公开(公告)号：US06600233B2

公开(公告)日：2003-07-29

申请号：US10142576

申请日：2002-05-08

申请人： Hwai-Peng Yeoh ,  Hamid Azimi ,  Amir Nur Rashid Wagiman ,  Mirng-Ji Lii

发明人： Hwai-Peng Yeoh ,  Hamid Azimi ,  Amir Nur Rashid Wagiman ,  Mirng-Ji Lii

IPC分类号： H01L2144

CPC分类号： H05K3/3463 ,  H01L21/4853 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/01087 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/00 ,  H01L2224/0401

摘要： An integrated circuit package fabricated by attaching a surface mount pin to a pin pad on a substrate using a Sn—Sb solder composition, where the quantity of Sb is in a range from 4 percent to 10 percent by weight. The Sn—Sb composition has a melting point above the melting point of commonly-used Sn—Pb solders. Thus, after the pins are surface mounted to the substrate, the pin integrity is not later compromised by assembly steps that reheat the substrate to a temperature sufficient to reflow the Sn—Pb solder. In one embodiment, the surface mount pins are attached to the bottom surface of an organic substrate using the Sn—Sb composition, and a flip-chip is attached to the top surface using Sn—Pb solder bumps. An integrated circuit package includes the substrate, the surface mount pins, and the Sn—Sb solder composition on the bonding surfaces of the pins.

公开(公告)号：US5936838A

公开(公告)日：1999-08-10

申请号：US972216

申请日：1997-11-18

申请人： Mirng-Ji Lii ,  Gregory Turturro ,  Chia-Pin Chiu

发明人： Mirng-Ji Lii ,  Gregory Turturro ,  Chia-Pin Chiu

IPC分类号： H05K7/20 ,  H05H7/20

CPC分类号： H05K7/20509 ,  G06F1/203 ,  H01L23/4093 ,  H01L23/42 ,  H01L2224/81801 ,  H01L24/81 ,  H01L2924/14

摘要： An electronic assembly which has a ring that creates a dam for a thermal grease. The assembly may include an integrated circuit which is mounted to a substrate. The assembly may also include a cover which has an opening that exposes the integrated circuit. The ring is coupled to the integrated circuit and the cover. A thermal element may be placed adjacent to the integrated circuit and the thermal grease. The dam controls the flow of the thermal grease. The opening allows the thermal element to be placed adjacent to the integrated circuit. In one embodiment the thermal element may be attached to the cover by a hinge. The hinge thermal element may compensate for tolerances in the assembly without creating excessive forces on the integrated circuit.

摘要翻译： 一个电子组件，它具有一个为导热油脂形成大坝的环。 组件可以包括安装到基板的集成电路。 组件还可以包括具有暴露集成电路的开口的盖。 环耦合到集成电路和盖。 热元件可以放置在集成电路和导热油脂附近。 大坝控制导热油脂的流动。 开口允许热元件邻近集成电路放置。 在一个实施例中，热元件可以通过铰链附接到盖。 铰链热元件可以补偿组件中的公差，而不会在集成电路上产生过大的力。

公开(公告)号：US09219030B2

公开(公告)日：2015-12-22

申请号：US13526073

申请日：2012-06-18

申请人： Chen-Hua Yu ,  Mirng-Ji Lii ,  Chung-Shi Liu ,  Meng-Tse Chen ,  Wei-Hung Lin ,  Ming-Da Cheng

发明人： Chen-Hua Yu ,  Mirng-Ji Lii ,  Chung-Shi Liu ,  Meng-Tse Chen ,  Wei-Hung Lin ,  Ming-Da Cheng

IPC分类号： H01L23/498 ,  H01L21/78 ,  H01L23/00 ,  H01L21/56 ,  H01L25/10 ,  H01L23/31 ,  H01L25/03 ,  H01L25/00

CPC分类号： H01L24/05 ,  B23K35/001 ,  B23K35/0222 ,  B23K35/22 ,  B23K35/262 ,  B23K35/3613 ,  H01L21/561 ,  H01L23/3135 ,  H01L23/3178 ,  H01L23/498 ,  H01L23/49816 ,  H01L24/08 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L24/94 ,  H01L24/97 ,  H01L25/03 ,  H01L25/0652 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05184 ,  H01L2224/05572 ,  H01L2224/05611 ,  H01L2224/06181 ,  H01L2224/08113 ,  H01L2224/1184 ,  H01L2224/13005 ,  H01L2224/13014 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/13026 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13184 ,  H01L2224/1355 ,  H01L2224/13561 ,  H01L2224/1357 ,  H01L2224/13582 ,  H01L2224/136 ,  H01L2224/13666 ,  H01L2224/1412 ,  H01L2224/14181 ,  H01L2224/16104 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/81815 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/381 ,  H01L2924/3841 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01083 ,  H01L2924/013 ,  H01L2924/206 ,  H01L2224/05552 ,  H01L2924/00012

摘要： The described embodiments of mechanisms of forming a package on package (PoP) structure involve bonding with connectors with non-solder metal balls to a packaging substrate. The non-solder metal balls may include a solder coating layer. The connectors with non-solder metal balls can maintain substantially the shape of the connectors and control the height of the bonding structures between upper and lower packages. The connectors with non-solder metal balls are also less likely to result in bridging between connectors or disconnection (or cold joint) of bonded connectors. As a result, the pitch of the connectors with non-solder metal balls can be kept small.

摘要翻译： 形成封装封装（PoP）结构的机构的所述实施例包括将具有非焊料金属球的连接器与包装衬底结合。 非焊接金属球可以包括焊料涂层。 具有非焊接金属球的连接器可以基本保持连接器的形状并控制上部和下部封装之间的结合结构的高度。 具有非焊接金属球的连接器也不太可能导致连接器之间的桥接或接合连接器的断开（或冷接头）。 结果，可以将具有非焊接金属球的连接器的间距保持较小。

公开(公告)号：US09123763B2

公开(公告)日：2015-09-01

申请号：US13271952

申请日：2011-10-12

申请人： Chen-Hua Yu ,  Chung-Shi Liu ,  Mirng-Ji Lii ,  Ming-Da Cheng ,  Chih-Wei Lin

发明人： Chen-Hua Yu ,  Chung-Shi Liu ,  Mirng-Ji Lii ,  Ming-Da Cheng ,  Chih-Wei Lin

IPC分类号： H01L23/48 ,  H01L21/683 ,  H01L23/538 ,  H01L21/56 ,  H01L25/10 ,  H01L21/36 ,  H01L23/31 ,  H01L21/48 ,  H01L23/00 ,  H05K1/18 ,  H01L23/498

CPC分类号： H01L25/50 ,  H01L21/31051 ,  H01L21/4846 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/76802 ,  H01L21/76819 ,  H01L21/76877 ,  H01L21/76898 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5383 ,  H01L24/16 ,  H01L24/19 ,  H01L24/32 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/105 ,  H01L2221/68345 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73267 ,  H01L2224/81005 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/83104 ,  H01L2225/06513 ,  H01L2225/06548 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H05K1/185 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2224/48

摘要： A package-on-package (PoP) structure comprises a first package and a second package. The first package comprises a first die, a second die, and a core material. The core material has a first surface and a second surface. A first redistribution layer (RDL) is on the first surface, and a second RDL is on the second surface. The first die is disposed in the core material between the first surface and the second surface. The second die is coupled to one of the first RDL and the second RDL. The second package comprises a third die and an interposer. The interposer has a first side and a second side. The third die is coupled to the second side of the interposer. The first package is coupled to the second package by first electrical connectors coupled to the second side of the interposer and the first RDL.

摘要翻译： 封装封装（PoP）结构包括第一封装和第二封装。 第一包装包括第一模具，第二模具和芯材料。 芯材料具有第一表面和第二表面。 第一再分配层（RDL）位于第一表面上，第二RDL位于第二表面上。 第一模具设置在第一表面和第二表面之间的芯材料中。 第二管芯耦合到第一RDL和第二RDL之一。 第二包装包括第三管芯和插入件。 插入器具有第一侧和第二侧。 第三裸片耦合到插入器的第二侧。 第一封装通过耦合到插入件的第二侧和第一RDL的第一电连接器耦合到第二封装。

公开(公告)号：US08716858B2

公开(公告)日：2014-05-06

申请号：US13167946

申请日：2011-06-24

申请人： Chen-Fa Lu ,  Chung-Shi Liu ,  Mirng-Ji Lii ,  Chen-Hua Yu

发明人： Chen-Fa Lu ,  Chung-Shi Liu ,  Mirng-Ji Lii ,  Chen-Hua Yu

IPC分类号： H01L23/48

CPC分类号： H01L24/03 ,  H01L23/3114 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0346 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05571 ,  H01L2224/05583 ,  H01L2224/05609 ,  H01L2224/05611 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/11334 ,  H01L2224/11849 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16147 ,  H01L2224/16237 ,  H01L2224/81191 ,  H01L2224/81411 ,  H01L2224/81413 ,  H01L2224/81416 ,  H01L2224/81439 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/81815 ,  H01L2224/8191 ,  H01L2924/00014 ,  H01L2924/01327 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15788 ,  H01L2924/01029 ,  H01L2924/00012 ,  H01L2924/01082 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/05552

摘要： A semiconductor device includes a barrier layer between a solder bump and a post-passivation interconnect (PPI) layer. The barrier layer is formed of at least one of an electroless nickel (Ni) layer, an electroless palladium (Pd) layer or an immersion gold (Au) layer.

摘要翻译： 半导体器件包括在焊料凸块和钝化后互连（PPI）层之间的阻挡层。 阻挡层由无电镀镍（Ni）层，无电解钯（Pd）层或浸金（Au）层中的至少一种形成。

公开(公告)号：US08642393B1

公开(公告)日：2014-02-04

申请号：US13570065

申请日：2012-08-08

申请人： Chen-Hua Yu ,  Mirng-Ji Lii ,  Chien-Hsun Lee ,  Yung Ching Chen ,  Jiun Yi Wu

发明人： Chen-Hua Yu ,  Mirng-Ji Lii ,  Chien-Hsun Lee ,  Yung Ching Chen ,  Jiun Yi Wu

IPC分类号： H01L21/00 ,  H01L23/48

CPC分类号： H01L24/05 ,  H01L21/4853 ,  H01L23/49811 ,  H01L24/16 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/16238 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45164 ,  H01L2224/45169 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85375 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2924/0665 ,  H01L2924/00012 ,  H01L2924/2075 ,  H01L2924/20751

摘要： An embodiment is a package-on-package (PoP) device comprising a first package on a first substrate and a second package over the first package. A plurality of wire sticks disposed between the first package and the second package and the plurality of wire sticks couple the first package to the second package. Each of the plurality of wire sticks comprise a conductive wire of a first height affixed to a bond pad on the first substrate and each of the plurality of wire sticks is embedded in a solder joint.

摘要翻译： 一个实施例是一种封装封装（PoP）器件，其包括在第一衬底上的第一封装和在第一封装上的第二封装。 设置在第一封装和第二封装之间的多个线棒，并且多个线棒将第一封装耦合到第二封装。 多个线棒中的每一个包括固定到第一基板上的接合焊盘的第一高度的导线，并且多个线棒中的每一个嵌入焊接接头中。

公开(公告)号：US20130270705A1

公开(公告)日：2013-10-17

申请号：US13444649

申请日：2012-04-11

申请人： Tsung-Ding Wang ,  Hung-Jen Lin ,  Jiun Yi Wu ,  Mirng-Ji Lii ,  Chien-Hsun Lee

发明人： Tsung-Ding Wang ,  Hung-Jen Lin ,  Jiun Yi Wu ,  Mirng-Ji Lii ,  Chien-Hsun Lee

IPC分类号： H01L23/48 ,  H01L21/56

CPC分类号： H01L23/4824 ,  H01L21/563 ,  H01L23/488 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/528 ,  H01L24/05 ,  H01L24/09 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05558 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/16056 ,  H01L2224/16146 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81385 ,  H01L2224/81424 ,  H01L2224/81447 ,  H01L2224/81815 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00

摘要： Semiconductor devices packages and methods are disclosed. In one embodiment, a package for a semiconductor device includes a substrate and a contact pad disposed on a first surface of the substrate. The contact pad has a first side and a second side opposite the first side. A conductive trace is coupled to the first side of the contact pad, and an extension of the conductive trace is coupled to the second side of the contact pad. A plurality of bond pads is disposed on a second surface of the substrate.

摘要翻译： 公开了半导体器件封装和方法。 在一个实施例中，用于半导体器件的封装包括衬底和设置在衬底的第一表面上的接触焊盘。 接触垫具有与第一侧相对的第一侧和第二侧。 导电迹线耦合到接触焊盘的第一侧，并且导电迹线的延伸部耦合到接触焊盘的第二侧。 多个接合焊盘设置在衬底的第二表面上。

公开(公告)号：US08501613B2

公开(公告)日：2013-08-06

申请号：US13178276

申请日：2011-07-07

申请人： Yi-Yang Lei ,  Hung-Jui Kuo ,  Chung-Shi Liu ,  Mirng-Ji Lii ,  Chen-Hua Yu

发明人： Yi-Yang Lei ,  Hung-Jui Kuo ,  Chung-Shi Liu ,  Mirng-Ji Lii ,  Chen-Hua Yu

IPC分类号： H01L21/44

CPC分类号： H01L24/11 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0345 ,  H01L2224/036 ,  H01L2224/03632 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/05186 ,  H01L2224/05564 ,  H01L2224/05572 ,  H01L2224/05647 ,  H01L2224/11424 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/1147 ,  H01L2224/13007 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/014 ,  H01L2924/01047 ,  H01L2924/00012 ,  H01L2224/05552 ,  H01L2924/00

摘要： A method includes forming an under-bump metallurgy (UBM) layer overlying a substrate, and forming a mask overlying the UBM layer. The mask covers a first portion of the UBM layer, and a second portion of the UBM layer is exposed through an opening in the mask. A metal bump is formed in the opening and on the second portion of the UBM layer. The mask is then removed. A laser removal is performed to remove a part of the first portion of the UBM layer and to form an UBM.

摘要翻译： 一种方法包括形成覆盖衬底的凸起下金属（UBM）层，以及形成覆盖UBM层的掩模。 掩模覆盖UBM层的第一部分，并且UBM层的第二部分通过掩模中的开口暴露。 在UBM层的开口和第二部分上形成金属凸块。 然后取下面具。 执行激光去除以去除UBM层的第一部分的一部分并形成UBM。

公开(公告)号：US20130167373A1

公开(公告)日：2013-07-04

申请号：US13527459

申请日：2012-06-19

申请人： Chien Ling Hwang ,  Yeong-Jyh Lin ,  Yi-Li Hsiao ,  Ming-Da Cheng ,  Tsai-Tsung Tsai ,  Chung-Shi Liu ,  Mirng-Ji Lii ,  Chen-Hua Yu

发明人： Chien Ling Hwang ,  Yeong-Jyh Lin ,  Yi-Li Hsiao ,  Ming-Da Cheng ,  Tsai-Tsung Tsai ,  Chung-Shi Liu ,  Mirng-Ji Lii ,  Chen-Hua Yu

IPC分类号： B26D7/27 ,  H01R43/00

CPC分类号： H01L24/11 ,  H01L21/4853 ,  H01L24/13 ,  H01L24/78 ,  H01L2224/056 ,  H01L2224/1111 ,  H01L2224/1134 ,  H01L2224/13005 ,  H01L2224/13111 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13164 ,  H01L2224/13169 ,  H01L2224/451 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48 ,  H01L2224/7855 ,  H01L2224/78621 ,  H01L2224/85051 ,  H01L2224/854 ,  H01L2924/00011 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/206 ,  Y10T29/49192 ,  Y10T29/49213 ,  Y10T29/514 ,  Y10T29/5177 ,  Y10T29/53217 ,  Y10T29/53235 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/01049 ,  H01L2224/4554

摘要： An apparatus includes a spool configured to supply a wire, a cutting device configured to form a notch in the wire, and a capillary configured to bond the wire and to form a stud bump. The apparatus is further configured to pull the wire to break at the notch, with a tail region attached to the stud bump.

公开(公告)号：US20130134588A1

公开(公告)日：2013-05-30

申请号：US13397747

申请日：2012-02-16

申请人： Chen-Hua Yu ,  Mirng-Ji Lii ,  Chung-Shi Liu ,  Ming-Da Cheng

发明人： Chen-Hua Yu ,  Mirng-Ji Lii ,  Chung-Shi Liu ,  Ming-Da Cheng

IPC分类号： H01L23/498

CPC分类号： H01L25/0657 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49894 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/94 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/038 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05023 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05552 ,  H01L2224/05564 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05693 ,  H01L2224/11019 ,  H01L2224/1134 ,  H01L2224/11823 ,  H01L2224/11825 ,  H01L2224/1184 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13019 ,  H01L2224/13023 ,  H01L2224/13082 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13562 ,  H01L2224/1357 ,  H01L2224/1358 ,  H01L2224/13611 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2224/13664 ,  H01L2224/16057 ,  H01L2224/16058 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16503 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45664 ,  H01L2224/48 ,  H01L2224/48611 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48655 ,  H01L2224/48664 ,  H01L2224/48693 ,  H01L2224/48711 ,  H01L2224/48724 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/48755 ,  H01L2224/48764 ,  H01L2224/48793 ,  H01L2224/48811 ,  H01L2224/48824 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48855 ,  H01L2224/48864 ,  H01L2224/48893 ,  H01L2224/73204 ,  H01L2224/81009 ,  H01L2224/81026 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2224/83104 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/157 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2924/01029 ,  H01L2924/01006

摘要： Package-On-Package (PoP) structures and methods of forming PoP structures are disclosed. According to an embodiment, a structure comprises a first substrate, stud bulbs, a die, a second substrate, and electrical connectors. The stud bulbs are coupled to a first surface of the first substrate. The die is attached to the first surface of the first substrate. The electrical connectors are coupled to the second substrate, and respective ones of the electrical connectors are coupled to respective ones of the stud bulbs.

摘要翻译： 封装封装（PoP）结构和形成PoP结构的方法被公开。 根据实施例，一种结构包括第一基板，螺柱灯泡，模具，第二基板和电连接器。 螺柱灯泡耦合到第一基板的第一表面。 模具附接到第一基板的第一表面。 电连接器耦合到第二基板，并且相应的电连接器耦合到相应的螺柱灯泡。