公开(公告)号：US10032752B2

公开(公告)日：2018-07-24

申请号：US15348238

申请日：2016-11-10

申请人： Invensas Corporation

发明人： Richard Dewitt Crisp ,  Wael Zohni ,  Belgacem Haba ,  Frank Lambrecht

IPC分类号： H01L25/065 ,  G11C5/04 ,  G11C5/06 ,  H01L23/00 ,  H01L23/13 ,  H01L23/498 ,  H01L23/50 ,  H01L23/48 ,  G11C8/18 ,  H01L23/02

CPC分类号： H01L25/0657 ,  G11C5/04 ,  G11C5/063 ,  G11C5/066 ,  G11C8/18 ,  H01L23/02 ,  H01L23/13 ,  H01L23/48 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/49113 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2225/06562 ,  H01L2225/06572 ,  H01L2225/06589 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3011 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/85

摘要： A microelectronic assembly can include a microelectronic package connected with a circuit panel. The package has a microelectronic element having a front face facing away from a substrate of the package, and electrically connected with the substrate through conductive structure extending above the front face. First terminals provided in first and second parallel grids or in first and second individual columns can be configured to carry address information usable to determine an addressable memory location from among all the available addressable memory locations of the memory storage array. The first terminals in the first grid can have signal assignments which are a mirror image of the signal assignments of the first terminals in the second grid.

公开(公告)号：US10026717B2

公开(公告)日：2018-07-17

申请号：US15430943

申请日：2017-02-13

申请人： Invensas Corporation

发明人： Cyprian Emeka Uzoh ,  Rajesh Katkar

IPC分类号： H01L25/065 ,  H01L23/00 ,  H01L49/02 ,  B81B7/00

CPC分类号： H01L25/0657 ,  B81B7/0074 ,  B81C1/0023 ,  H01L21/4853 ,  H01L23/3675 ,  H01L23/42 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/522 ,  H01L23/5383 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/24 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/16 ,  H01L25/50 ,  H01L28/10 ,  H01L28/20 ,  H01L28/40 ,  H01L2224/0239 ,  H01L2224/0332 ,  H01L2224/0333 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/0347 ,  H01L2224/03614 ,  H01L2224/0391 ,  H01L2224/03912 ,  H01L2224/03914 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05111 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05169 ,  H01L2224/05184 ,  H01L2224/05547 ,  H01L2224/05565 ,  H01L2224/05568 ,  H01L2224/05569 ,  H01L2224/05611 ,  H01L2224/05616 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05669 ,  H01L2224/05684 ,  H01L2224/1134 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/1147 ,  H01L2224/11903 ,  H01L2224/1191 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/13025 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13169 ,  H01L2224/13184 ,  H01L2224/13565 ,  H01L2224/13616 ,  H01L2224/1403 ,  H01L2224/14131 ,  H01L2224/14132 ,  H01L2224/14134 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16265 ,  H01L2224/17181 ,  H01L2224/24147 ,  H01L2224/24227 ,  H01L2224/244 ,  H01L2224/32145 ,  H01L2224/3303 ,  H01L2224/33181 ,  H01L2224/45015 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48149 ,  H01L2224/4903 ,  H01L2224/73201 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81825 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/1461 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/16251 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/3841 ,  H01L2924/00 ,  H01L2924/01029 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/01028 ,  H01L2224/05 ,  H01L2224/13 ,  H01L2224/81 ,  H01L2224/45099

摘要： Apparatuses relating generally to a substrate are disclosed. In such an apparatus, first wire bond wires (“first wires”) extend from a surface of the substrate. Second wire bond wires (“second wires”) extend from the surface of the substrate. The first wires and the second wires are external to the substrate. The first wires are disposed at least partially within the second wires. The first wires are of a first height. The second wires are of a second height greater than the first height for coupling of at least one electronic component to the first wires at least partially disposed within the second wires.

公开(公告)号：US10014243B2

公开(公告)日：2018-07-03

申请号：US15403679

申请日：2017-01-11

申请人： Invensas Corporation

发明人： Hong Shen ,  Liang Wang ,  Gabriel Z. Guevara ,  Rajesh Katkar ,  Cyprian Emeka Uzoh ,  Laura Wills Mirkarimi

IPC分类号： H01L23/498 ,  H01L21/48 ,  H01L25/065 ,  H01L25/00 ,  H01L23/00

CPC分类号： H01L23/49822 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49805 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/09 ,  H01L24/48 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/15192 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/85399

摘要： An interposer (110) has contact pads at the top and/or bottom surfaces for connection to circuit modules (e.g. ICs 112). The interposer includes a substrate made of multiple layers (110.i). Each layer can be a substrate (110S), possibly a ceramic substrate, with circuitry. The substrates extend vertically. Multiple interposers are fabricated in a single structure (310) made of vertical layers (310.i) corresponding to the interposers' layers. The structure is diced along horizontal planes (314) to provide the interposers. An interposer's vertical conductive lines (similar to through-substrate vias) can be formed on the substrates' surfaces before dicing and before all the substrates are attached to each other. Thus, there is no need to make through-substrate holes for the vertical conductive lines. Non-vertical features can also be formed on the substrates' surfaces before the substrates are attached to each other. Other embodiments are also provided.

公开(公告)号：US10008534B2

公开(公告)日：2018-06-26

申请号：US15461001

申请日：2017-03-16

申请人： Invensas Corporation

发明人： Cyprian Emeka Uzoh ,  Rajesh Katkar

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L27/146 ,  H01L23/31 ,  H01L23/00 ,  H01L25/065 ,  H01L21/56

CPC分类号： H01L27/14634 ,  H01L21/568 ,  H01L23/3114 ,  H01L24/09 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/46 ,  H01L24/48 ,  H01L24/49 ,  H01L24/82 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L27/14618 ,  H01L27/14636 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/09181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48101 ,  H01L2224/48227 ,  H01L2224/4903 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2924/00014 ,  H01L2924/143 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： In a microelectronic package, a first wire bond wire is coupled to an upper surface of a substrate. A first bond mass is coupled to another end of the first wire bond wire. A second wire bond wire is coupled to the upper surface. A second bond mass is coupled to another end of the second wire bond wire. The first and second wire bond wires laterally jut out horizontally away from the upper surface of the substrate for at least a distance of approximately 2 to 3 times a diameter of both the first wire bond wire and the second wire bond wire. The first wire bond wire and the second wire bond wire are horizontal for the distance with respect to being co-planar with the upper surface within +/−10 degrees.

公开(公告)号：US09984992B2

公开(公告)日：2018-05-29

申请号：US14997774

申请日：2016-01-18

申请人： Invensas Corporation

发明人： Javier A. DeLaCruz ,  Abiola Awujoola ,  Ashok S. Prabhu ,  Christopher W. Lattin ,  Zhuowen Sun

IPC分类号： H05K1/02 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L25/065 ,  H01L25/16

CPC分类号： H01L24/49 ,  H01L23/3121 ,  H01L23/49838 ,  H01L23/552 ,  H01L24/17 ,  H01L24/48 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/11334 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/17051 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48108 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06562 ,  H01L2225/1023 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  H05K1/0284 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00

摘要： In a vertically integrated microelectronic package, a first microelectronic device is coupled to an upper surface of a circuit platform in a wire bond-only surface area thereof. Wire bond wires are coupled to and extends away from an upper surface of the first microelectronic device. A second microelectronic device in a face-down orientation is coupled to upper ends of the wire bond wires in a surface mount-only area. The second microelectronic device is located above and at least partially overlaps the first microelectronic device. A protective layer is disposed over the circuit platform and the first microelectronic device. An upper surface of the protective layer has the surface mount-only area. The upper surface of the protective layer has the second microelectronic device disposed thereon in the face-down orientation in the surface mount-only area for coupling to the upper ends of the first wire bond wires.

公开(公告)号：US20180130766A1

公开(公告)日：2018-05-10

申请号：US15861631

申请日：2018-01-03

申请人： Invensas Corporation

发明人： Belgacem Haba

IPC分类号： H01L23/00

CPC分类号： H01L24/83 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L24/92 ,  H01L24/94 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/05611 ,  H01L2224/05616 ,  H01L2224/05687 ,  H01L2224/113 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13193 ,  H01L2224/1403 ,  H01L2224/1601 ,  H01L2224/16105 ,  H01L2224/16146 ,  H01L2224/271 ,  H01L2224/2733 ,  H01L2224/2741 ,  H01L2224/27436 ,  H01L2224/27849 ,  H01L2224/29027 ,  H01L2224/29028 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29393 ,  H01L2224/29499 ,  H01L2224/3201 ,  H01L2224/32105 ,  H01L2224/32145 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/75102 ,  H01L2224/8109 ,  H01L2224/81101 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/8309 ,  H01L2224/83101 ,  H01L2224/83143 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/83815 ,  H01L2224/83851 ,  H01L2224/83862 ,  H01L2224/8388 ,  H01L2224/9211 ,  H01L2224/9212 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2924/01006 ,  H01L2924/014 ,  H01L2924/381 ,  H01L2924/0665 ,  H01L2924/07025 ,  H01L2924/0675 ,  H01L2924/0635 ,  H01L2924/00012 ,  H01L2924/069 ,  H01L2224/83 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/11 ,  H01L2224/27

摘要： An adhesive with self-connecting interconnects is provided. The adhesive layer provides automatic 3D joining of microelectronic components with a conductively self-adjusting anisotropic matrix. In an implementation, the adhesive matrix automatically makes electrical connections between two surfaces that have opposing electrical contacts, and bonds the two surfaces together. Conductive members in the adhesive matrix are aligned to automatically establish electrical connections between at least partially aligned contacts on each of the two surfaces while providing nonconductive adhesion between parts of the two surfaces lacking aligned contacts. An example method includes forming an adhesive matrix between two surfaces to be joined, including conductive members anisotropically aligned in an adhesive medium, then pressing the two surfaces together to automatically connect corresponding electrical contacts that are at least partially aligned on the two surfaces. The adhesive medium in the matrix secures the two surfaces together.

公开(公告)号：US20180130757A1

公开(公告)日：2018-05-10

申请号：US15346397

申请日：2016-11-08

申请人： Invensas Corporation

发明人： Belgacem Haba ,  Ilyas Mohammed

IPC分类号： H01L23/00 ,  H01L23/498 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H05K1/02

CPC分类号： H01L23/562 ,  H01L21/4857 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/4985 ,  H01L23/5387 ,  H01L25/065

摘要： A foldable microelectronic assembly and a method for forming the same are provided. One or more packages comprising encapsulated microelectronic elements are formed, along with a compliant layer. The packages and the compliant layer are coupled to a redistribution layer. The compliant layer and the redistribution layer are bent such that the redistribution layer is non-planar.

公开(公告)号：US20180130717A1

公开(公告)日：2018-05-10

申请号：US15865842

申请日：2018-01-09

申请人： INVENSAS CORPORATION

发明人： Hong SHEN ,  Charles G. WOYCHIK ,  Arkalgud R. SITARAM

IPC分类号： H01L23/055 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L21/768 ,  H01L23/04 ,  H01L23/14 ,  H01L23/31 ,  H01L23/367 ,  H01L23/48 ,  H01L21/288 ,  H01L25/00 ,  H01L25/065 ,  H01L23/00 ,  H01L23/538 ,  H01L23/10

CPC分类号： H01L23/055 ,  H01L21/2885 ,  H01L21/4803 ,  H01L21/486 ,  H01L21/56 ,  H01L21/561 ,  H01L21/76879 ,  H01L21/76897 ,  H01L23/04 ,  H01L23/10 ,  H01L23/147 ,  H01L23/3107 ,  H01L23/315 ,  H01L23/3675 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5389 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/06548 ,  H01L2225/06555 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012

摘要： Dies (110) with integrated circuits are attached to a wiring substrate (120), possibly an interposer, and are protected by a protective substrate (410) attached to a wiring substrate. The dies are located in cavities in the protective substrate (the dies may protrude out of the cavities). In some embodiments, each cavity surface puts pressure on the die to strengthen the mechanical attachment of the die the wiring substrate, to provide good thermal conductivity between the dies and the ambient (or a heat sink), to counteract the die warpage, and possibly reduce the vertical size. The protective substrate may or may not have its own circuitry connected to the dies or to the wiring substrate. Other features are also provided.

公开(公告)号：US09947643B2

公开(公告)日：2018-04-17

申请号：US15075899

申请日：2016-03-21

申请人： Invensas Corporation

发明人： Ilyas Mohammed ,  Masud Beroz ,  Liang Wang

IPC分类号： H01L33/62 ,  H01L25/16 ,  H01L33/06 ,  H01L33/22 ,  H01L33/32 ,  H01L33/60 ,  H01L33/00 ,  H01L33/58

CPC分类号： H01L25/167 ,  H01L33/0079 ,  H01L33/06 ,  H01L33/22 ,  H01L33/32 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

摘要： Inverted optical device. In accordance with an embodiment of the present invention, a plurality of piggyback substrates are attached to a carrier wafer. The plurality of piggyback substrates are dissimilar in composition to the carrier wafer. The plurality of piggyback substrates are processed, while attached to the carrier wafer, to produce a plurality of integrated circuit devices. A flip wafer is attached to the plurality of light emitting diodes, away from the carrier wafer and the carrier wafer is removed. The plurality of light emitting diodes may be singulated to form individual light emitting diode devices.

公开(公告)号：US09935075B2

公开(公告)日：2018-04-03

申请号：US15237936

申请日：2016-08-16

申请人： Invensas Corporation

发明人： Shaowu Huang ,  Javier A. Delacruz

IPC分类号： H01L23/552 ,  H01L23/00 ,  H01L21/56 ,  H01L23/31

CPC分类号： H01L24/49 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/552 ,  H01L24/85 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49097 ,  H01L2224/49171 ,  H01L2224/49179 ,  H01L2924/15311 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/00014

摘要： Apparatuses relating generally to a microelectronic package having protection from electromagnetic interference are disclosed. In an apparatus thereof, a platform has an upper surface and a lower surface opposite the upper surface and has a ground plane. A microelectronic device is coupled to the upper surface of the platform. Wire bond wires are coupled to the ground plane with a pitch. The wire bond wires extend away from the upper surface of the platform with upper ends of the wire bond wires extending above an upper surface of the microelectronic device. The wire bond wires are spaced apart from one another to provide a fence-like perimeter to provide an interference shielding cage. A conductive layer is coupled to at least a subset of the upper ends of the wire bond wires for electrical conductivity to provide a conductive shielding layer to cover the interference shielding cage.