公开(公告)号：US07217997B2

公开(公告)日：2007-05-15

申请号：US10565044

申请日：2004-07-30

Applicant: Chris Wyland

Inventor： Chris Wyland

IPC: H01L23/34

CPC classification number: H01L24/73 ,  H01L23/04 ,  H01L23/3672 ,  H01L23/49816 ,  H01L23/50 ,  H01L23/552 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/91 ,  H01L2223/6611 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/73221 ,  H01L2224/73229 ,  H01L2224/73265 ,  H01L2224/85201 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/1616 ,  H01L2924/1617 ,  H01L2924/163 ,  H01L2924/166 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/32225 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A structure provides for the control of bond wire impedance. In an example embodiment, there is an integrated circuit device comprising a semiconductor device die having a plurality of grounding pads, signal pads, and power pads and a package for mounting the integrated circuit and includes a conductive path having at least one reference trace that surrounds the integrated circuit. A grounding arch is disposed over the semiconductor device die.

Abstract translation: 一种结构提供了对键合线阻抗的控制。 在示例性实施例中，存在集成电路器件，其包括具有多个接地焊盘，信号焊盘和电源焊盘的半导体器件管芯和用于安装集成电路的封装，并且包括具有至少一个参考迹线的导电路径， 集成电路。 接地拱架设置在半导体器件裸片上。

公开(公告)号：US07157790B2

公开(公告)日：2007-01-02

申请号：US10209502

申请日：2002-07-31

Applicant: Bruce Beauchamp ,  Andrew Tuthill ,  Joseph D. Fernandez ,  Anucha Phongsantichai

Inventor： Bruce Beauchamp ,  Andrew Tuthill ,  Joseph D. Fernandez ,  Anucha Phongsantichai

IPC: H01L31/00

CPC classification number: H01L24/49 ,  H01L23/4952 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48655 ,  H01L2224/48724 ,  H01L2224/48744 ,  H01L2224/48755 ,  H01L2224/48824 ,  H01L2224/48844 ,  H01L2224/48855 ,  H01L2224/4911 ,  H01L2224/49113 ,  H01L2224/49175 ,  H01L2224/85201 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An integrated circuit device comprising an integrated circuit die mounted on a leadframe having a plurality of inner leads. The integrated circuit die has a plurality of bond pads that are electrically connected to the inner leads of the leadframe, wherein at least two bond pads are connected to a one of the plurality of inner leads and/or at least two inner leads are connected to one or more bond pads with a single bond wire. A single bond wire is connected to a first bond pad or inner lead and subsequently wedge or stitch bonded to a second bond pad or inner lead, then it is connected to a third bond pad or inner lead. The single bond wire requires only one connection area at each of the bond pad(s) and inner lead(s). The bond pad(s) of the die and inner lead(s) of the leadframe are thereby electrically connected together by the single bond wire.

Abstract translation: 一种集成电路装置，包括安装在具有多个内引线的引线框上的集成电路管芯。 集成电路管芯具有电连接到引线框架的内部引线的多个接合焊盘，其中至少两个接合焊盘连接到多个内部引线中的一个和/或至少两个内部引线连接到 一个或多个具有单键线的接合焊盘。 单键线连接到第一接合焊盘或内引线，随后楔形或缝合接合到第二接合焊盘或内引线，然后连接到第三接合焊盘或内引线。 单键线在每个接合焊盘和内引线上仅需要一个连接区域。 因此，引线框架的管芯和内引线的接合焊盘由单键焊丝电连接在一起。

公开(公告)号：US20060270117A1

公开(公告)日：2006-11-30

申请号：US11482335

申请日：2006-07-06

Applicant: Robert Courtenay

Inventor： Robert Courtenay

IPC: H01L21/00

CPC classification number: H01L24/06 ,  H01L23/4951 ,  H01L23/49513 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05556 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2924/00 ,  H01L2924/00015

Abstract: A semiconductor device is formed from a die and a lead frame having one or more bus bars. Portions of the bus bars are overlain with an electrically insulative material while leaving bonding areas unobstructed, whereby bond wires which span the bus bar(s) may be bonded with a shorter wire and a lower loop, without the danger of shorting to the bus bar(s). The incidence of harmful wire sweep in the encapsulation step is also reduced.

Abstract translation: 半导体器件由具有一个或多个汇流条的管芯和引线框构成。 汇流条的一部分覆盖有电绝缘材料，同时使结合区域不被阻挡，由此跨越母线的接合线可以用较短的线和下回路接合，而不会与母线短路 （s）。 在封装步骤中有害线扫的发生率也降低。

公开(公告)号：US07132738B2

公开(公告)日：2006-11-07

申请号：US10782810

申请日：2004-02-23

Applicant: Hiroyuki Tomimatsu

Inventor： Hiroyuki Tomimatsu

IPC: H01L23/02

CPC classification number: H01L24/85 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48475 ,  H01L2224/48479 ,  H01L2224/48499 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/4911 ,  H01L2224/49112 ,  H01L2224/4917 ,  H01L2224/49429 ,  H01L2224/4945 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/85191 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/85986 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/20752 ,  H01L2924/20753 ,  H05K3/341 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/4554 ,  H01L2224/85399

Abstract: The invention enhances reliability and achieves higher speeds for semiconductor devices with a stacked structure. A semiconductor device includes a die pad, a plurality of semiconductor chips stacked on one surface of the die pad, leads extending toward the die pad, first wires that are bonded to first pads of a first semiconductor chip among the plurality of semiconductor chips and to second pads of a second semiconductor chip among the plurality of semiconductor chips, second wires that are bonded to the leads and to the first pads or the second pads, and a sealing material that seals the plurality of semiconductor chips and exposes another surface of the die pad.

Abstract translation: 本发明提高了具有堆叠结构的半导体器件的可靠性并实现更高的速度。 半导体器件包括：芯片焊盘，堆叠在芯片焊盘的一个表面上的多个半导体芯片，朝向芯片焊盘延伸的引线，接合到多个半导体芯片中的第一半导体芯片的第一焊盘的第一布线， 多个半导体芯片中的第二半导体芯片的第二焊盘，接合到引线和第一焊盘或第二焊盘的第二焊丝，以及密封多个半导体芯片并暴露模具的另一表面的密封材料 垫。

公开(公告)号：US07131568B2

公开(公告)日：2006-11-07

申请号：US10635843

申请日：2003-08-05

Applicant: Michael B. Ball

Inventor： Michael B. Ball

IPC: B23K31/02

CPC classification number: H01L24/85 ,  B23K20/004 ,  B23K2101/40 ,  H01L21/4825 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/05553 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/78301 ,  H01L2224/78703 ,  H01L2224/85181 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  Y10S269/903 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An apparatus and method of forming improved wire bonds between the contact pads on semiconductor devices and individual lead frame fingers of a lead frame. The apparatus and method include the use of a penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding by the clamp penetrating a portion of the lead finger being bonded. If desired, the apparatus and method also provide for the use of either a penetrating or non-penetrating fixed clamp for the lead fingers during the wire bonding process in addition to the penetrating individual independent lead finger clamp during the wire bonding process to provide increased stability of the individual lead finger for improved bonding.

Abstract translation: 一种在半导体器件上的接触焊盘和引线框架的单个引线框架指状物之间形成改进的引线接合的装置和方法。 该装置和方法包括在引线接合过程期间使用穿透的独立的独立引线夹，以提供单独的引线指针的增强的稳定性，以通过夹具穿过被接合的引线的一部分来改善接合。 如果需要，该设备和方法还提供了在引线接合过程期间使用穿透或非穿透性固定夹头用于引线指，以及在引线接合过程期间穿透独立的引线夹具，以提供增加的稳定性 的单个引线用于改善接合。

公开(公告)号：US20060197203A1

公开(公告)日：2006-09-07

申请号：US11320635

申请日：2005-12-30

Applicant: Ching-Sung Chu ,  Tsung-Ta Tsai ,  Ming-Yu Huang

Inventor： Ching-Sung Chu ,  Tsung-Ta Tsai ,  Ming-Yu Huang

IPC: H01L23/02

CPC classification number: H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L29/0657 ,  H01L2224/26145 ,  H01L2224/27013 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10155 ,  H01L2924/10157 ,  H01L2924/181 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/2075 ,  H01L2924/20754 ,  H01L2224/83205

Abstract: A die structure of a package is provided. The die structure of the package includes a carrier and a die. The die includes a first portion and a second portion. The top surface of the first portion is an active surface. The second portion is configured below the first portion. A first width of the first portion is smaller than a second width of the second portion. And the second portion of the die is adhered to the carrier.

Abstract translation: 提供包装的模具结构。 封装的管芯结构包括载体和管芯。 模具包括第一部分和第二部分。 第一部分的顶表面是活性表面。 第二部分被配置在第一部分下方。 第一部分的第一宽度小于第二部分的第二宽度。 并且模具的第二部分粘附到载体上。

公开(公告)号：US07082682B2

公开(公告)日：2006-08-01

申请号：US10938267

申请日：2004-09-10

Applicant: Igor Y. Khandros

Inventor： Igor Y. Khandros

IPC: H01R9/00

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  B23K2101/40 ,  C23C18/161 ,  C25D7/12 ,  G01R1/0466 ,  G01R1/06711 ,  G01R1/06761 ,  G01R1/07307 ,  G01R3/00 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/6715 ,  H01L21/76897 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/10126 ,  H01L2224/10145 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45109 ,  H01L2224/45111 ,  H01L2224/45116 ,  H01L2224/45117 ,  H01L2224/4512 ,  H01L2224/45123 ,  H01L2224/45124 ,  H01L2224/45138 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45163 ,  H01L2224/45164 ,  H01L2224/45169 ,  H01L2224/45173 ,  H01L2224/45176 ,  H01L2224/4554 ,  H01L2224/4556 ,  H01L2224/456 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/85043 ,  H01L2224/85045 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49174 ,  Y10T29/49179 ,  Y10T29/49204 ,  Y10T29/49222 ,  Y10T29/49224 ,  Y10T29/49609 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2924/00015 ,  H01L2924/2075 ,  H01L2924/0102

Abstract: Contact structures are formed by building a core structure on a substrate and over coating the core structure with a material that is harder or has a greater yield strength than the material of the core structure. The core structure may be formed by attaching a wire to the substrate and spooling the wire out from a spool. While spooling the wire out, the spool may be moved to impart a desired shape to the wire. The wire is severed from the spool and over coated. As an alternative, the wire is not over coated. The substrate may be an electronic device, such as a semiconductor die.

Abstract translation: 通过在基体上构建芯结构并用与芯结构的材料相比更硬或具有更高屈服强度的材料涂覆芯结构来形成接触结构。 芯结构可以通过将线附接到基底并且将线从线轴缠绕而形成。 在将电线卷绕的同时，可以使线轴移动以向线提供期望的形状。 电线从线轴上断开，并被覆盖。 作为替代方案，导线没有被覆盖。 衬底可以是诸如半导体管芯的电子器件。

公开(公告)号：US07061257B2

公开(公告)日：2006-06-13

申请号：US10889334

申请日：2004-07-12

Applicant: Igor Y. Khandros ,  A. Nicholas Sporck ,  Benjamin N. Eldridge

Inventor： Igor Y. Khandros ,  A. Nicholas Sporck ,  Benjamin N. Eldridge

IPC: G01R31/02

CPC classification number: H05K3/4015 ,  B23K1/0016 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/06711 ,  G01R1/07342 ,  G01R1/07364 ,  G01R1/07378 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/76897 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/45014 ,  H01L2224/45144 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4092 ,  H05K7/1069 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/05599

Abstract: In a probe card assembly, a series of probe elements can be arrayed on a silicon space transformer. The silicon space transformer can be fabricated with an array of primary contacts in a very tight pitch, comparable to the pitch of a semiconductor device. One preferred primary contact is a resilient spring contact. Conductive elements in the space transformer are routed to second contacts at a more relaxed pitch. In one preferred embodiment, the second contacts are suitable for directly attaching a ribbon cable, which in turn can be connected to provide selective connection to each primary contact. The silicon space transformer is mounted in a fixture that provides for resilient connection to a wafer or device to be tested. This fixture can be adjusted to planarize the primary contacts with the plane of a support probe card board.

公开(公告)号：US07061114B2

公开(公告)日：2006-06-13

申请号：US10811124

申请日：2004-03-25

Applicant: Edgardo R. Hortaleza ,  Lei Li

Inventor： Edgardo R. Hortaleza ,  Lei Li

IPC: H01L23/48

CPC classification number: H01L24/05 ,  H01L24/03 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/04042 ,  H01L2224/05073 ,  H01L2224/05147 ,  H01L2224/05157 ,  H01L2224/05166 ,  H01L2224/0518 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/05187 ,  H01L2224/05556 ,  H01L2224/05624 ,  H01L2224/45144 ,  H01L2224/48463 ,  H01L2224/48624 ,  H01L2224/85201 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/04941 ,  H01L2924/00

Abstract: An integrated circuit having copper interconnecting metallization (311, 312) protected by a first, inorganic overcoat layer (320), portions of the metallization exposed in windows (301, 302) opened through the thickness of the first overcoat layer. A patterned conductive barrier layer (330) is positioned on the exposed portion of the copper metallization and on portions of the first overcoat layer surrounding the window. A bondable metal layer (350, 351) is positioned on the barrier layer; the thickness of this bondable layer is suitable for wire bonding. A second, organic overcoat layer (360) is surrounding the window so that the surface (360a) of this second overcoat layer at the edge of the window is at or above the surface (350a) of the bondable layer. The second overcoat layer may be spaced (370) from the edge of the bondable metal layer.

Abstract translation: 具有由第一无机外涂层（320）保护的铜互连金属化（311,312）的集成电路，暴露在窗口（301,302）中的金属化部分暴露在第一外涂层的厚度上。 图案化的导电阻挡层（330）被定位在铜金属化的暴露部分上以及围绕窗口的第一覆盖层的部分上。 可粘合金属层（350,351）位于阻挡层上; 该可结合层的厚度适合于引线接合。 第二有机覆盖层（360）围绕窗户，使得窗口边缘处的该第二覆盖层的表面（360a）处于或接合在可结合层的表面（350a）上方。 第二外涂层可以与可粘合金属层的边缘间隔开（370）。

公开(公告)号：US07042087B2

公开(公告)日：2006-05-09

申请号：US10622997

申请日：2003-07-18

Applicant: Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Eiju Maehara ,  Noriyasu Sakai ,  Hitoshi Takagishi ,  Kouji Takahashi ,  Kazuhisa Kusano

Inventor： Noriaki Sakamoto ,  Yoshiyuki Kobayashi ,  Eiju Maehara ,  Noriyasu Sakai ,  Hitoshi Takagishi ,  Kouji Takahashi ,  Kazuhisa Kusano

IPC: H01L23/52 ,  H01L23/495 ,  B23K31/00

CPC classification number: H01L25/16 ,  H01L21/4832 ,  H01L23/3107 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2221/68377 ,  H01L2224/04042 ,  H01L2224/05556 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/48724 ,  H01L2224/48747 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/85424 ,  H01L2224/85447 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01059 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12035 ,  H01L2924/12036 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/2076 ,  H05K1/185 ,  H05K3/06 ,  H05K3/202 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/20754 ,  H01L2924/00015

Abstract: The semiconductor elements for the small signal type circuits and the Au wire for connection are integrated as one package to produce the semiconductor devices 30A, 31A, 32, 33A, 34A and 38. In this way, the wire bonding of Au can be omitted, and the wire bonding of the small diameter Al wire and the large diameter Al wire is only required to complete the connection of the fine metal wire.These semiconductor devices have a plurality of circuit elements as one package, so that the mounting operation on the mounting board can be significantly reduced.

Abstract translation: 用于小信号电路的半导体元件和用于连接的Au线被集成为一个封装以制造半导体器件30A，31A，32,3AA，34A和38。 以这种方式，可以省略Au的引线键合，仅需要小直径Al线和大直径Al线的引线接合才能完成金属细线的连接。 这些半导体器件具有作为一个封装的多个电路元件，从而可以显着地减少对安装板的安装操作。