公开(公告)号：US07458816B1

公开(公告)日：2008-12-02

申请号：US09547561

申请日：2000-04-12

Applicant: Gaetan L. Mathieu ,  Benjamin N. Eldridge ,  Stuart W. Wenzel

Inventor： Gaetan L. Mathieu ,  Benjamin N. Eldridge ,  Stuart W. Wenzel

IPC: H01R12/00

CPC classification number: G01R1/07342 ,  G01R1/07357 ,  H05K3/4092

Abstract: An interconnection element that includes a first element material adapted to be coupled to a substrate and a second element material comprising a material having a transformable property such that upon transformation, a shape of the interconnection is modified. An example is a material that has a transformable property such that a volume of the first and/or second element material may undergo a thermal transformation from one volume to a different volume (such as a smaller volume).

Abstract translation: 一种互连元件，其包括适于联接到基板的第一元件材料和第二元件材料，所述第二元件材料包括具有可变形特性的材料，使得在变形时，互连的形状被修改。 一个实例是具有可变形特性的材料，使得第一和/或第二元素材料的体积可以经历从一个体积到不同体积（例如较小体积）的热转化。

公开(公告)号：US20080157799A1

公开(公告)日：2008-07-03

申请号：US11617373

申请日：2006-12-28

Applicant: John K. Gritters ,  Benjamin N. Eldridge ,  Keith J. Breinlinger

Inventor： John K. Gritters ,  Benjamin N. Eldridge ,  Keith J. Breinlinger

IPC: G01R1/067 ,  G01R31/26

CPC classification number: H01R31/02 ,  G01R1/06733 ,  G01R1/07342 ,  G01R3/00

Abstract: Embodiments of resilient contact elements and methods for fabricating same are provided herein. In one embodiment, a resilient contact element for use in a probe card includes a lithographically formed resilient beam having a first end and an opposing second end; and a tip disposed proximate the first end of the beam and configured to break through an oxide layer of a surface of a device to be tested to establish a reliable electrical connection therewith; wherein at least a central portion of the beam has a continuous sloped profile defining, in a relaxed state, a height measured between the beam and a plane representing an upper surface of a device to be tested that is greater near the second end of the beam than near the first end of the beam.

Abstract translation: 弹性接触元件的实施例及其制造方法在本文中提供。 在一个实施例中，用于探针卡的弹性接触元件包括光刻形成的弹性梁，其具有第一端和相对的第二端; 以及设置在所述梁的第一端附近并且被构造成突破待测试装置的表面的氧化物层以与其建立可靠的电连接的尖端; 其中所述梁的至少中心部分具有连续的倾斜轮廓，所述连续倾斜轮廓在松弛状态下限定在所述梁与表示待测试装置的上表面的平面之间测量的高度，其在所述梁的第二端附近较大 比梁的第一端附近。

公开(公告)号：US20080115353A1

公开(公告)日：2008-05-22

申请号：US11929510

申请日：2007-10-30

Applicant: Gaetan L. Mathieu ,  Benjamin N. Eldridge ,  Gary W. Grube

Inventor： Gaetan L. Mathieu ,  Benjamin N. Eldridge ,  Gary W. Grube

IPC: H05K3/10

CPC classification number: G01R3/00 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/06727 ,  G01R1/06744 ,  G01R1/06761 ,  H01L21/6835 ,  H01L23/49811 ,  H01L24/16 ,  H01L25/0657 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/1147 ,  H01L2224/11902 ,  H01L2224/13012 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/1308 ,  H01L2224/13099 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01055 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/19041 ,  H05K3/326 ,  H05K3/4092 ,  Y10S438/977 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49222 ,  Y10T29/49224 ,  H01L2924/00

Abstract: A method of forming an interconnection, including a spring contact element, by lithographic techniques. In one embodiment, the method includes applying a masking material over a first portion of a substrate, the masking material having an opening which will define a first portion of a spring structure, depositing a structure material (e.g., conductive material) in the opening, and overfilling the opening with the structure material, removing a portion of the structure material, and removing a first portion of the masking material. In this embodiment, at least a portion of the first portion of the spring structure is freed of masking material. In one aspect of the invention, the method includes planarizing the masking material layer and structure material to remove a portion of the structure material. In another aspect, the spring structure formed includes one of a post portion, a beam portion, and a tip structure portion.

Abstract translation: 通过光刻技术形成包括弹簧接触元件的互连的方法。 在一个实施例中，该方法包括在衬底的第一部分上施加掩模材料，掩模材料具有将限定弹簧结构的第一部分的开口，在开口中沉积结构材料（例如导电材料） 并用结构材料过度填充开口，去除结构材料的一部分，以及去除掩模材料的第一部分。 在该实施例中，弹簧结构的第一部分的至少一部分没有掩蔽材料。 在本发明的一个方面，该方法包括平坦化掩模材料层和结构材料以去除结构材料的一部分。 另一方面，形成的弹簧结构包括柱部分，梁部分和尖端结构部分中的一个。

公开(公告)号：US07347702B2

公开(公告)日：2008-03-25

申请号：US11561297

申请日：2006-11-17

Applicant: Benjamin N. Eldridge ,  Thomas H. Dozier, II ,  Igor Y. Khandros ,  Gaetan L. Mathieu ,  William D. Smith

Inventor： Benjamin N. Eldridge ,  Thomas H. Dozier, II ,  Igor Y. Khandros ,  Gaetan L. Mathieu ,  William D. Smith

IPC: H01R12/00

CPC classification number: H05K3/4015 ,  B23K1/0016 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/07342 ,  G01R1/07378 ,  G01R3/00 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49004 ,  Y10T29/49126 ,  Y10T29/49208 ,  Y10T29/49222 ,  H01L2924/00 ,  H01L2224/48

Abstract: An interconnection apparatus and a method of forming an interconnection apparatus. Contact structures are attached to or formed on a first substrate. The first substrate is attached to a second substrate, which is larger than the first substrate. Multiple such first substrates may be attached to the second substrate in order to create an array of contact structures. Each contact structure may be elongate and resilient and may comprise a core that is over coated with a material that imparts desired structural properties to the contact structure.

Abstract translation: 一种互连装置和形成互连装置的方法。 接触结构附着在第一基底上或形成在第一基底上。 第一衬底附接到比第一衬底大的第二衬底。 可以将多个这样的第一基板附接到第二基板，以便产生接触结构的阵列。 每个接触结构可以是细长的和弹性的，并且可以包括在涂覆有向接触结构赋予期望的结构特性的材料的芯上。

公开(公告)号：US07253651B2

公开(公告)日：2007-08-07

申请号：US10905199

申请日：2004-12-21

Applicant: Igor Y. Khandros ,  Benjamin N. Eldridge

Inventor： Igor Y. Khandros ,  Benjamin N. Eldridge

IPC: G01R31/28 ,  G01R31/02 ,  G06F17/50

CPC classification number: G01R31/2884 ,  G01R31/3025 ,  G01R31/31907

Abstract: A central test facility transmits wirelessly test data to a local test facility, which tests electronic devices using the test data. The local test facility transmits wirelessly response data generated by the electronic devices back to the central test facility, which analyzes the response data to determine which electronic devices passed the testing. The central test facility may provide the results of the testing to other entities, such as a design facility where the electronic devices were designed or a manufacturing facility where the electronic devices where manufactured. The central test facility may accept requests for test resources from any of a number of local test facilities, schedule test times corresponding to each test request, and at a scheduled test time, wirelessly transmits test data to a corresponding local test facility.

Abstract translation: 中央测试设备将无线测试数据传输到本地测试设备，该测试设备使用测试数据测试电子设备。 本地测试设备将由电子设备生成的无线响应数据发送回中央测试设备，分析响应数据以确定哪些电子设备通过测试。 中央测试设备可以向其他实体提供测试结果，例如设计电子设备的设计设施或其中制造的电子设备的制造设施。 中央测试设备可以接受来自任何本地测试设施的测试资源的请求，对应于每个测试请求的调度测试时间，并且在预定的测试时间，将测试数据无线地传输到相应的本地测试设施。

公开(公告)号：US07142000B2

公开(公告)日：2006-11-28

申请号：US10673686

申请日：2003-09-29

Applicant: Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

Inventor： Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

IPC: G01R31/28 ,  G01R1/073

CPC classification number: H05K7/1069 ,  B23K1/0008 ,  B23K20/004 ,  B23K2101/40 ,  C23C18/1605 ,  C23C18/165 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/07342 ,  G01R31/2856 ,  G01R31/2863 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/6835 ,  H01L22/20 ,  H01L23/49811 ,  H01L23/544 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/27 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L24/83 ,  H01L24/90 ,  H01L24/94 ,  H01L25/0652 ,  H01L25/16 ,  H01L2223/54453 ,  H01L2224/02311 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/0558 ,  H01L2224/05599 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/11003 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/1147 ,  H01L2224/1184 ,  H01L2224/13022 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13582 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/274 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4556 ,  H01L2224/45572 ,  H01L2224/45599 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48724 ,  H01L2224/48844 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/83851 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/90 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10S977/712 ,  Y10S977/723 ,  Y10T29/49004 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49169 ,  Y10T29/49171 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/4922 ,  Y10T29/49812 ,  Y10T428/12396 ,  Y10T428/12528 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/48824 ,  H01L2224/48744 ,  H01L2224/29099 ,  H01L2224/29075 ,  H01L2224/85399

Abstract: Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies to be exercised (e.g., tested and/or burned-in) by connecting to the semiconductor dies with a circuit board or the like having a plurality of terminals disposed on a surface thereof. Subsequently, the semiconductor dies may be singulated from the semiconductor wafer, whereupon the same resilient contact structures can be used to effect interconnections between the semiconductor dies and other electronic components (such as wiring substrates, semiconductor packages, etc.). Using the all-metallic composite interconnection elements of the present invention as the resilient contact structures, burn-in can be performed at temperatures of at least 150° C., and can be completed in less than 60 minutes.

Abstract translation: 弹性接触结构直接安装在半导体晶片上的接合焊盘上，在裸片与半导体晶片分离（分离）之前。 这使得半导体管芯能够通过具有设置在其表面上的多个端子的电路板等连接到半导体管芯来进行（例如，测试和/或烧入）。 接下来，半导体管芯可以从半导体晶片分离，因此可以使用相同的弹性接触结构来实现半导体管芯和其他电子部件（例如布线基板，半导体封装等）之间的互连。 使用本发明的全金属复合互连元件作为弹性接触结构，可以在至少150℃的温度下进行老化，并且可以在少于60分钟内完成。

公开(公告)号：US06940093B2

公开(公告)日：2005-09-06

申请号：US09753309

申请日：2000-12-29

Applicant: Benjamin N. Eldridge ,  Igor Y. Khandros ,  David V. Pedersen ,  Ralph G. Whitten

Inventor： Benjamin N. Eldridge ,  Igor Y. Khandros ,  David V. Pedersen ,  Ralph G. Whitten

IPC: G01R1/073 ,  H01L23/50 ,  H01L23/58 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: G01R1/07307 ,  G01R31/2884 ,  G01R31/31723 ,  H01L22/32 ,  H01L23/50 ,  H01L23/60 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/16 ,  H01L2924/00013 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2224/29099 ,  H01L2924/00

Abstract: One embodiment of the present invention concerns an integrated circuit that includes bond pads and special contact pads or points. The bond pads are for interfacing the integrated circuit as a whole with an external circuit, and are to be bonded to a package or circuit board. The bond pads are disposed on the die in a predetermined alignment such as a peripheral, grid, or lead-on-center alignment. The special contact pads are used to provide external test patterns to internal circuits and/or to externally monitor results from testing the internal circuits. The special contact pads may be advantageously located on the integrated circuit with a high degree of positional freedom. For one embodiment, the special contact pads may be disposed on the die at a location that is not in the same alignment as the bond pads. The special contact pads may be smaller than the bond pads so as not to increase the die size due to the special contact pads. The special contact points may also be used to externally program internal circuits (e.g., nonvolatile circuits) at the die or package level. The special contact points may also be used to select redundant circuits for faulty circuits.

Abstract translation: 本发明的一个实施例涉及包括接合焊盘和特殊接触焊盘或点的集成电路。 接合焊盘用于将集成电路作为整体与外部电路接口，并且将被连接到封装或电路板。 接合焊盘以预定的对准方式设置在管芯上，例如外围，栅格或中心对准。 特殊接触焊盘用于向内部电路提供外部测试模式和/或外部监测测试内部电路的结果。 特别的接触垫可以有利地以高度的位置自由度位于集成电路上。 对于一个实施例，特殊接触焊盘可以在与焊盘不同于对准的位置处设置在管芯上。 特殊的接触焊盘可以小于接合焊盘，以便不会由于特殊的接触垫而增加管芯的尺寸。 特殊接触点也可以用于在芯片或封装级别外部编程内部电路（例如非易失性电路）。 特殊接触点也可用于选择故障电路的冗余电路。

公开(公告)号：US06791176B2

公开(公告)日：2004-09-14

申请号：US09777348

申请日：2001-02-05

Applicant: Gaetan L. Mathieu ,  Benjamin N. Eldridge ,  Gary W. Grube

Inventor： Gaetan L. Mathieu ,  Benjamin N. Eldridge ,  Gary W. Grube

IPC: H01L2348

CPC classification number: G01R3/00 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/06727 ,  G01R1/06744 ,  G01R1/06761 ,  H01L21/6835 ,  H01L23/49811 ,  H01L24/16 ,  H01L25/0657 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/1147 ,  H01L2224/11902 ,  H01L2224/13012 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/1308 ,  H01L2224/13099 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01055 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/19041 ,  H05K3/326 ,  H05K3/4092 ,  Y10S438/977 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49222 ,  Y10T29/49224 ,  H01L2924/00

Abstract: A method of forming an interconnection, including a spring contact element, by lithographic techniques. In one embodiment, the method includes applying a masking material over a first portion of a substrate, the masking material having an opening which will define a first portion of a spring structure, depositing a structure material (e.g., conductive material) in the opening, and overfilling the opening with the structure material, removing a portion of the structure material, and removing a first portion of the masking material. In this embodiment, at least a portion of the first portion of the spring structure is freed of masking material. In one aspect of the invention, the method includes planarizing the masking material layer and structure material to remove a portion of the structure material. In another aspect, the spring structure formed includes one of a post portion, a beam portion, and a tip structure portion.

Abstract translation: 通过光刻技术形成包括弹簧接触元件的互连的方法。 在一个实施例中，该方法包括在衬底的第一部分上施加掩模材料，掩模材料具有将限定弹簧结构的第一部分的开口，在开口中沉积结构材料（例如导电材料） 并用结构材料过度填充开口，去除结构材料的一部分，以及去除掩模材料的第一部分。 在该实施例中，弹簧结构的第一部分的至少一部分没有掩蔽材料。 在本发明的一个方面，该方法包括平坦化掩模材料层和结构材料以去除结构材料的一部分。 另一方面，形成的弹簧结构包括柱部分，梁部分和尖端结构部分中的一个。

公开(公告)号：US06741092B2

公开(公告)日：2004-05-25

申请号：US10035364

申请日：2001-12-28

Applicant: Benjamin N. Eldridge ,  Stefan Jan Juergen Zschiegner

Inventor： Benjamin N. Eldridge ,  Stefan Jan Juergen Zschiegner

IPC: G01R3102

CPC classification number: G01R31/2831

Abstract: A method and apparatus for detecting an arc condition in a semiconductor test system is disclosed. While probes in a semiconductor test system are being moved into or out of contact with a semiconductor wafer, the voltage level of power supplied to selected ones of the probes is monitored. If the voltage level of the power exceeds a level that could cause an arc between the probes and the semiconductor wafer while the wafer is being moved, an indication is generated that an arc condition has been detected.

Abstract translation: 公开了一种用于检测半导体测试系统中的电弧状态的方法和装置。 当半导体测试系统中的探针被移入或接触半导体晶片时，监测提供给所选探针的电压的电压电平。 如果电源的电压水平超过在晶片被移动时在探针与半导体晶片之间可能引起电弧的电平，则产生已经检测到电弧条件的指示。

公开(公告)号：US06727579B1

公开(公告)日：2004-04-27

申请号：US09592487

申请日：2000-06-08

Applicant: Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y Khandros ,  Gaetan L. Mathieu

Inventor： Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y Khandros ,  Gaetan L. Mathieu

IPC: H01L2352

CPC classification number: H05K3/4015 ,  B23K1/0016 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/06761 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01031 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/01204 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/20751 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/141 ,  H05K3/20 ,  H05K3/24 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  H01L2924/01004 ,  H01L2924/0102 ,  H01L2924/20752 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Contact structures exhibiting resilience or compliance for a variety of electronic components are formed by bonding a free end of a wire to a substrate, configuring the wire into a wire stem having a springable shape, severing the wire stem, and overcoating the wire stem with at least one layer of a material chosen primarily for its structural (resiliency, compliance) characteristics. A variety of techniques for configuring, severing, and overcoating the wire stem are disclosed. In an exemplary embodiment, a free end of a wire stem is bonded to a contact area on a substrate, the wire stem is configured to have a springable shape, the wire stem is severed to be free-standing by an electrical discharge, and the free-standing wire stem is overcoated by plating. A variety of materials for the wire stem (which serves as a falsework) and for the overcoat (which serves as a superstructure over the falsework) are disclosed. Various techniques are described for mounting the contact structures to a variety of electronic components (e.g., semiconductor wafers and dies, semiconductor packages, interposers, interconnect substrates, etc.), and various process sequences are described. The resilient contact structures described herein are ideal for making a “temporary” (probe) connections to an electronic component such as a semiconductor die, for burn-in and functional testing. The self-same resilient contact structures can be used for subsequent permanent mounting of the electronic component, such as by soldering to a printed circuit board (PCB). An irregular topography can be created on or imparted to the tip of the contact structure to enhance its ability to interconnect resiliently with another electronic component. Among the numerous advantages of the present invention is the great facility with which the tips of a plurality of contact structures can be made to be coplanar with one another. Other techniques and embodiments, such as wherein the falsework wirestem protrudes beyond an end of the superstructure, or is melted down, and wherein multiple free-standing resilient contact structures can be fabricated from loops, are described.