公开(公告)号：US20070126091A1

公开(公告)日：2007-06-07

申请号：US11296057

申请日：2005-12-07

申请人： Alan Wood ,  David Hembree

发明人： Alan Wood ,  David Hembree

IPC分类号： H01L23/495

CPC分类号： H01L23/02 ,  B33Y70/00 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/48 ,  H01L23/481 ,  H01L23/49827 ,  H01L24/10 ,  H01L24/11 ,  H01L24/13 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L25/0657 ,  H01L2221/6834 ,  H01L2224/02333 ,  H01L2224/02335 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13024 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/4554 ,  H01L2224/45565 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48145 ,  H01L2224/4824 ,  H01L2224/48471 ,  H01L2224/48475 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48992 ,  H01L2224/49429 ,  H01L2224/78301 ,  H01L2224/85001 ,  H01L2224/85045 ,  H01L2224/85051 ,  H01L2224/85121 ,  H01L2224/85205 ,  H01L2224/85444 ,  H01L2224/85951 ,  H01L2225/06506 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06596 ,  H01L2924/00015 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/19042 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45644 ,  H01L2924/00 ,  H01L2924/2075 ,  H01L2924/013 ,  H01L2924/00013 ,  H01L2924/00012

摘要： A semiconductor component includes a semiconductor substrate having a substrate contact, and a through wire interconnect (TWI) bonded to the substrate contact. The through wire interconnect (TWI) includes a via through the substrate contact and the substrate, a wire in the via bonded to the substrate contact, and a contact on the wire. A stacked semiconductor component includes the semiconductor substrate, and a second semiconductor substrate stacked on the substrate and bonded to a through wire interconnect on the substrate. A method for fabricating a semiconductor component with a through wire interconnect includes the steps of providing a semiconductor substrate with a substrate contact, forming a via through the substrate contact and part way through the substrate, placing the wire in the via, bonding the wire to the substrate contact, and then thinning the substrate from a second side to expose a contact on the wire. A system for fabricating the semiconductor component includes a bonding capillary configured to place the wire in the via, and to form a bonded connection between the wire and the substrate contact.

公开(公告)号：US20060243889A1

公开(公告)日：2006-11-02

申请号：US11476015

申请日：2006-06-28

申请人： Warren Farnworth ,  Sidney Rigg ,  William Hiatt ,  Alan Wood ,  Peter Benson ,  James Wark ,  David Hembree ,  Kyle Kirby ,  Charles Watkins ,  Salman Akram

发明人： Warren Farnworth ,  Sidney Rigg ,  William Hiatt ,  Alan Wood ,  Peter Benson ,  James Wark ,  David Hembree ,  Kyle Kirby ,  Charles Watkins ,  Salman Akram

IPC分类号： H01L27/00

CPC分类号： H01L27/00 ,  B33Y80/00 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14683 ,  H01L27/14687 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/00014

摘要： Microelectronic imager assemblies comprising a workpiece including a substrate and a plurality of imaging dies on and/or in the substrate. The substrate includes a front side and a back side, and the imaging dies comprise imaging sensors at the front side of the substrate and external contacts operatively coupled to the image sensors. The microelectronic imager assembly further comprises optics supports superimposed relative to the imaging dies. The optics supports can be directly on the substrate or on a cover over the substrate. Individual optics supports can have (a) an opening aligned with one of the image sensors, and (b) a bearing element at a reference distance from the image sensor. The microelectronic imager assembly can further include optical devices mounted or otherwise carried by the optics supports.

公开(公告)号：US20060234422A1

公开(公告)日：2006-10-19

申请号：US11451398

申请日：2006-06-13

申请人： Warren Farnworth ,  Alan Wood ,  James Wark ,  David Hembree ,  Rickie Lake

发明人： Warren Farnworth ,  Alan Wood ,  James Wark ,  David Hembree ,  Rickie Lake

IPC分类号： H01L21/00

CPC分类号： H01L31/0203 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14634 ,  H01L27/14683 ,  H01L2224/48227 ,  H01L2224/48091 ,  H01L2924/00014

摘要： Methods of packaging microelectronic imagers and packaged microelectronic imagers. An embodiment of such a method can include providing an imager workpiece having a plurality of imager dies arranged in a die pattern and providing a cover substrate through which a desired radiation can propagate. The imager dies include image sensors and integrated circuitry coupled to the image sensors. The method further includes providing a spacer having a web that includes an adhesive and has openings arranged to be aligned with the image sensors. For example, the web can be a film having an adhesive coating, or the web itself can be a layer of adhesive. The method continues by assembling the imager workpiece with the cover substrate such that (a) the spacer is between the imager workpiece and the cover substrate, and (b) the openings are aligned with the image sensors. The attached web is not cured after the imager workpiece and the cover substrate have both been adhered to the web. As such, the web does not outgas contaminants into the compartments in which the image sensors are housed.

摘要翻译： 包装微电子成像仪和封装的微电子成像仪的方法。 这种方法的实施例可以包括提供具有以模片图案布置的多个成像模具的成像工件，并提供覆盖基板，期望的辐射可以通过该基板传播。 成像器裸片包括耦合到图像传感器的图像传感器和集成电路。 该方法还包括提供具有包括粘合剂并具有布置成与图像传感器对准的开口的腹板的间隔件。 例如，网可以是具有粘合剂涂层的膜，或者网本身可以是一层粘合剂。 该方法通过将成像器工件与盖基板组装成使得（a）间隔件位于成像器工件和盖基板之间，并且（b）开口与图像传感器对准，该方法继续。 在成像器工件和盖基板都已经粘附在卷材上之后，连接的卷材不固化。 因此，纸幅不会将污染物排出到其中容纳图像传感器的隔室中。

公开(公告)号：US20060220665A1

公开(公告)日：2006-10-05

申请号：US11445684

申请日：2006-06-01

申请人： Salman Akram ,  Alan Wood ,  Warren Farnworth

发明人： Salman Akram ,  Alan Wood ,  Warren Farnworth

IPC分类号： G01R31/02

CPC分类号： H05K7/1061 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y80/00 ,  G01R1/0408 ,  G01R1/0433 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/07378 ,  G01R3/00 ,  H01L23/32 ,  H01L23/49827 ,  H01L2224/16111 ,  H01L2224/16237 ,  H01L2224/8114 ,  H01L2224/81385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/15787 ,  H01L2924/351 ,  H05K1/112 ,  H05K1/141 ,  H05K3/3436 ,  H05K2201/049 ,  H05K2201/09472 ,  H05K2201/10378 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2203/167 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T29/49204 ,  Y10T29/49218 ,  Y10T29/49222 ,  H01L2924/00

摘要： A fence is configured to receive and align a semiconductor device, such as a flip-chip type semiconductor device, with a substrate. The fence may include a plurality of adjacent, mutually adhered regions, which may comprise layers. One or more laterally recessed regions may be located at one or more corners of a receptacle formed by the fence to facilitate rough alignment of a semiconductor device with the substrate. The receptacle of the fence may include edges that are configured to progressively align a semiconductor device with the substrate.

摘要翻译： 栅栏被配置为接收和对齐诸如倒装芯片型半导体器件的半导体器件与衬底。 栅栏可以包括多个相邻的相互粘合的区域，其可以包括层。 一个或多个横向凹陷区域可以位于由栅栏形成的容器的一个或多个拐角处，以便半导体器件与衬底的粗略对准。 栅栏的插座可以包括被配置为使半导体器件与衬底逐渐对准的边缘。

公开(公告)号：US20060197235A1

公开(公告)日：2006-09-07

申请号：US11413414

申请日：2006-04-27

申请人： Warren Farnworth ,  Alan Wood

发明人： Warren Farnworth ,  Alan Wood

IPC分类号： H01L23/28

CPC分类号： H01L21/44 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/00 ,  B33Y80/00 ,  H01L23/3157 ,  H01L23/3192 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2224/29099 ,  H01L2924/00

摘要： An electronic device component, such as a semiconductor element device or semiconductor device component includes on selected portions of a surface thereof. One or more conductive features may be exposed through the protective element. The protective element includes a plurality of adjacent, mutually adhered regions. The adjacent, mutually adhered regions may comprise the same material. They may be substantially free of voids or air pockets. The electronic device may be an individual component or it may be physically secured to one or more other components, such as devices that have yet to be singulated from a large-scale substrate, such as a full or partial wafer or a strip or array of carriers.

摘要翻译： 诸如半导体元件器件或半导体器件部件的电子器件部件包括在其表面的选定部分上。 可以通过保护元件暴露一个或多个导电特征。 保护元件包括多个相邻的相互粘合的区域。 相邻的相互粘合的区域可以包括相同的材料。 它们可以基本上没有空隙或气穴。 电子设备可以是单个组件，或者它可以物理地固定到一个或多个其他组件，诸如尚未从大规模衬底（例如，全部或部分晶片）或者一个或多个 承运人

公开(公告)号：US20060154446A1

公开(公告)日：2006-07-13

申请号：US11371766

申请日：2006-03-09

申请人： Alan Wood ,  Trung Tri Doan

发明人： Alan Wood ,  Trung Tri Doan

IPC分类号： H01L21/44

CPC分类号： H01L23/3114 ,  H01L21/76831 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/11 ,  H01L24/13 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05172 ,  H01L2224/0557 ,  H01L2224/05572 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2225/06541 ,  H01L2225/06586 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  Y10S438/977 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05681 ,  H01L2224/05684 ,  H01L2224/05111 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05184

摘要： A semiconductor component includes back side pin contacts fabricated using a circuit side fabrication method. The component also includes a thinned semiconductor die having a pattern of die contacts, and conductive members formed by filled openings in the die contacts and the die. In addition, the pin contacts are formed by terminal portions of the conductive members. The fabrication method includes the steps of forming the openings and the conductive members, and then thinning and etching the die to form the pin contacts. An alternate embodiment female component includes female conductive members configured to physically and electrically engage pin contacts on a mating component of a stacked assembly.

摘要翻译： 半导体部件包括使用电路侧制造方法制造的后侧引脚触点。 该部件还包括具有模接触图案的薄化半导体管芯，以及由管芯接触件和管芯中的填充开口形成的导电部件。 此外，引脚触点由导电构件的端子部分形成。 制造方法包括形成开口和导电构件的步骤，然后使模具变薄和蚀刻以形成引脚触点。 替代实施例的阴部件包括阴导电部件，其被配置为物理地和电接合堆叠组件的配合部件上的销触点。

公开(公告)号：US20060035415A1

公开(公告)日：2006-02-16

申请号：US10919604

申请日：2004-08-16

申请人： Alan Wood ,  Kyle Kirby ,  Warren Farnworth ,  Salman Akram

发明人： Alan Wood ,  Kyle Kirby ,  Warren Farnworth ,  Salman Akram

IPC分类号： H01L21/50

CPC分类号： H01L27/14618 ,  B33Y80/00 ,  H01L27/14625 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A semiconductor package such as an image sensor package, and methods for fabrication. A frame structure includes an array of frames, each having an aperture therethrough, into which an image sensor die in combination with a cover glass, filter, lens or other components may be installed in precise mutual alignment. Singulated image sensor dice and other components may be picked and placed into each frame of the frame structure. Alternatively, the frame structure may be configured to be aligned with and joined to a wafer bearing a plurality of image sensor dice, wherein optional, downwardly protruding skirts along peripheries of the frames may be received into kerfs cut along streets between die locations on the wafer, followed by installation of other package components. In either instance, the frame structure in combination with singulated image sensor dice or a joined wafer is singulated into individual image sensor packages. Various external connection approaches may be used for the packages.

摘要翻译： 诸如图像传感器封装的半导体封装以及制造方法。 框架结构包括每个具有穿过其中的孔的框架阵列，图像传感器与盖玻片，过滤器，透镜或其它部件组合的模具可以精确相互对准地安装在该框架中。 单片图像传感器骰子和其他组件可以被拾取并放置在框架结构的每个帧中。 或者，框架结构可以被配置为与承载多个图像传感器骰子的晶片对准并且连接到其上，其中沿着框架的周边的任选的向下突出的裙边可以被接收到沿着晶片上的模具位置之间沿着街道切割的切口 ，然后安装其他包装组件。 在任一情况下，将帧结构与单独的图像传感器芯片或连接的晶片组合成单独的图像传感器封装。 各种外部连接方法可用于包装。

公开(公告)号：US20050242422A1

公开(公告)日：2005-11-03

申请号：US11167031

申请日：2005-06-27

申请人： Dean Klein ,  Alan Wood ,  Trung Doan

发明人： Dean Klein ,  Alan Wood ,  Trung Doan

IPC分类号： H01L23/498 ,  H01L25/065 ,  H01L23/02

CPC分类号： H01L23/48 ,  B33Y80/00 ,  H01L21/563 ,  H01L23/3114 ,  H01L23/49833 ,  H01L24/10 ,  H01L24/13 ,  H01L25/0652 ,  H01L25/0657 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06586 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/05599

摘要： A semiconductor package component includes a base die and a secondary die flip chip mounted to the base die. The base die includes a set of stacking contacts for flip chip mounting the secondary die to the base die, and a set of interconnect contacts configured as an internal signal transmission system, and a physical structure for supporting a terminal contact system of the package component. The package component also includes an encapsulant on the base die encapsulating the interconnect contacts, an underfill layer between the dice, and terminal contacts configured for flip chip mounting the package component to a supporting substrate. A method for fabricating the package component includes the steps of providing a base wafer containing a plurality of base dice, and flip chip mounting the secondary dice to the base dice on the base wafer. In addition the method includes the steps of forming and planarizing the interconnect contacts on the base dice, and forming the terminal contacts on the planarized interconnect contacts.

摘要翻译： 半导体封装部件包括安装在基模上的基模和次晶片倒装芯片。 基座芯片包括用于将二次管芯倒装芯片安装到基底管芯的一组叠置触点，以及一组配置为内部信号传输系统的互连触头，以及用于支撑封装部件的端子接触系统的物理结构。 封装部件还包括在封装了互连触头的基底管芯上的密封剂，芯片之间的底部填充层和被配置用于将封装部件倒装芯片安装到支撑衬底的端子触头。 制造封装部件的方法包括以下步骤：提供包含多个基底晶片的基底晶片，以及将二次晶片安装到基底晶片上的基底晶片的倒装芯片。 此外，该方法包括以下步骤：在基底裸片上形成和平坦化互连触点，以及在平坦化的互连触点上形成端子触点。

公开(公告)号：US20050237075A1

公开(公告)日：2005-10-27

申请号：US11170852

申请日：2005-06-30

申请人： Alan Wood ,  Tim Corbett

发明人： Alan Wood ,  Tim Corbett

IPC分类号： G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/26 ,  G01R31/28 ,  H01L21/60 ,  H01L21/66 ,  H01L23/13 ,  H05K3/00 ,  H05K3/40 ,  H05K3/42

CPC分类号： H01L24/80 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/0491 ,  G01R1/0735 ,  G01R3/00 ,  G01R31/2831 ,  G01R31/2855 ,  G01R31/2863 ,  G01R31/2867 ,  G01R31/2886 ,  G01R31/2889 ,  G01R31/2893 ,  H01L22/20 ,  H01L22/22 ,  H01L23/13 ,  H01L2224/16145 ,  H01L2225/06562 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15151 ,  H05K3/0058 ,  H05K3/0067 ,  H05K3/4007 ,  H05K3/423 ,  H05K2201/0133 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/0307 ,  H05K2203/0723

摘要： A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consisting of two halves. The first half of the test fixture is a wafer cavity plate for receiving the wafer, and the second half establishes electrical communication between the wafer and electrical testing equipment. A rigid substrate has conductors thereon which establish electrical contact with the wafer. The test fixture need not be opened until the burn-in and electrical testing are completed. After burn-in stress and electrical testing, it is possible to establish interconnection between the single die or separate and package dice into discrete parts, arrays or clusters, either as singulated parts or as arrays.

公开(公告)号：US20050230811A1

公开(公告)日：2005-10-20

申请号：US11152438

申请日：2005-06-14

申请人： Kyle Kirby ,  Warren Farnworth ,  James Wark ,  William Hiatt ,  David Hembree ,  Alan Wood

发明人： Kyle Kirby ,  Warren Farnworth ,  James Wark ,  William Hiatt ,  David Hembree ,  Alan Wood

IPC分类号： G01R1/073 ,  H01L21/66 ,  H01L23/48 ,  H01L23/498 ,  H01L23/58 ,  H01R13/24 ,  H05K3/32 ,  H05K3/40 ,  H05K7/06 ,  H05K7/10

CPC分类号： G01R1/0735 ,  G01R1/07314 ,  H01L23/13 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49827 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01R12/714 ,  H01R13/24 ,  H01R2201/20 ,  H05K3/326 ,  H05K7/1069 ,  H05K2201/0314 ,  H05K2201/09036 ,  H05K2201/10378 ,  Y10T29/49165 ,  Y10T29/49174 ,  Y10T29/49204 ,  Y10T29/49222 ,  H01L2224/05599

摘要： A compliant contact pin assembly and a contactor card system are provided. A compliant contact pin assembly includes a contact pin formed from a portion of a substrate with the contact pin compliantly held suspended within the substrate by a compliant coupling structure. The suspension within the substrate results in a compliant deflection orthogonal to the plane of the substrate. The contact pin assembly is formed by generally thinning the substrate around the contact pin location and then specifically thinning the substrate immediately around the contact pin location for forming a void. The contact pin is compliantly coupled, in one embodiment by compliant coupling material, and in another embodiment by compliantly flexible portions of the substrate.