公开(公告)号：US20060032888A1

公开(公告)日：2006-02-16

申请号：US11246353

申请日：2005-10-07

Applicant: Gregory Chapman ,  Michael Bettinger ,  Jennifer Due

Inventor： Gregory Chapman ,  Michael Bettinger ,  Jennifer Due

IPC: B23K37/00 ,  B23K1/06 ,  B23K31/02

CPC classification number: H01L24/85 ,  B23K20/005 ,  B23K2101/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/05624 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48824 ,  H01L2224/7825 ,  H01L2224/78301 ,  H01L2224/78302 ,  H01L2224/78306 ,  H01L2224/78307 ,  H01L2224/85043 ,  H01L2224/85045 ,  H01L2224/85181 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  Y10S228/904 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015

Abstract: An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.

公开(公告)号：US06982220B1

公开(公告)日：2006-01-03

申请号：US10780605

申请日：2004-02-19

Applicant: Shiann-Ming Liou

Inventor： Shiann-Ming Liou

IPC: H01L21/44

CPC classification number: H01L23/645 ,  H01L23/5286 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/4911 ,  H01L2224/49112 ,  H01L2224/49175 ,  H01L2224/85051 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2224/4554

Abstract: An integrated circuit power distribution system and method is provided. The integrated circuit comprises a semiconductor die that includes at least one pair of bond pads having a single bond wire connected thereto such that each bond pad of the pair of bond pads has only one bond wire end connected thereto. A first bond pad of the pair of bond pads is located in an internal portion of the semiconductor die. A first wire having a first end and a second end is electrically connected between the pair of bond pads.

Abstract translation: 提供集成电路配电系统和方法。 集成电路包括半导体管芯，其包括至少一对具有连接到其上的单键焊接的接合焊盘，使得该对接合焊盘中的每个接合焊盘仅具有连接到其上的一个接合线端。 一对接合焊盘的第一接合焊盘位于半导体管芯的内部。 具有第一端和第二端的第一线电连接在该对接合焊盘之间。

公开(公告)号：US06977214B2

公开(公告)日：2005-12-20

申请号：US09943763

申请日：2001-08-30

Applicant: David J. Corisis

Inventor： David J. Corisis

IPC: H01L21/607 ,  H01L23/495 ,  H01L21/44 ,  H01L29/40

CPC classification number: H01L24/85 ,  H01L23/49503 ,  H01L23/49541 ,  H01L24/29 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78703 ,  H01L2224/83805 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/83205

Abstract: A leadframe configuration for a semiconductor device that has a die attach paddle with paddle support bars. In addition, clamp tabs extend outwardly from lesser supported locations of the paddle to underlie a conventional lead clamp. The clamp tabs are formed as an integral part of the paddle. Normal clamping during die attach and wire bonding operations prevents paddle movement and enhances integrity of the die bond and wire bonds.

Abstract translation: 一种用于半导体器件的引线框架配置，其具有带有桨支撑杆的管芯附接桨叶。 另外，夹紧片从桨的较小的支撑位置向外延伸到常规引线夹的下面。 夹紧片形成为桨叶的组成部分。 管芯附着和引线接合操作期间的正常夹紧可防止桨移动并增强芯片接合和引线键合的完整性。

公开(公告)号：US06966480B2

公开(公告)日：2005-11-22

申请号：US10624796

申请日：2003-07-22

Applicant: Gregory M. Chapman ,  Michael J. Bettinger ,  Jennifer A. Due

Inventor： Gregory M. Chapman ,  Michael J. Bettinger ,  Jennifer A. Due

IPC: B23K20/00 ,  H01L21/603 ,  H01L21/607 ,  B23K37/00 ,  B23K31/00

CPC classification number: H01L24/85 ,  B23K20/005 ,  B23K2101/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/05624 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48824 ,  H01L2224/7825 ,  H01L2224/78301 ,  H01L2224/78302 ,  H01L2224/78306 ,  H01L2224/78307 ,  H01L2224/85043 ,  H01L2224/85045 ,  H01L2224/85181 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  Y10S228/904 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015

Abstract: An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip.

Abstract translation: 一种用于将导线接合到半导体器件的接合焊盘和引线框架的引线上的改进的引线接合毛细管，所述引线框架的引线键合毛细管具有工作尖端，所述工作尖端具有工作表面，所述工作尖端包括环绕引线进给孔的平坦环形部分 毛细管和从其延伸到与从工作尖端的外部尖端直径延伸的半径的交点处的凹面。

公开(公告)号：US06937037B2

公开(公告)日：2005-08-30

申请号：US10198198

申请日：2002-07-16

Applicant: Benjamin N. Eldridge ,  Gary W. Grube ,  Gaetan L. Mathieu

Inventor： Benjamin N. Eldridge ,  Gary W. Grube ,  Gaetan L. Mathieu

IPC: G01R31/26 ,  B23K20/00 ,  G01R1/067 ,  G01R1/073 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/603 ,  H01L21/66 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L25/065 ,  H01L25/16 ,  H01R33/76 ,  H05K1/14 ,  H05K3/20 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40

CPC classification number: B23K20/004 ,  B23K2101/40 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/07307 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07378 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/13099 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2924/0001 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15787 ,  H05K1/141 ,  H05K3/20 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4015 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  H01L2924/00

Abstract: A probe card is provided for probing a semiconductor wafer with raised contact elements. In particular, the present invention is useful with resilient contact elements, such as springs. A probe card is designed to have terminals to mate with the contact elements on the wafer. In a preferred embodiment, the terminals are posts. In a preferred embodiment the terminals include a contact material suitable for repeated contacts. In one particularly preferred embodiment, a space transformer is prepared with contact posts on one side and terminals on the opposing side. An interposer with spring contacts connects a contact on the opposing side of the space transformer to a corresponding terminal on a probe card, which terminal is in turn connected to a terminal which is connectable to a test device such as a conventional tester.

Abstract translation: 探针卡用于探测具有凸起接触元件的半导体晶片。 特别地，本发明对弹性接触元件例如弹簧是有用的。 探针卡被设计成具有与晶片上的接触元件配合的端子。 在优选实施例中，终端是帖子。 在优选实施例中，端子包括适于重复接触的接触材料。 在一个特别优选的实施例中，空间变压器被制备成具有一侧的接触柱和相对侧上的端子。 具有弹簧触点的插入件将空间变压器的相对侧上的触点连接到探针卡上的对应端子，该端子又连接到可连接到诸如常规测试器的测试装置的端子。

公开(公告)号：US20050185689A1

公开(公告)日：2005-08-25

申请号：US10961639

申请日：2004-10-08

Applicant: David Clark ,  Paul Charles

Inventor： David Clark ,  Paul Charles

IPC: H01S5/00 ,  H01S5/026 ,  H01S5/0625 ,  H01S5/125 ,  H01S5/20 ,  H01S5/227

CPC classification number: H01S5/227 ,  H01L24/45 ,  H01L2224/45144 ,  H01L2224/85201 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01S5/0265 ,  H01S5/06256 ,  H01S5/125 ,  H01S5/2077 ,  H01S5/2275 ,  H01L2224/48 ,  H01L2924/00

Abstract: A semiconductor component includes a waveguide section for guiding optical radiation, a Distributed Bragg Reflector (DBR) section for wavelength-selecting optical radiation received from the waveguide section and an Electro-absorption Modulator (EAM) section for modulating optical radiation received from the DBR section, in which each section has a waveguide layer for conveying the optical radiation, the sections being monolithically integrated on a common semiconductor substrate, the DBR section lying between the waveguide section and the EAM section with the waveguides of adjacent sections being butt-coupled and aligned so that optical radiation may be conveyed between adjacent sections.

Abstract translation: 半导体部件包括用于引导光辐射的波导部分，用于从波导部分接收的波长选择光辐射的分布布拉格反射器（DBR）部分和用于调制从DBR部分接收的光辐射的电吸收调制器（EAM）部分 ，其中每个部分具有用于传送光学辐射的波导层，这些部分单片地集成在公共半导体衬底上，DBR部分位于波导部分和EAM部分之间，相邻部分的波导是对接和对准的 使得可以在相邻部分之间传送光辐射。

公开(公告)号：US06913468B2

公开(公告)日：2005-07-05

申请号：US10684094

申请日：2003-10-10

Applicant: Thomas H. Dozier, II ,  Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

Inventor： Thomas H. Dozier, II ,  Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

IPC: B23K20/00 ,  C23C18/16 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/603 ,  H01L21/66 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L25/065 ,  H01L25/16 ,  H05K1/14 ,  H05K3/20 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K7/10 ,  H01R12/00

CPC classification number: B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/07314 ,  G01R1/07357 ,  G01R1/07378 ,  G01R3/00 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/76897 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K7/1069 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/48

Abstract: Surface-mount, solder-down sockets are described which permit electronic components such as semiconductor packages to be releasably mounted to a circuit board. Generally, the socket includes resilient contact structures extending from a top surface of a support substrate, and solder-ball (or other suitable) contact structures disposed on a bottom surface of the support substrate. Composite interconnection elements are described for use as the resilient contact structures disposed atop the support substrate. In use, the support substrate is soldered down onto the circuit board, the contact structures on the bottom surface of the support substrate contacting corresponding contact areas on the circuit board. In any suitable manner, selected ones of the resilient contact structures atop the support substrate are connected, via the support substrate, to corresponding ones of the contact structures on the bottom surface of the support substrate.

Abstract translation: 描述了允许诸如半导体封装的电子部件可释放地安装到电路板的表面贴装焊接插座。 通常，插座包括从支撑衬底的顶表面延伸的弹性接触结构以及设置在支撑衬底的底表面上的焊球（或其它合适的）接触结构。 复合互连元件被描述为用作设置在支撑基板顶上的弹性接触结构。 在使用中，支撑基板被焊接到电路板上，支撑基板的底表面上的接触结构接触电路板上的相应的接触区域。 以任何合适的方式，通过支撑衬底将支撑衬底上的弹性接触结构中的选定的接触结构连接到支撑衬底的底表面上的相应接触结构。

公开(公告)号：US06891267B2

公开(公告)日：2005-05-10

申请号：US10414492

申请日：2003-04-16

Applicant: Tetsuro Asano ,  Mikito Sakakibara

Inventor： Tetsuro Asano ,  Mikito Sakakibara

IPC: H01L21/822 ,  H01L21/338 ,  H01L23/482 ,  H01L23/485 ,  H01L23/528 ,  H01L23/552 ,  H01L23/66 ,  H01L27/04 ,  H01L27/06 ,  H01L27/095 ,  H01L29/812 ,  H03K17/693 ,  H01L23/34

CPC classification number: H01L24/05 ,  H01L23/4824 ,  H01L23/552 ,  H01L23/66 ,  H01L24/06 ,  H01L24/48 ,  H01L27/0605 ,  H01L2224/04042 ,  H01L2224/05552 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/05644 ,  H01L2224/05666 ,  H01L2224/05669 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/85201 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01031 ,  H01L2924/01037 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01088 ,  H01L2924/10161 ,  H01L2924/10329 ,  H01L2924/12032 ,  H01L2924/1306 ,  H01L2924/13063 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor switching circuit device includes a field effect transistor having a source electrode, a gate electrode and a drain electrode, a first electrode pad connected to the source electrode or the drain electrode, and a second electrode pad connected to the source electrode or the drain electrode which is not connected to the first electrode pad. The device also includes a third electrode pad receiving a DC voltage and applying the DC voltage to the field effect transistor, a first insulating layer covering the field effect transistor, a metal layer disposed above the first insulating layer and connected to the third electrode pad, and a second insulating layer disposed on the metal layer. The third electrode pad may be a control terminal pad, a ground terminal pad or a terminal pad receiving a constant DC power voltage. The metal layer may be a flat sheet, a lattice or a comb-like structure.

Abstract translation: 一种半导体开关电路装置，包括具有源电极，栅电极和漏电极的场效应晶体管，连接到源电极或漏极的第一电极焊盘和连接到源电极或漏极的第二电极焊盘 电极，其未连接到第一电极焊盘。 该装置还包括：接收DC电压并将DC电压施加到场效应晶体管的第三电极焊盘，覆盖场效应晶体管的第一绝缘层，设置在第一绝缘层上方并连接到第三电极焊盘的金属层， 以及设置在所述金属层上的第二绝缘层。 第三电极焊盘可以是控制端子焊盘，接地端子焊盘或接收恒定DC电源电压的端子焊盘。 金属层可以是平板状，格子状或梳状结构。

公开(公告)号：US06885087B2

公开(公告)日：2005-04-26

申请号：US10358572

申请日：2003-02-05

Applicant: Robert W. Courtenay

Inventor： Robert W. Courtenay

IPC: H01L23/495

CPC classification number: H01L24/06 ,  H01L23/4951 ,  H01L23/49513 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05556 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2924/00 ,  H01L2924/00015

Abstract: A semiconductor device is formed from a die and a lead frame having one or more bus bars. Portions of the bus bars are overlain with an electrically insulative material while leaving bonding areas unobstructed, whereby bond wires which span the bus bar(s) may be bonded with a shorter wire and a lower loop, without the danger of shorting to the bus bar(s). The incidence of harmful wire sweep in the encapsulation step is also reduced.

公开(公告)号：US20050028363A1

公开(公告)日：2005-02-10

申请号：US10938267

申请日：2004-09-10

Applicant: Igor Khandros

Inventor： Igor Khandros

IPC: B23K1/00 ,  C23C18/16 ,  C25D7/12 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/66 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L25/065 ,  H01L25/16 ,  H05K1/14 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K7/10 ,  H05K3/00 ,  H01R43/00 ,  H05K1/16

CPC classification number: H05K7/1069 ,  B23K1/0016 ,  B23K2101/40 ,  C23C18/161 ,  C25D7/12 ,  G01R1/0466 ,  G01R1/06711 ,  G01R1/06761 ,  G01R1/07307 ,  G01R3/00 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/6715 ,  H01L21/76897 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/10126 ,  H01L2224/10145 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45109 ,  H01L2224/45111 ,  H01L2224/45116 ,  H01L2224/45117 ,  H01L2224/4512 ,  H01L2224/45123 ,  H01L2224/45124 ,  H01L2224/45138 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45163 ,  H01L2224/45164 ,  H01L2224/45169 ,  H01L2224/45173 ,  H01L2224/45176 ,  H01L2224/4554 ,  H01L2224/4556 ,  H01L2224/456 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/85043 ,  H01L2224/85045 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49174 ,  Y10T29/49179 ,  Y10T29/49204 ,  Y10T29/49222 ,  Y10T29/49224 ,  Y10T29/49609 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2924/00015 ,  H01L2924/2075 ,  H01L2924/0102

Abstract: Contact structures are formed by building a core structure on a substrate and over coating the core structure with a material that is harder or has a greater yield strength than the material of the core structure. The core structure may be formed by attaching a wire to the substrate and spooling the wire out from a spool. While spooling the wire out, the spool may be moved to impart a desired shape to the wire. The wire is severed from the spool and over coated. As an alternative, the wire is not over coated. The substrate may be an electronic device, such as a semiconductor die.

Abstract translation: 通过在基体上构建芯结构并用与芯结构的材料相比更硬或具有更高屈服强度的材料涂覆芯结构来形成接触结构。 芯结构可以通过将线附接到基底并且将线从线轴缠绕而形成。 在将电线卷绕的同时，可以使线轴移动以向线提供期望的形状。 电线从线轴上断开，并被覆盖。 作为替代方案，导线没有被覆盖。 衬底可以是诸如半导体管芯的电子器件。