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公开(公告)号:CN104979334A
公开(公告)日:2015-10-14
申请号:CN201410256010.1
申请日:2014-06-10
申请人: 台湾积体电路制造股份有限公司
IPC分类号: H01L25/065 , H01L23/31 , H01L21/98
CPC分类号: H01L21/561 , H01L21/4817 , H01L21/4853 , H01L21/486 , H01L21/56 , H01L21/565 , H01L21/6835 , H01L23/16 , H01L23/29 , H01L23/3128 , H01L23/3185 , H01L23/3192 , H01L23/49811 , H01L23/49816 , H01L23/49827 , H01L23/49833 , H01L23/49894 , H01L23/5384 , H01L23/5385 , H01L23/60 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/92 , H01L24/94 , H01L24/97 , H01L25/0652 , H01L25/0655 , H01L25/50 , H01L2221/68327 , H01L2221/68331 , H01L2221/68381 , H01L2224/11002 , H01L2224/1132 , H01L2224/1144 , H01L2224/1145 , H01L2224/11462 , H01L2224/11849 , H01L2224/13111 , H01L2224/13139 , H01L2224/13147 , H01L2224/14181 , H01L2224/16145 , H01L2224/16225 , H01L2224/17181 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2224/81815 , H01L2224/92125 , H01L2224/94 , H01L2224/97 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2924/15311 , H01L2924/157 , H01L2924/15787 , H01L2924/15788 , H01L2924/1579 , H01L2924/18161 , H01L2924/3512 , H01L2924/37001 , H01L2224/81 , H01L2224/83 , H01L2924/00 , H01L2224/1403
摘要: 本发明提供了半导体器件及其制造方法。根据实施例,第一半导体管芯和第二半导体管芯接合至第一衬底。在第一半导体管芯和第二半导体管芯的上方并且在它们之间形成保护盖。将密封剂布置在保护盖的上方,并且去除密封剂的部分以露出保护盖,或者可选地露出第一半导体器件和第二半导体器件。然后,第一衬底可接合至第二衬底。
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公开(公告)号:CN103871909A
公开(公告)日:2014-06-18
申请号:CN201310692838.7
申请日:2013-12-17
申请人: IMEC公司
IPC分类号: H01L21/50
CPC分类号: H01L24/06 , G03F7/0002 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/742 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/98 , H01L2224/02126 , H01L2224/0401 , H01L2224/05026 , H01L2224/05562 , H01L2224/05572 , H01L2224/10126 , H01L2224/111 , H01L2224/1144 , H01L2224/11462 , H01L2224/1147 , H01L2224/11602 , H01L2224/1181 , H01L2224/1182 , H01L2224/131 , H01L2224/13147 , H01L2224/13541 , H01L2224/13562 , H01L2224/13693 , H01L2224/14051 , H01L2224/14505 , H01L2224/1703 , H01L2224/17505 , H01L2224/29036 , H01L2224/2919 , H01L2224/73104 , H01L2224/73204 , H01L2224/742 , H01L2224/81193 , H01L2224/81815 , H01L2224/81902 , H01L2224/81903 , H01L2224/83191 , H01L2224/83862 , H01L2924/00014 , H01L2924/12042 , H01L2924/15747 , Y10T29/49 , Y10T29/49014 , Y10T29/49117 , Y10T156/1028 , Y10T156/11 , H01L2924/00012 , H01L2924/0665 , H01L2924/014 , H01L2224/05552 , H01L2924/00
摘要: 本发明涉及转移石墨烯片到用于封装的衬底金属接触凸块的方法。根据本发明的一种方法,用于将石墨烯片转移到半导体器件封装中使用的衬底的金属接触凸块,所述封装即由所述接触凸块连接的衬底叠层。特别地,该方法相关于铜接触凸块,石墨烯为其形成保护层。根据本发明的方法,使用压印器装置,该压印器装置包括压印器衬底,所述衬底设置有空腔,其中各个空腔设置有凸缘部。压印器衬底对准所述包括凸块的衬底,并降低到所述衬底上,使每个凸块都由空腔封闭,直至空腔的凸缘部切穿石墨烯片,当压印器被移除后,石墨烯层部分留在每个凸块的顶部。石墨烯片优选地通过将其压印到围绕所述凸块的钝化层中,以附着在衬底上。
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公开(公告)号:CN105810603A
公开(公告)日:2016-07-27
申请号:CN201610031246.4
申请日:2016-01-18
申请人: 国际商业机器公司
IPC分类号: H01L21/603
CPC分类号: H01L25/0657 , H01L21/565 , H01L23/3107 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/81 , H01L25/50 , H01L2224/0381 , H01L2224/0401 , H01L2224/05147 , H01L2224/05647 , H01L2224/05655 , H01L2224/0612 , H01L2224/065 , H01L2224/11003 , H01L2224/11334 , H01L2224/1141 , H01L2224/1144 , H01L2224/11849 , H01L2224/13109 , H01L2224/13111 , H01L2224/14104 , H01L2224/16012 , H01L2224/16145 , H01L2224/16146 , H01L2224/16227 , H01L2224/16503 , H01L2224/17181 , H01L2224/73204 , H01L2224/81022 , H01L2224/81065 , H01L2224/8109 , H01L2224/811 , H01L2224/8112 , H01L2224/81201 , H01L2224/8121 , H01L2224/81447 , H01L2224/81455 , H01L2224/8181 , H01L2224/81815 , H01L2224/81986 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2924/15311 , H01L2924/3511 , H01L2924/381 , H01L2924/3841 , H01L2924/00012 , H01L2924/00014 , H01L2224/81203 , H01L2924/01047 , H01L2924/01029 , H01L24/19
摘要: 一种形成用于包括多个硅层的芯片堆叠的体积减少的互连的方法,该方法包括:形成多个导电结构,导电结构的至少一个子集中的每个导电结构具有针对导电结构被转移到其上的对应凸块下冶金焊盘的导电材料的体积,该体积被配置为使得导电结构的未回流直径与对应焊盘的直径的比率为约三分之一比一或更小;将导电结构转移到硅层;在基本上竖直的维度上堆叠硅层,使得给定硅层上的导电结构中的每个导电结构与邻近硅层的下侧上的对应电接触位置对准;以及加热互连,以便以冶金方式键合邻近硅层的多个电接触位置。
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公开(公告)号:CN103871991A
公开(公告)日:2014-06-18
申请号:CN201310088383.8
申请日:2013-03-19
申请人: 台湾积体电路制造股份有限公司
IPC分类号: H01L23/488 , H01L21/60
CPC分类号: H01L23/49838 , H01L21/4853 , H01L21/52 , H01L21/563 , H01L21/565 , H01L23/3128 , H01L23/3157 , H01L23/481 , H01L23/49811 , H01L23/49816 , H01L23/5386 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/81 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/0401 , H01L2224/04042 , H01L2224/05572 , H01L2224/1132 , H01L2224/11334 , H01L2224/1144 , H01L2224/1145 , H01L2224/11462 , H01L2224/11849 , H01L2224/13111 , H01L2224/13139 , H01L2224/13147 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/1712 , H01L2224/26175 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06555 , H01L2225/06575 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01322 , H01L2924/1431 , H01L2924/1436 , H01L2924/1437 , H01L2924/1443 , H01L2924/15311 , H01L2924/15331 , H01L2924/157 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H05K1/0284 , H05K1/0313 , H05K1/111 , H05K1/181 , H05K3/40 , H05K2201/09409 , H01L2924/00012 , H01L2924/00 , H01L2224/05552 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: 本文公开了一种用于在封装管芯中使用的具有阻拦件的中介层的方法和装置。一种中介层可以包括位于衬底上方的金属层。多个阻拦件可以围绕金属层的每个角部形成在金属层上方。可以在中介衬底的两个面上都形成阻拦件。阻拦件围绕一区域,在该区域中可以设置用于与其他封装件连接的连接件,诸如焊料球。非导电阻拦件可以形成在阻拦件上方。底部填充物可以形成在连接至连接件的封装件下方、金属层上方且包含在角部阻拦件所围绕的区域内,从而使得连接件被底部填充物保护得很好。也可以在印刷电路板上进一步形成这样的阻拦件。
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公开(公告)号:CN103718280A
公开(公告)日:2014-04-09
申请号:CN201280038204.3
申请日:2012-08-08
申请人: 松下电器产业株式会社
IPC分类号: H01L21/60
CPC分类号: H01L24/10 , B23K35/001 , B23K35/0222 , B23K35/24 , B23K35/262 , B23K2101/40 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/0401 , H01L2224/05541 , H01L2224/05557 , H01L2224/11 , H01L2224/1144 , H01L2224/11464 , H01L2224/1182 , H01L2224/13 , H01L2224/13082 , H01L2224/13144 , H01L2224/13155 , H01L2224/13553 , H01L2224/13562 , H01L2224/13582 , H01L2224/13611 , H01L2224/13655 , H01L2224/16225 , H01L2224/16227 , H01L2224/16501 , H01L2224/81075 , H01L2224/81191 , H01L2224/81193 , H01L2224/81203 , H01L2224/8121 , H01L2224/81805 , H01L2224/81825 , H01L2924/181 , H01L2924/3511 , H01L2924/381 , H01L2924/206 , H01L2924/00014 , H01L2924/01015 , H01L2924/00012 , H01L2924/0105 , H01L2924/01029 , H01L2924/00
摘要: 本发明的提供一种安装结构,能够在将具有脆弱膜的半导体芯片等电子元器件安装到电路基板等基板上的安装结构中,提高连接可靠性。将电子元器件(1)的电极端子(4)与基板(2)的电极端子(5)相连接的接合部包含合金(8)以及弹性模量比该合金(8)要低的金属(9),并且具有合金(8)被弹性模量较低的金属(9)包围的剖面结构。
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公开(公告)号:CN104217997B
公开(公告)日:2017-05-03
申请号:CN201310710945.8
申请日:2013-12-20
申请人: 台湾积体电路制造股份有限公司
IPC分类号: H01L21/78 , H01L21/683 , H01L23/31
CPC分类号: H01L23/18 , H01L21/4803 , H01L21/56 , H01L21/561 , H01L21/6835 , H01L21/6836 , H01L23/055 , H01L23/12 , H01L23/28 , H01L23/31 , H01L23/3128 , H01L23/3135 , H01L23/3675 , H01L23/3677 , H01L23/481 , H01L23/49827 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/32 , H01L24/80 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/94 , H01L24/97 , H01L25/0657 , H01L2221/68327 , H01L2221/68331 , H01L2221/68368 , H01L2224/0345 , H01L2224/03452 , H01L2224/03462 , H01L2224/0401 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05684 , H01L2224/06181 , H01L2224/1132 , H01L2224/11334 , H01L2224/11424 , H01L2224/1144 , H01L2224/1145 , H01L2224/11452 , H01L2224/1146 , H01L2224/11462 , H01L2224/11464 , H01L2224/11849 , H01L2224/13082 , H01L2224/13083 , H01L2224/13084 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/17181 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2224/81005 , H01L2224/81191 , H01L2224/814 , H01L2224/81411 , H01L2224/81439 , H01L2224/81815 , H01L2224/81895 , H01L2224/83104 , H01L2224/8385 , H01L2224/92 , H01L2224/9202 , H01L2224/94 , H01L2224/97 , H01L2225/06513 , H01L2225/06517 , H01L2225/06568 , H01L2225/06589 , H01L2924/15311 , H01L2924/181 , H01L2224/81 , H01L2924/00014 , H01L2924/01029 , H01L2924/01074 , H01L2924/014 , H01L2924/01082 , H01L21/304 , H01L2224/11 , H01L2221/683 , H01L21/78 , H01L2924/00
摘要: 本发明的实施例包括半导体器件和形成半导体器件的方法。一个实施例是形成半导体器件的方法,该方法包括:将管芯接合至第一衬底的顶面,管芯电连接至第一衬底;以及在第一衬底的顶面上形成支撑结构,支撑结构与管芯物理间隔开,支撑结构的顶面与管芯的顶面共面。该方法进一步包括对第一衬底实施锯切工艺,该锯切工艺锯切穿过支撑结构。本发明还公开了3D的封装件及其形成方法。
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公开(公告)号:CN103579183A
公开(公告)日:2014-02-12
申请号:CN201210592167.2
申请日:2012-12-28
申请人: 台湾积体电路制造股份有限公司
IPC分类号: H01L23/532 , H01L23/488 , H01L25/00 , H01L21/768 , H01L21/60
CPC分类号: H01L23/5381 , H01L21/486 , H01L21/563 , H01L23/147 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/585 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/29 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/97 , H01L25/0652 , H01L25/0655 , H01L2224/0345 , H01L2224/0348 , H01L2224/0361 , H01L2224/03616 , H01L2224/0362 , H01L2224/0401 , H01L2224/05624 , H01L2224/05647 , H01L2224/1132 , H01L2224/11334 , H01L2224/1145 , H01L2224/11462 , H01L2224/11849 , H01L2224/131 , H01L2224/13111 , H01L2224/13139 , H01L2224/13147 , H01L2224/14515 , H01L2224/16237 , H01L2224/2919 , H01L2224/29191 , H01L2224/32225 , H01L2224/73204 , H01L2224/81424 , H01L2224/81447 , H01L2224/81815 , H01L2224/81895 , H01L2224/83104 , H01L2224/83855 , H01L2224/92125 , H01L2224/97 , H01L2924/12042 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H01L2924/351 , H01L2924/3512 , H01L2224/81 , H01L2224/83 , H01L2924/00014 , H01L2924/014 , H01L2924/0665 , H01L2224/1144 , H01L2924/00
摘要: 本发明提供了一种用于设置中介层的系统和方法。实施例包括在中介层晶圆上形成第一区域和第二区域,其中,该中介层在第一区域和第二区域之间具有划线区域。然而,第一区域和第二区域通过位于划线区域上方的电路相互连接。在另一个实施例中,第一区域和第二区域可以相互分离,然后在第一区域连接至第二区域之前,将第一区域和第二区域密封在一起。
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公开(公告)号:CN103377305A
公开(公告)日:2013-10-30
申请号:CN201310002312.1
申请日:2013-01-05
申请人: 台湾积体电路制造股份有限公司
IPC分类号: G06F17/50 , H01L23/522
CPC分类号: G06F17/5068 , H01L23/3192 , H01L23/49838 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/81 , H01L2224/0345 , H01L2224/03452 , H01L2224/03462 , H01L2224/0401 , H01L2224/05558 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/05671 , H01L2224/1132 , H01L2224/11334 , H01L2224/1145 , H01L2224/11452 , H01L2224/11462 , H01L2224/11849 , H01L2224/13012 , H01L2224/13013 , H01L2224/13014 , H01L2224/13015 , H01L2224/13022 , H01L2224/131 , H01L2224/13111 , H01L2224/13139 , H01L2224/13147 , H01L2224/16105 , H01L2224/16225 , H01L2224/16227 , H01L2224/16238 , H01L2224/17104 , H01L2224/81191 , H01L2224/81385 , H01L2224/81444 , H01L2224/81815 , H01L2924/00014 , H01L2924/014 , H01L2924/00012 , H01L2924/01029 , H01L2924/01074 , H01L2224/1144
摘要: 一种用于阻止迹线上凸块结构中的邻近的金属迹线桥接的方法和器件。实施例包括确定封装元件的热膨胀系数(CTE)和处理参数。然后分析设计参数并可以基于封装元件的CTE和处理参数修改设计参数。本发明提供了迹线上凸块结构的迹线布局方法。
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公开(公告)号:CN103579183B
公开(公告)日:2018-02-16
申请号:CN201210592167.2
申请日:2012-12-28
申请人: 台湾积体电路制造股份有限公司
IPC分类号: H01L23/532 , H01L23/488 , H01L25/00 , H01L21/768 , H01L21/60
CPC分类号: H01L23/5381 , H01L21/486 , H01L21/563 , H01L23/147 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/585 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/29 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/97 , H01L25/0652 , H01L25/0655 , H01L2224/0345 , H01L2224/0348 , H01L2224/0361 , H01L2224/03616 , H01L2224/0362 , H01L2224/0401 , H01L2224/05624 , H01L2224/05647 , H01L2224/1132 , H01L2224/11334 , H01L2224/1145 , H01L2224/11462 , H01L2224/11849 , H01L2224/131 , H01L2224/13111 , H01L2224/13139 , H01L2224/13147 , H01L2224/14515 , H01L2224/16237 , H01L2224/2919 , H01L2224/29191 , H01L2224/32225 , H01L2224/73204 , H01L2224/81424 , H01L2224/81447 , H01L2224/81815 , H01L2224/81895 , H01L2224/83104 , H01L2224/83855 , H01L2224/92125 , H01L2224/97 , H01L2924/12042 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H01L2924/351 , H01L2924/3512 , H01L2224/81 , H01L2224/83 , H01L2924/00014 , H01L2924/014 , H01L2924/0665 , H01L2224/1144 , H01L2924/00
摘要: 本发明提供了一种用于设置中介层的系统和方法。实施例包括在中介层晶圆上形成第一区域和第二区域,其中,该中介层在第一区域和第二区域之间具有划线区域。然而,第一区域和第二区域通过位于划线区域上方的电路相互连接。在另一个实施例中,第一区域和第二区域可以相互分离,然后在第一区域连接至第二区域之前,将第一区域和第二区域密封在一起。
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公开(公告)号:CN103871991B
公开(公告)日:2016-12-28
申请号:CN201310088383.8
申请日:2013-03-19
申请人: 台湾积体电路制造股份有限公司
IPC分类号: H01L23/488 , H01L21/60
CPC分类号: H01L23/49838 , H01L21/4853 , H01L21/52 , H01L21/563 , H01L21/565 , H01L23/3128 , H01L23/3157 , H01L23/481 , H01L23/49811 , H01L23/49816 , H01L23/5386 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/81 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/0401 , H01L2224/04042 , H01L2224/05572 , H01L2224/1132 , H01L2224/11334 , H01L2224/1144 , H01L2224/1145 , H01L2224/11462 , H01L2224/11849 , H01L2224/13111 , H01L2224/13139 , H01L2224/13147 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/1712 , H01L2224/26175 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06555 , H01L2225/06575 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01322 , H01L2924/1431 , H01L2924/1436 , H01L2924/1437 , H01L2924/1443 , H01L2924/15311 , H01L2924/15331 , H01L2924/157 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H05K1/0284 , H05K1/0313 , H05K1/111 , H05K1/181 , H05K3/40 , H05K2201/09409 , H01L2924/00012 , H01L2924/00 , H01L2224/05552 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: 本文公开了一种用于在封装管芯中使用的具有阻拦件的中介层的方法和装置。一种中介层可以包括位于衬底上方的金属层。多个阻拦件可以围绕金属层的每个角部形成在金属层上方。可以在中介衬底的两个面上都形成阻拦件。阻拦件围绕一区域,在该区域中可以设置用于与其他封装件连接的连接件,诸如焊料球。非导电阻拦件可以形成在阻拦件上方。底部填充物可以形成在连接至连接件的封装件下方、金属层上方且包含在角部阻拦件所围绕的区域内,从而使得连接件被底部填充物保护得很好。也可以在印刷电路板上进一步形成这样的阻拦件。
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