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公开(公告)号:CN104900623B
公开(公告)日:2018-11-30
申请号:CN201410167761.6
申请日:2014-03-06
申请人: 恩智浦美国有限公司
IPC分类号: H01L23/495 , H01L23/488 , H01L21/60
CPC分类号: H01L25/18 , H01L21/56 , H01L21/568 , H01L23/3107 , H01L23/3121 , H01L23/49513 , H01L23/4952 , H01L23/49524 , H01L23/49541 , H01L23/49562 , H01L23/49568 , H01L23/49572 , H01L23/49575 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/92 , H01L24/97 , H01L25/50 , H01L2224/29011 , H01L2224/29013 , H01L2224/2919 , H01L2224/32058 , H01L2224/32105 , H01L2224/32245 , H01L2224/32257 , H01L2224/48137 , H01L2224/48247 , H01L2224/48465 , H01L2224/48472 , H01L2224/4903 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2224/83005 , H01L2224/83801 , H01L2224/83862 , H01L2224/85005 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/15151 , H01L2924/15157 , H01L2924/181 , H01L2924/18165 , H01L2924/35121 , H01L2224/45099 , H01L2924/00012 , H01L2224/83 , H01L2224/85 , H01L2924/00
摘要: 本发明涉及露出管芯的功率半导体装置。一种半导体封装件具有引线框和功率管芯。所述引线框具有第一管芯桨板,其具有一个空腔完全贯穿形成于其中。所述具有下表面的功率管芯且安装在所述第一管芯桨板上,使得所述下表面的第一部分使用无焊料管芯附接粘接剂附接到所述第一管芯桨板,以及所述下表面的第二部分未附接到所述第一管芯桨板,并邻接形成在所述第一管芯桨板中的所述空腔,使得所述第二部分暴露。
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公开(公告)号:CN104517936A
公开(公告)日:2015-04-15
申请号:CN201310653285.4
申请日:2013-12-05
申请人: 联发科技股份有限公司
IPC分类号: H01L23/538
CPC分类号: H01L25/0657 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L25/18 , H01L2224/16145 , H01L2224/32014 , H01L2224/32058 , H01L2224/32105 , H01L2224/32145 , H01L2224/48227 , H01L2224/73204 , H01L2224/73207 , H01L2224/73215 , H01L2225/0651 , H01L2225/06513 , H01L2225/06562 , H01L2225/06565 , H01L2225/06568 , H01L2924/00014 , H01L2924/1431 , H01L2924/1434 , H01L2924/15311 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/00 , H01L2224/05599 , H01L2224/85399
摘要: 本发明提供一种封装结构。该封装结构包括基板,具有位于该基板的第一表面的至少一导电单元;至少一第一芯片,位于该基板的第二表面;连接层;第二芯片,位于该连接层之上,其中该连接层包括至少一凸块,用于电性连接该至少一第一芯片至该第二芯片;以及至少一接合线,以用于电性连接该至少一第一芯片至该至少一导电单元或该基板。本发明所提出的封装结构,可降低成本。
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公开(公告)号:CN105489565A
公开(公告)日:2016-04-13
申请号:CN201410513135.8
申请日:2014-09-29
申请人: 矽品精密工业股份有限公司
CPC分类号: H01L23/49838 , H01L21/6835 , H01L23/3121 , H01L23/49822 , H01L23/49827 , H01L23/5389 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L2221/68318 , H01L2221/68345 , H01L2224/131 , H01L2224/13147 , H01L2224/16227 , H01L2224/16237 , H01L2224/26175 , H01L2224/2919 , H01L2224/32058 , H01L2224/32105 , H01L2224/32106 , H01L2224/32237 , H01L2224/73204 , H01L2224/81801 , H01L2224/83101 , H01L2924/15313 , H01L2924/18161 , H01L2924/19041 , H01L2924/19103 , H01L2924/19104 , H05K1/0231 , H05K1/185 , H05K1/186 , H05K1/189 , H05K3/0026 , H05K3/007 , H05K3/108 , H05K3/32 , H05K3/4682 , H05K2201/0376 , H05K2201/10515 , H05K2201/1053 , H05K2201/10674 , H05K2201/10977 , H01L2924/014 , H01L2924/00014 , H01L2924/0665
摘要: 一种嵌埋元件的封装结构及其制法,在承载板上形成第一线路层后,移除该承载板并将该第一线路层接置于结合层上。接着于该第一线路层上接置电子元件,并依序形成封装层、第二线路层及绝缘层,并以包覆层包覆设置于该电子元件及该第二线路层上的晶片。通过本发明能够有效减少封装结构的厚度,且能在不须使用粘着剂的情况下固定该电子元件。
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公开(公告)号:CN104900623A
公开(公告)日:2015-09-09
申请号:CN201410167761.6
申请日:2014-03-06
申请人: 飞思卡尔半导体公司
IPC分类号: H01L23/495 , H01L23/488 , H01L21/60
CPC分类号: H01L25/18 , H01L21/56 , H01L21/568 , H01L23/3107 , H01L23/3121 , H01L23/49513 , H01L23/4952 , H01L23/49524 , H01L23/49541 , H01L23/49562 , H01L23/49568 , H01L23/49572 , H01L23/49575 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/92 , H01L24/97 , H01L25/50 , H01L2224/29011 , H01L2224/29013 , H01L2224/2919 , H01L2224/32058 , H01L2224/32105 , H01L2224/32245 , H01L2224/32257 , H01L2224/48137 , H01L2224/48247 , H01L2224/48465 , H01L2224/48472 , H01L2224/4903 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2224/83005 , H01L2224/83801 , H01L2224/83862 , H01L2224/85005 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/15151 , H01L2924/15157 , H01L2924/181 , H01L2924/18165 , H01L2924/35121 , H01L2224/45099 , H01L2924/00012 , H01L2224/83 , H01L2224/85 , H01L2924/00
摘要: 本发明涉及露出管芯的功率半导体装置。一种半导体封装件具有引线框和功率管芯。所述引线框具有第一管芯桨板,其具有一个空腔完全贯穿形成于其中。所述具有下表面的功率管芯且安装在所述第一管芯桨板上,使得所述下表面的第一部分使用无焊料管芯附接粘接剂附接到所述第一管芯桨板,以及所述下表面的第二部分未附接到所述第一管芯桨板,并邻接形成在所述第一管芯桨板中的所述空腔,使得所述第二部分暴露。
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公开(公告)号:CN104584712A
公开(公告)日:2015-04-29
申请号:CN201380044132.8
申请日:2013-08-16
申请人: 松下知识产权经营株式会社
CPC分类号: H01R43/048 , G02F1/1303 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/743 , H01L24/75 , H01L24/83 , H01L2224/27334 , H01L2224/2929 , H01L2224/293 , H01L2224/32014 , H01L2224/32105 , H01L2224/32225 , H01L2224/75301 , H01L2224/756 , H01L2224/75621 , H01L2224/7565 , H01L2224/75701 , H01L2224/75702 , H01L2224/75744 , H01L2224/75745 , H01L2224/75753 , H01L2224/75755 , H01L2224/75804 , H01L2224/759 , H01L2224/75901 , H01L2224/7598 , H01L2224/83101 , H01L2224/83121 , H01L2224/83132 , H01L2224/83192 , H01L2224/83203 , H01L2224/83851 , H05K3/301 , H05K3/323 , H05K2203/0278 , Y10T29/4914 , Y10T29/53174 , H01L2924/00012 , H01L2924/00014
摘要: 本发明的目的是提供能够在防止安装于基板上的元件掉落的同时转入元件压接工作的元件封装装置和元件封装方法。在基板(2)放置在设于中央基板转移单元(33C)中的基板放置台(53)上的情况下,基板(2)被转移到元件装载操作单元(22b),在已经通过元件装载操作单元(22b)执行将元件(4)装载在基板(2)上的操作之后,中央基板转移单元(33C)被移动至第一元件压接操作单元(22c)侧,以由此将保持放置在基板放置台(53)上的基板(2)转移到第一元件压接操作单元(22c),并且通过第一元件压接操作单元(22c)将元件(4)压接到基板(2)。
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公开(公告)号:CN103456706A
公开(公告)日:2013-12-18
申请号:CN201310205500.4
申请日:2013-05-29
申请人: NXP股份有限公司
IPC分类号: H01L23/498 , H01L21/48 , H01L21/50 , H05K1/11
CPC分类号: H01L21/78 , H01L21/56 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/12 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2224/0346 , H01L2224/0401 , H01L2224/04026 , H01L2224/04105 , H01L2224/05016 , H01L2224/05088 , H01L2224/051 , H01L2224/05111 , H01L2224/05147 , H01L2224/05568 , H01L2224/05573 , H01L2224/05582 , H01L2224/05611 , H01L2224/05639 , H01L2224/05644 , H01L2224/06181 , H01L2224/13147 , H01L2224/16145 , H01L2224/20 , H01L2224/291 , H01L2224/32105 , H01L2224/32113 , H01L2224/32237 , H01L2224/33181 , H01L2224/9202 , H01L2224/94 , H01L2224/96 , H01L2225/06513 , H01L2225/06565 , H01L2924/00014 , H01L2924/10253 , H01L2924/12036 , H01L2924/014 , H01L2924/00 , H01L2224/03 , H01L2224/81 , H01L2224/05552
摘要: 公开了一种分立半导体器件封装(100),包括:半导体管芯(110),具有第一表面以及与所述第一表面相对且承载触点(112)的第二表面;所述触点上的导电体(120);密封材料(130),横向地密封所述导电体;以及与导电体导电接触的封盖部件(140,610),例如焊接帽、另一半导体管芯或者其组合,所述焊接帽在密封材料上延伸。可以将另一焊接帽(150)设置在第一表面上。也公开了一种制造这种分立半导体器件封装的方法。
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公开(公告)号:CN104517936B
公开(公告)日:2018-11-23
申请号:CN201310653285.4
申请日:2013-12-05
申请人: 联发科技股份有限公司
IPC分类号: H01L23/538
CPC分类号: H01L25/0657 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L25/18 , H01L2224/16145 , H01L2224/32014 , H01L2224/32058 , H01L2224/32105 , H01L2224/32145 , H01L2224/48227 , H01L2224/73204 , H01L2224/73207 , H01L2224/73215 , H01L2225/0651 , H01L2225/06513 , H01L2225/06562 , H01L2225/06565 , H01L2225/06568 , H01L2924/00014 , H01L2924/1431 , H01L2924/1434 , H01L2924/15311 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/00 , H01L2224/05599 , H01L2224/85399
摘要: 本发明提供一种封装结构。该封装结构包括基板,具有位于该基板的第一表面的至少一导电单元;至少一第一芯片,位于该基板的第二表面;连接层;第二芯片,位于该连接层之上,其中该连接层包括至少一凸块,用于电性连接该至少一第一芯片至该第二芯片;以及至少一接合线,以用于电性连接该至少一第一芯片至该至少一导电单元或该基板。本发明所提出的封装结构,可降低成本。
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公开(公告)号:CN104867898B
公开(公告)日:2017-12-15
申请号:CN201510087951.1
申请日:2015-02-25
申请人: 英飞凌科技股份有限公司
IPC分类号: H01L23/495 , H01L21/60
CPC分类号: H01L21/52 , H01L21/4803 , H01L21/683 , H01L21/78 , H01L23/051 , H01L23/3677 , H01L23/492 , H01L23/49861 , H01L24/19 , H01L24/20 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/83 , H01L24/92 , H01L24/97 , H01L2224/0346 , H01L2224/2101 , H01L2224/214 , H01L2224/215 , H01L2224/221 , H01L2224/2732 , H01L2224/29011 , H01L2224/29188 , H01L2224/2919 , H01L2224/32105 , H01L2224/32111 , H01L2224/32155 , H01L2224/32225 , H01L2224/73267 , H01L2224/82101 , H01L2224/82105 , H01L2224/82947 , H01L2224/83192 , H01L2224/83201 , H01L2224/9202 , H01L2224/92244 , H01L2224/97 , H01L2924/13055 , H01L2924/15156 , H01L2924/3511 , H01L2924/00 , H01L2924/00014 , H01L2224/03 , H01L2924/0665 , H01L2924/014 , H01L2924/00012 , H01L2924/01029 , H01L2924/01028 , H01L2224/19 , H01L2224/83
摘要: 本发明的各个实施例涉及具有镀覆的引线框架的半导体器件及其制造方法。提供了一种具有各自用于接收和承载半导体芯片的多个插口的载体衬底。半导体芯片布置在插口中,并且在插口中镀覆金属以在半导体芯片上形成与该半导体芯片接触的金属结构。对载体衬底进行切割以形成单独的半导体器件。
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公开(公告)号:CN104718611B
公开(公告)日:2017-07-11
申请号:CN201380038752.0
申请日:2013-06-06
申请人: 伊文萨思公司
IPC分类号: H01L21/768 , H01L23/48 , H01L23/00
CPC分类号: H01L23/34 , H01L21/76841 , H01L21/76883 , H01L21/76885 , H01L21/76898 , H01L23/147 , H01L23/481 , H01L23/49811 , H01L23/49827 , H01L24/05 , H01L24/10 , H01L24/13 , H01L2224/0401 , H01L2224/05558 , H01L2224/05567 , H01L2224/0557 , H01L2224/05571 , H01L2224/1134 , H01L2224/1147 , H01L2224/13082 , H01L2224/13083 , H01L2224/13124 , H01L2224/13147 , H01L2224/13155 , H01L2224/13184 , H01L2224/13565 , H01L2224/32105 , H01L2924/00011 , H01L2924/01322 , H01L2924/07811 , H01L2924/12042 , H01L2924/00 , H01L2924/00012 , H01L2924/00014 , H01L2924/014 , H01L2224/81805
摘要: 部件10可包括衬底20和在开口30内延伸的导电通孔40。衬底20可具有第一和第二相对表面21、22。可在开口30的内壁32处露出介电材料60。导电通孔40可与第一表面21相邻地在开口30内限定释放沟道55。释放沟道55可在平行于第一表面21的平面P的方向D2上和所述第一表面21下方的5微米内与内壁32相距第一距离D1的边缘56,第一距离小于1微米和平面中的开口30的最大宽度的5%。边缘56可沿着内壁32延伸以跨越内壁的圆周的至少5%。
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公开(公告)号:CN105140136A
公开(公告)日:2015-12-09
申请号:CN201510438605.3
申请日:2010-03-11
申请人: 高通股份有限公司
IPC分类号: H01L21/56 , H01L21/60 , H01L23/31 , H01L23/48 , H01L23/522 , H01L25/065 , H01L25/18
CPC分类号: G06F1/16 , G11C5/147 , H01L21/563 , H01L23/3128 , H01L23/3171 , H01L23/3192 , H01L23/481 , H01L23/5223 , H01L23/5227 , H01L23/60 , H01L23/66 , H01L24/02 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/50 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/85 , H01L24/92 , H01L24/94 , H01L24/97 , H01L25/0657 , H01L25/16 , H01L25/18 , H01L25/50 , H01L2223/6611 , H01L2223/6666 , H01L2224/02166 , H01L2224/02311 , H01L2224/02313 , H01L2224/02321 , H01L2224/0233 , H01L2224/02331 , H01L2224/0235 , H01L2224/0237 , H01L2224/02371 , H01L2224/02375 , H01L2224/02381 , H01L2224/0239 , H01L2224/024 , H01L2224/0345 , H01L2224/03462 , H01L2224/03464 , H01L2224/03612 , H01L2224/03614 , H01L2224/03912 , H01L2224/0392 , H01L2224/0401 , H01L2224/04042 , H01L2224/05024 , H01L2224/05027 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05176 , H01L2224/05181 , H01L2224/05187 , H01L2224/05541 , H01L2224/05548 , H01L2224/05554 , H01L2224/0556 , H01L2224/05567 , H01L2224/05572 , H01L2224/056 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05669 , H01L2224/05673 , H01L2224/05676 , H01L2224/11 , H01L2224/11009 , H01L2224/1132 , H01L2224/11334 , H01L2224/11462 , H01L2224/11464 , H01L2224/1147 , H01L2224/11849 , H01L2224/119 , H01L2224/1191 , H01L2224/13 , H01L2224/13006 , H01L2224/1302 , H01L2224/13022 , H01L2224/13024 , H01L2224/13082 , H01L2224/13083 , H01L2224/13084 , H01L2224/13099 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13169 , H01L2224/13294 , H01L2224/133 , H01L2224/13311 , H01L2224/13609 , H01L2224/1403 , H01L2224/1411 , H01L2224/14181 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/16245 , H01L2224/16265 , H01L2224/17181 , H01L2224/2919 , H01L2224/2929 , H01L2224/29294 , H01L2224/293 , H01L2224/29339 , H01L2224/32105 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48111 , H01L2224/48145 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/48624 , H01L2224/48644 , H01L2224/48647 , H01L2224/48664 , H01L2224/48669 , H01L2224/48764 , H01L2224/48769 , H01L2224/48824 , H01L2224/48844 , H01L2224/48847 , H01L2224/48864 , H01L2224/4911 , H01L2224/49175 , H01L2224/4918 , H01L2224/73203 , H01L2224/73204 , H01L2224/73207 , H01L2224/73215 , H01L2224/73253 , H01L2224/73257 , H01L2224/73265 , H01L2224/81191 , H01L2224/81411 , H01L2224/81444 , H01L2224/81801 , H01L2224/81815 , H01L2224/8185 , H01L2224/81895 , H01L2224/81903 , H01L2224/83101 , H01L2224/83104 , H01L2224/83851 , H01L2224/92 , H01L2224/9202 , H01L2224/92125 , H01L2224/92127 , H01L2224/92147 , H01L2224/92225 , H01L2224/92247 , H01L2224/94 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06562 , H01L2225/06589 , H01L2225/1023 , H01L2225/1029 , H01L2225/1058 , H01L2225/107 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01059 , H01L2924/01068 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2924/1421 , H01L2924/1433 , H01L2924/15311 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19104 , H01L2924/19105 , H01L2924/30105 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2224/48869 , H01L2224/48744 , H01L2924/00012 , H01L2224/03 , H01L2224/0361 , H01L2924/0665 , H01L2224/81 , H01L2224/83 , H01L24/78 , H01L2224/85 , H01L21/56 , H01L21/78 , H01L2924/0635 , H01L2924/07025 , H01L21/304 , H01L21/76898 , H01L2224/0231 , H01L24/10
摘要: 本申请涉及使用顶部后钝化技术和底部结构技术的集成电路芯片。本发明揭示集成电路芯片和芯片封装,其包含所述集成电路芯片的顶部处的过钝化方案和所述集成电路芯片的底部处的底部方案,所述过钝化方案和底部方案使用顶部后钝化技术和底部结构技术。所述集成电路芯片可通过所述过钝化方案或所述底部方案连接到外部电路或结构,例如球栅格阵列(BGA)衬底、印刷电路板、半导体芯片、金属衬底、玻璃衬底或陶瓷衬底。还描述相关的制造技术。
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