公开(公告)号：US09418975B1

公开(公告)日：2016-08-16

申请号：US14960606

申请日：2015-12-07

申请人： Mitsubishi Electric Corporation

发明人： Rei Yoneyama ,  Masayuki Ando ,  Takehiro Araki ,  Yoshitaka Kimura ,  Ryo Goto

IPC分类号： H01L29/40 ,  H01L25/18 ,  H01L23/498 ,  H01L25/00 ,  H01L23/04 ,  H01L29/16 ,  H01L29/20

CPC分类号： H01L25/18 ,  H01L23/045 ,  H01L23/24 ,  H01L23/50 ,  H01L23/5386 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/84 ,  H01L24/85 ,  H01L25/072 ,  H01L25/115 ,  H01L2224/37124 ,  H01L2224/37144 ,  H01L2224/40139 ,  H01L2224/40227 ,  H01L2224/45624 ,  H01L2224/45644 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/84205 ,  H01L2224/85205 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/1203 ,  H01L2924/13055 ,  H01L2924/19107

摘要： A semiconductor module has a first electrode terminal, a second electrode terminal, a third electrode terminal, a fourth electrode terminal, a fifth electrode terminal, and a sixth electrode terminal. The first electrode terminal and the second electrode terminal are arranged along a first direction. The third electrode terminal, the fourth electrode terminal, the fifth electrode terminal, and the sixth electrode terminal are arranged along a second direction perpendicular to the first direction. The first electrode terminal is arranged at a position where the first direction intersects with the second direction. The fourth electrode terminal, the fifth electrode terminal, and the sixth electrode terminal are AC output terminals or AC input terminals. The first electrode terminal is one of an anode terminal and a cathode terminal. At least one of the second electrode terminal and the third electrode terminal is the other of the anode terminal and the cathode terminal.

摘要翻译： 半导体模块具有第一电极端子，第二电极端子，第三电极端子，第四电极端子，第五电极端子和第六电极端子。 第一电极端子和第二电极端子沿着第一方向布置。 第三电极端子，第四电极端子，第五电极端子和第六电极端子沿着与第一方向垂直的第二方向布置。 第一电极端子布置在第一方向与第二方向相交的位置处。 第四电极端子，第五电极端子和第六电极端子是交流输出端子或交流输入端子。 第一电极端子是阳极端子和阴极端子之一。 第二电极端子和第三电极端子中的至少一个是阳极端子和阴极端子中的另一个。

公开(公告)号：US09406592B2

公开(公告)日：2016-08-02

申请号：US14735300

申请日：2015-06-10

申请人： Continental Automotive GmbH

发明人： Nico Kohl ,  Martin Metzler ,  Sven Egelkraut ,  Markus Leicht

IPC分类号： H01L23/495 ,  H01L23/00 ,  H01L23/498

CPC分类号： H01L23/49544 ,  H01L23/3735 ,  H01L23/495 ,  H01L23/49548 ,  H01L23/49838 ,  H01L23/49844 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/35 ,  H01L24/37 ,  H01L24/40 ,  H01L24/73 ,  H01L24/83 ,  H01L24/84 ,  H01L24/92 ,  H01L2224/29339 ,  H01L2224/32227 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/352 ,  H01L2224/37011 ,  H01L2224/37013 ,  H01L2224/37147 ,  H01L2224/3756 ,  H01L2224/37639 ,  H01L2224/4001 ,  H01L2224/4007 ,  H01L2224/40095 ,  H01L2224/40106 ,  H01L2224/40221 ,  H01L2224/40225 ,  H01L2224/40227 ,  H01L2224/40475 ,  H01L2224/40499 ,  H01L2224/73263 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83201 ,  H01L2224/83203 ,  H01L2224/83205 ,  H01L2224/83385 ,  H01L2224/83801 ,  H01L2224/83825 ,  H01L2224/8384 ,  H01L2224/8385 ,  H01L2224/84201 ,  H01L2224/84203 ,  H01L2224/84205 ,  H01L2224/84385 ,  H01L2224/84801 ,  H01L2224/84825 ,  H01L2224/8484 ,  H01L2224/8485 ,  H01L2224/92142 ,  H01L2224/92246 ,  H01L2924/00015 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/01047 ,  H01L2924/00012

摘要： A power semiconductor circuit includes at least one semiconductor having at least one contact area, and at least one bonding conductor strip having at least one contact region fastened on at least one of the contact areas. The contact region of the bonding conductor strip includes cutouts.

摘要翻译： 功率半导体电路包括至少一个具有至少一个接触区域的半导体，以及至少一个接合导体条，其具有紧固在至少一个接触区域上的至少一个接触区域。 接合导体条的接触区域包括切口。

公开(公告)号：US09402311B2

公开(公告)日：2016-07-26

申请号：US14435686

申请日：2013-10-25

申请人： NSK Ltd.

发明人： Takashi Sunaga ,  Noboru Kaneko ,  Osamu Miyoshi

IPC分类号： H05K7/00 ,  H05K1/09 ,  H01L25/07 ,  H01L25/18 ,  H01L23/373 ,  H01L23/498 ,  H01L23/495 ,  H05K1/02 ,  H05K1/05 ,  H05K1/18 ,  H01L23/00

CPC分类号： H05K1/09 ,  H01L23/142 ,  H01L23/3735 ,  H01L23/49582 ,  H01L23/49811 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/35 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/73 ,  H01L24/83 ,  H01L24/84 ,  H01L24/92 ,  H01L25/07 ,  H01L25/072 ,  H01L25/18 ,  H01L2224/05553 ,  H01L2224/0603 ,  H01L2224/291 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/32227 ,  H01L2224/32238 ,  H01L2224/33181 ,  H01L2224/352 ,  H01L2224/35847 ,  H01L2224/3701 ,  H01L2224/37013 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/40227 ,  H01L2224/40475 ,  H01L2224/40499 ,  H01L2224/4103 ,  H01L2224/4112 ,  H01L2224/48 ,  H01L2224/73263 ,  H01L2224/77272 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83424 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/84424 ,  H01L2224/84447 ,  H01L2224/84801 ,  H01L2224/84815 ,  H01L2224/85 ,  H01L2224/9221 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/351 ,  H05K1/0271 ,  H05K1/05 ,  H05K1/181 ,  H05K3/3431 ,  H05K2201/10166 ,  H05K2201/1028 ,  H05K2201/1031 ,  H05K2201/10409 ,  H05K2201/10946 ,  H05K2201/10962 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00015 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2224/84 ,  H01L2224/33 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor module includes a copper connector jointing an electrode formed on a top surface of a bare-chip transistor and a wiring pattern out of plural wiring patterns via a solder. The copper connector includes an electrode jointing portion jointed to the electrode of the bare-chip transistor and a substrate jointing portion arranged to face the electrode-jointing portion and jointed to the wiring pattern. The width W1 of the electrode jointing portion in a direction perpendicular to one direction is smaller than the width W2 of the substrate jointing portion in the direction perpendicular to the one direction.

摘要翻译： 半导体模块包括通过焊料将形成在裸芯片晶体管的顶表面上的电极和多个布线图案中的布线图案连接的铜连接器。 铜连接器包括连接到裸芯片晶体管的电极的电极接合部分和布置成面对电极接合部分并且接合到布线图案的基板接合部分。 电极接合部在与一个方向垂直的方向上的宽度W1小于基板接合部在垂直于该一个方向的方向上的宽度W2。

公开(公告)号：US20160181221A1

公开(公告)日：2016-06-23

申请号：US14910355

申请日：2014-10-06

申请人： NSK LTD.

发明人： Takashi SUNAGA ,  Noboru KANEKO ,  Osamu MIYOSHI ,  Ryoichi SUZUKI

IPC分类号： H01L23/00 ,  H01L23/498 ,  H01L23/492 ,  H01L29/78 ,  H01L29/739

CPC分类号： H01L24/41 ,  H01L23/3735 ,  H01L23/492 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/35 ,  H01L24/37 ,  H01L24/40 ,  H01L24/83 ,  H01L24/84 ,  H01L24/92 ,  H01L25/07 ,  H01L25/072 ,  H01L25/18 ,  H01L29/7393 ,  H01L29/78 ,  H01L2224/05553 ,  H01L2224/0603 ,  H01L2224/2732 ,  H01L2224/29101 ,  H01L2224/32227 ,  H01L2224/32238 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/352 ,  H01L2224/35847 ,  H01L2224/3701 ,  H01L2224/37011 ,  H01L2224/37013 ,  H01L2224/37124 ,  H01L2224/37139 ,  H01L2224/37144 ,  H01L2224/37147 ,  H01L2224/37611 ,  H01L2224/4001 ,  H01L2224/40095 ,  H01L2224/40227 ,  H01L2224/40475 ,  H01L2224/40499 ,  H01L2224/4099 ,  H01L2224/4112 ,  H01L2224/73263 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83424 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/84138 ,  H01L2224/8421 ,  H01L2224/84424 ,  H01L2224/84447 ,  H01L2224/84801 ,  H01L2224/84815 ,  H01L2224/9221 ,  H01L2924/00015 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15724 ,  H01L2924/19105 ,  H01L2924/35121 ,  H01L2924/365 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/291 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/48 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/84 ,  H01L2924/01029 ,  H01L2924/013 ,  H01L2924/00013

摘要： To provide a semiconductor module that has high reliability of electric connection by a solder and is inexpensive. A joint surface of an electrode jointing portion that is opposed to a surface to be jointed of a gate electrode of a bare-chip FET and a joint surface of a substrate jointing portion that is opposed to a surface to be jointed of another wiring pattern include an outgas releasing mechanism that makes outgas generated from a molten solder during solder jointing of a metal plate connector be released from solders interposed between the joint surfaces and the surfaces to be jointed.

摘要翻译： 提供通过焊料具有高可靠性的电连接并且便宜的半导体模块。 电极接合部的与裸芯片FET的栅电极接合的面相对的基板接合部的接合面与与其他布线图案的被接合面相对的基板接合部的接合面包含 在金属板连接器的焊接期间使从熔融焊料产生的废气从放置在接合面和待接合面之间的焊料脱离的脱气释放机构。

公开(公告)号：US20160043054A1

公开(公告)日：2016-02-11

申请号：US14451868

申请日：2014-08-05

申请人： Infineon Technologies AG

发明人： Rupert Fischer ,  Peter Strobel ,  Joachim Mahler ,  Konrad Roesl ,  Alexander Heinrich

IPC分类号： H01L23/00 ,  H01L25/00 ,  H01L23/495

CPC分类号： H01L24/97 ,  H01L21/6835 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/3142 ,  H01L23/49575 ,  H01L24/83 ,  H01L25/0655 ,  H01L25/18 ,  H01L25/50 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2224/04026 ,  H01L2224/05611 ,  H01L2224/05618 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/06181 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/371 ,  H01L2224/40227 ,  H01L2224/40247 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/83005 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/8381 ,  H01L2224/8382 ,  H01L2224/83851 ,  H01L2224/92246 ,  H01L2224/92247 ,  H01L2224/94 ,  H01L2224/95001 ,  H01L2224/95091 ,  H01L2224/97 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/84 ,  H01L2224/27 ,  H01L2924/014 ,  H01L2224/03 ,  H01L2924/00

摘要： Methods for connecting chips to a chip carrier are disclosed. In some embodiments the method for connecting a plurality of chips to a chip carrier includes placing first chips on a transfer carrier, placing second chips on the transfer carrier, placing the transfer carrier with the first and second chips on the chip carrier and forming connections between the first chips and the chip carrier and the second chips and the chip carrier.

摘要翻译： 公开了将芯片连接到芯片载体的方法。 在一些实施例中，用于将多个芯片连接到芯片载体的方法包括将第一芯片放置在转移载体上，将第二芯片放置在转移载体上，将具有第一和第二芯片的转移载体放置在芯片载体上并形成 第一芯片和芯片载体以及第二芯片和芯片载体。

公开(公告)号：US09147637B2

公开(公告)日：2015-09-29

申请号：US13336248

申请日：2011-12-23

申请人： Ralf Otremba ,  Roland Rupp ,  Daniel Domes

发明人： Ralf Otremba ,  Roland Rupp ,  Daniel Domes

IPC分类号： H01L23/02 ,  H01L23/48 ,  H01L23/24 ,  H01L23/373 ,  H01L23/495 ,  H01L23/498 ,  H01L23/00 ,  H01L23/31

CPC分类号： H01L23/48 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/3735 ,  H01L23/49524 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49811 ,  H01L24/05 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/84 ,  H01L24/85 ,  H01L24/92 ,  H01L2224/04026 ,  H01L2224/04034 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05669 ,  H01L2224/05671 ,  H01L2224/0603 ,  H01L2224/06181 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/37155 ,  H01L2224/3716 ,  H01L2224/37639 ,  H01L2224/37647 ,  H01L2224/37655 ,  H01L2224/3766 ,  H01L2224/4005 ,  H01L2224/40095 ,  H01L2224/40137 ,  H01L2224/40227 ,  H01L2224/40247 ,  H01L2224/4103 ,  H01L2224/41051 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/48464 ,  H01L2224/4847 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/48755 ,  H01L2224/48764 ,  H01L2224/48766 ,  H01L2224/48769 ,  H01L2224/48771 ,  H01L2224/73221 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/8381 ,  H01L2224/8382 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2224/84801 ,  H01L2224/8482 ,  H01L2224/8485 ,  H01L2224/85447 ,  H01L2224/92247 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/141 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/0105 ,  H01L2924/01049 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01015 ,  H01L2924/20759

摘要： A module includes a DCB substrate and a discrete device mounted on the DCB substrate, wherein the discrete device comprises a leadframe, a semiconductor chip mounted on the leadframe and an encapsulation material covering the semiconductor chip.

摘要翻译： 模块包括DCB衬底和安装在DCB衬底上的分立器件，其中分立器件包括引线框，安装在引线框上的半导体芯片和覆盖半导体芯片的封装材料。

公开(公告)号：US20150214189A1

公开(公告)日：2015-07-30

申请号：US14165720

申请日：2014-01-28

申请人： Infineon Technologies Austria AG

发明人： Tian San Tan ,  Theng Chao Long

IPC分类号： H01L25/065 ,  H01R4/00 ,  H01L23/31 ,  H01L23/00 ,  H01L25/00 ,  H01L21/56

CPC分类号： H01L25/0655 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/4334 ,  H01L23/49513 ,  H01L23/49524 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/38 ,  H01L24/40 ,  H01L24/48 ,  H01L24/70 ,  H01L24/73 ,  H01L24/83 ,  H01L24/84 ,  H01L24/89 ,  H01L24/97 ,  H01L25/072 ,  H01L25/50 ,  H01L2224/04026 ,  H01L2224/05554 ,  H01L2224/05609 ,  H01L2224/05611 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05669 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/32227 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/37011 ,  H01L2224/37013 ,  H01L2224/37026 ,  H01L2224/3719 ,  H01L2224/40227 ,  H01L2224/40245 ,  H01L2224/40499 ,  H01L2224/48227 ,  H01L2224/48245 ,  H01L2224/73221 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83143 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/83825 ,  H01L2224/8384 ,  H01L2224/83855 ,  H01L2224/84143 ,  H01L2224/84447 ,  H01L2224/84801 ,  H01L2224/84815 ,  H01L2224/84825 ,  H01L2224/8484 ,  H01L2224/8485 ,  H01L2224/84855 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/1425 ,  H01L2924/14252 ,  H01L2924/14253 ,  H01L2924/181 ,  H01R4/00 ,  H01L2924/00 ,  H01L2924/0105 ,  H01L2924/01049 ,  H01L2924/01014 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/83 ,  H01L2224/84

摘要： A semiconductor device includes a device carrier, a first semiconductor chip mounted on the device carrier and a second semiconductor chip mounted on the device carrier. Further, the semiconductor device includes a first contact clip bonded to a first electrode of the first semiconductor chip, a second contact clip bonded to a first electrode of the second semiconductor chip and an insulating connector configured to hold the first contact clip and the second contact clip together.

摘要翻译： 半导体器件包括器件载体，安装在器件载体上的第一半导体芯片和安装在器件载体上的第二半导体芯片。 此外，半导体器件包括接合到第一半导体芯片的第一电极的第一接触夹，与第二半导体芯片的第一电极接合的第二接触夹和被配置为保持第一接触夹和第二接触的绝缘连接器 夹在一起

公开(公告)号：US20150187726A1

公开(公告)日：2015-07-02

申请号：US14582196

申请日：2014-12-24

申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

发明人： Sung Keun PARK ,  Jun Woo Myung ,  Sung Min Song

IPC分类号： H01L23/00 ,  H01L23/495

CPC分类号： H01L23/495 ,  H01L23/3121 ,  H01L23/49531 ,  H01L23/49894 ,  H01L24/29 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L25/072 ,  H01L25/18 ,  H01L2224/29111 ,  H01L2224/32225 ,  H01L2224/37147 ,  H01L2224/3716 ,  H01L2224/40137 ,  H01L2224/40227 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48855 ,  H01L2224/49 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/83805 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2924/13034 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01028 ,  H01L2924/01082 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/00012

摘要： There are provided a semiconductor package and a method for manufacturing the same. The semiconductor package according to an exemplary embodiment of the present disclosure includes: a board on which an insulating layer and a plurality of circuit patterns are formed; first bonding parts formed on portions of an upper portion of the circuit pattern; second bonding parts formed on portions of the upper portion of the circuit pattern; a first semiconductor device mounted on the board; a first connecting member of electrically connecting the first bonding part and the first semiconductor device to each other; a second connecting member having one surface bonded to the second bonding part and the other end exposed to the outside; and an oxide film formed on the remaining portions except for the first bonding part and the second bonding part.

摘要翻译： 提供半导体封装及其制造方法。 根据本公开的示例性实施例的半导体封装包括：其上形成有绝缘层和多个电路图案的板; 形成在电路图案的上部的部分上的第一接合部; 形成在电路图案的上部的部分上的第二接合部; 安装在所述板上的第一半导体器件; 将第一接合部和第一半导体器件电连接的第一连接部件; 第二连接构件，其一个表面粘合到第二接合部分，另一端暴露于外部; 以及形成在除了第一接合部和第二接合部之外的其余部分上的氧化膜。

公开(公告)号：US08970021B2

公开(公告)日：2015-03-03

申请号：US14019962

申请日：2013-09-06

申请人： International Rectifier Corporation

发明人： Eung San Cho

IPC分类号： H01L23/495 ,  H01L23/373 ,  H01L23/498 ,  H01L23/00 ,  H01L21/78 ,  H01L25/07 ,  H01L25/18

CPC分类号： H01L23/49568 ,  H01L21/78 ,  H01L23/3735 ,  H01L23/49524 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49844 ,  H01L24/37 ,  H01L24/40 ,  H01L24/48 ,  H01L24/49 ,  H01L24/84 ,  H01L24/97 ,  H01L25/072 ,  H01L25/18 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40137 ,  H01L2224/40139 ,  H01L2224/40225 ,  H01L2224/40227 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73221 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： One exemplary disclosed embodiment comprises a semiconductor package including an inside pad, a transistor, and a conductive clip coupled to the inside pad and a terminal of the transistor. A top surface of the conductive clip is substantially exposed at the top of the package, and a side surface of the conductive clip is exposed at a side of the package. By supporting the semiconductor package on an outside pad during the fabrication process and by removing the outside pad during singulation, the conductive clip may be kept substantially parallel and in alignment with the package substrate while optimizing the package form factor compared to conventional packages. The exposed top surface of the conductive clip may be further attached to a heat sink for enhanced thermal dissipation.

摘要翻译： 一个示例性的公开实施例包括包括内部焊盘，晶体管和耦合到内部焊盘和晶体管的端子的导电夹的半导体封装。 导电夹的顶表面基本上暴露在封装的顶部，并且导电夹的侧表面暴露在封装的一侧。 通过在制造过程中在外部焊盘上支撑半导体封装并且在分离期间通过去除外部焊盘，与传统封装相比，导电夹可以保持基本上平行并与封装衬底对准，同时优化封装形状因素。 导电夹子的暴露的顶表面可以进一步附接到散热器以增强散热。

公开(公告)号：US20140332950A1

公开(公告)日：2014-11-13

申请号：US14363189

申请日：2012-11-07

申请人： KABUSHIKI KAISHA TOYOTA JIDOSHIOKKI

发明人： Yoshitaka Iwata ,  Shogo Mori ,  Daizo Kamiyama

IPC分类号： H01L23/373 ,  H01L23/31 ,  H01L23/12

CPC分类号： H01L23/3731 ,  H01L23/12 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/373 ,  H01L23/3735 ,  H01L23/473 ,  H01L23/49811 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/48 ,  H01L24/73 ,  H01L25/072 ,  H01L2224/291 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/371 ,  H01L2224/40137 ,  H01L2224/40227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73215 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2224/32245 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device includes a cooling portion, which is made of ceramic or resin and includes a mounting surface, a metal circuit board, which is mounted on the mounting surface of the cooling portion and includes an element mounting surface, and a semiconductor element mounted on the element mounting surface of the circuit board. At least a part of the circuit board, which corresponds to the element mounting surface, is covered with resin with respect to the cooling portion.

摘要翻译： 半导体器件包括由陶瓷或树脂制成并包括安装表面的冷却部分，安装在冷却部分的安装表面上并包括元件安装表面的金属电路板，以及安装在其上的半导体元件 电路板的元件安装表面。 电路板的至少一部分对应于元件安装表面，相对于冷却部分被树脂覆盖。