Discrete electronic component and related assembling method
    371.
    发明申请
    Discrete electronic component and related assembling method 审中-公开
    离散电子元件及相关组装方法

    公开(公告)号:US20050195586A1

    公开(公告)日:2005-09-08

    申请号:US11053478

    申请日:2005-02-08

    Applicant: Elio Marioni

    Inventor: Elio Marioni

    Abstract: The present invention relates to a substantially package-like discrete electronic component of the type comprising a power electronic circuit, a body or casing, substantially parallelepiped, and electric connecting pins connected inside the body with said circuit and projecting from said body for an electric connection on the electronic printed circuit board. The body has a heat dissipating header having at least one surface emerging from the body and laying on a plane whereas the pins project from the body for a first section initially extended parallel to the plane. Advantageously a pair of pins has a substantially U-shaped bending, after the first section parallel to the plane for allowing a more stable bearing of the component during the step of welding to a heat dissipating intermediate die.

    Abstract translation: 本发明涉及一种基本上包装状的分立电子部件,其类型包括主电源电路,主体或壳体,基本上平行六面体的电连接销和连接在主体内的所述电路的电连接销,并从所述主体突出以进行电连接 在电子印刷电路板上。 主体具有散热头部,其具有至少一个从主体出来并放置在平面上的表面,而销从主体突出出来,第一部分最初平行于平面延伸。 有利的是,在第一部分平行于平面之后,一对销具有基本上U形的弯曲,以便在焊接到散热中间管芯的步骤期间允许部件的更稳定的轴承。

    Soldering structure between a tab of a bus bar and a printed substrate
    373.
    发明申请
    Soldering structure between a tab of a bus bar and a printed substrate 失效
    母线和印刷基板的接头之间的焊接结构

    公开(公告)号:US20050048825A1

    公开(公告)日:2005-03-03

    申请号:US10898183

    申请日:2004-07-26

    Abstract: A soldering structure between a tab of a bus bar and a printed substrate is disclosed to provide a soldering structure between a tab of a bus bar and a printed substrate that causes no crack. An electrical conductive material is formed on a printed substrate. A tab through-hole is provide to penetrate the electrical conductive material and printed substrate. A tab formed by bending a body of the bus bar enters the tab through-hole. A periphery of the tab and the electrical conductive material are interconnected by soldering. A stress-absorbing aperture or recess is provided in an insulation plate on which the body of the bus bar is mounted. The stress-absorbing aperture or recess can absorb an axial stress caused in the tab.

    Abstract translation: 公开了母线和印刷基板的突片之间的焊接结构,以在母线的突片和不产生裂纹的印刷基板之间提供焊接结构。 在印刷基板上形成导电材料。 提供突片通孔以穿透导电材料和印刷基板。 通过弯曲母线的主体形成的突片进入突片通孔。 突片和导电材料的周边通过焊接相互连接。 在安装母线主体的绝缘板上设置应力吸收孔或凹部。 应力吸收孔或凹槽可以吸收在凸片中产生的轴向应力。

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