专利检索 cpc:"H01L2224/80121" 第 7 页

61.

发明授权
Methods and devices for fabricating and assembling printable semiconductor elements 有权

公开(公告)号：US09768086B2

公开(公告)日：2017-09-19

申请号：US15084211

申请日：2016-03-29

申请人： The Board of Trustees of the University of Illinois

发明人： Ralph G. Nuzzo , John A. Rogers , Etienne Menard , Keon Jae Lee , Dahl-Young Khang , Yugang Sun , Matthew Meitl , Zhengtao Zhu

IPC分类号： H01L23/02 , H01L21/322 , B82Y10/00 , H01L29/06 , H01L29/786 , H01L31/0392 , H01L31/18 , H01L21/02 , H01L21/308 , H01L29/12 , H01L29/04 , H01L23/00 , H01L21/683 , H01L27/12 , H01L25/075 , H01L33/00 , H01L33/32

CPC分类号： H01L29/76 , B81C2201/0185 , B82Y10/00 , H01L21/02521 , H01L21/02603 , H01L21/02628 , H01L21/308 , H01L21/322 , H01L21/6835 , H01L23/02 , H01L24/03 , H01L24/05 , H01L24/08 , H01L24/29 , H01L24/32 , H01L24/80 , H01L24/83 , H01L24/94 , H01L24/97 , H01L25/0753 , H01L27/1285 , H01L27/1292 , H01L29/04 , H01L29/06 , H01L29/0665 , H01L29/0673 , H01L29/0676 , H01L29/068 , H01L29/12 , H01L29/78603 , H01L29/78681 , H01L29/78696 , H01L31/0392 , H01L31/03926 , H01L31/1804 , H01L31/1864 , H01L31/1896 , H01L33/007 , H01L33/0079 , H01L33/32 , H01L2221/68368 , H01L2221/68381 , H01L2224/03 , H01L2224/0332 , H01L2224/0345 , H01L2224/03614 , H01L2224/0362 , H01L2224/05073 , H01L2224/05082 , H01L2224/05124 , H01L2224/05144 , H01L2224/05155 , H01L2224/05166 , H01L2224/05552 , H01L2224/05553 , H01L2224/05554 , H01L2224/05555 , H01L2224/05644 , H01L2224/05666 , H01L2224/08225 , H01L2224/2919 , H01L2224/32225 , H01L2224/80 , H01L2224/80006 , H01L2224/80121 , H01L2224/80862 , H01L2224/80895 , H01L2224/83 , H01L2224/83005 , H01L2224/83121 , H01L2224/83192 , H01L2224/83193 , H01L2224/8385 , H01L2224/83862 , H01L2224/9202 , H01L2224/94 , H01L2224/95 , H01L2224/97 , H01L2924/00012 , H01L2924/01032 , H01L2924/0665 , H01L2924/10253 , H01L2924/10329 , H01L2924/12032 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2924/1305 , H01L2924/1306 , H01L2924/13063 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/15159 , H01L2924/15162 , H01L2924/15788 , H01L2924/1579 , Y02E10/547 , Y02P70/521 , Y10S977/707 , Y10S977/724 , H01L2924/00014 , H01L2924/00

摘要： The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

62.

发明授权
Hybrid bonding systems and methods for semiconductor wafers 有权

公开(公告)号：US09748198B2

公开(公告)日：2017-08-29

申请号：US14725266

申请日：2015-05-29

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Ping-Yin Liu , Shih-Wei Lin , Xin-Hua Huang , Lan-Lin Chao , Chia-Shiung Tsai

IPC分类号： H01L21/30 , H01L21/46 , H01L23/00

CPC分类号： H01L24/80 , H01L24/03 , H01L24/05 , H01L24/08 , H01L24/27 , H01L24/74 , H01L24/94 , H01L2224/02215 , H01L2224/0361 , H01L2224/03616 , H01L2224/0381 , H01L2224/05647 , H01L2224/05687 , H01L2224/08145 , H01L2224/74 , H01L2224/7501 , H01L2224/75101 , H01L2224/7565 , H01L2224/75753 , H01L2224/75824 , H01L2224/80004 , H01L2224/80007 , H01L2224/8001 , H01L2224/80011 , H01L2224/80013 , H01L2224/80014 , H01L2224/80065 , H01L2224/80075 , H01L2224/80097 , H01L2224/80121 , H01L2224/80136 , H01L2224/80203 , H01L2224/80895 , H01L2224/80896 , H01L2224/83889 , H01L2224/94 , H01L2924/00014 , H01L2924/1461 , H01L2924/351 , Y10T156/15 , Y10T156/1744 , H01L2924/00012 , H01L2224/80 , H01L2924/05442 , H01L2924/00

摘要： Hybrid bonding systems and methods for semiconductor wafers are disclosed. In one embodiment, a hybrid bonding system for semiconductor wafers includes a chamber and a plurality of sub-chambers disposed within the chamber. A robotics handler is disposed within the chamber that is adapted to move a plurality of semiconductor wafers within the chamber between the plurality of sub-chambers. The plurality of sub-chambers includes a first sub-chamber adapted to remove a protection layer from the plurality of semiconductor wafers, and a second sub-chamber adapted to activate top surfaces of the plurality of semiconductor wafers prior to hybrid bonding the plurality of semiconductor wafers together. The plurality of sub-chambers also includes a third sub-chamber adapted to align the plurality of semiconductor wafers and hybrid bond the plurality of semiconductor wafers together.

63.

发明授权
Alignment systems and wafer bonding systems and methods 有权

公开(公告)号：US09646860B2

公开(公告)日：2017-05-09

申请号：US13963741

申请日：2013-08-09

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Xin-Hua Huang , Xiaomeng Chen , Ping-Yin Liu , Lan-Lin Chao

IPC分类号： H01L21/68 , H01L21/67 , H01L23/00

CPC分类号： H01L24/94 , H01L21/67092 , H01L21/681 , H01L24/08 , H01L24/74 , H01L24/80 , H01L2224/08145 , H01L2224/74 , H01L2224/7501 , H01L2224/75251 , H01L2224/75252 , H01L2224/753 , H01L2224/75702 , H01L2224/75744 , H01L2224/75745 , H01L2224/75802 , H01L2224/75804 , H01L2224/75822 , H01L2224/75824 , H01L2224/759 , H01L2224/80011 , H01L2224/80013 , H01L2224/80019 , H01L2224/8013 , H01L2224/80132 , H01L2224/80201 , H01L2224/80203 , H01L2224/80986 , H01L2224/94 , H01L2924/01322 , H01L2924/12042 , H01L2924/00012 , H01L2924/00014 , H01L2224/80 , H01L2924/00015 , H01L2224/80121 , H01L2924/00

摘要： Alignment systems, and wafer bonding alignment systems and methods are disclosed. In some embodiments, an alignment system for a wafer bonding system includes means for monitoring an alignment of a first wafer and a second wafer, and means for adjusting a position of the second wafer. The alignment system includes means for feeding back a relative position of the first wafer and the second wafer to the means for adjusting the position of the second wafer before and during a bonding process for the first wafer and the second wafer.

64.

发明申请
Methods and Devices for Fabricating and Assembling Printable Semiconductor Elements 有权
标题翻译：用于制造和组装可印刷半导体元件的方法和装置

公开(公告)号：US20160293794A1

公开(公告)日：2016-10-06

申请号：US15084211

申请日：2016-03-29

申请人： The Board of Trustees of the University of Illinois

发明人： Ralph G. NUZZO , John A. ROGERS , Etienne MENARD , Keon Jae LEE , Dahl-Young KHANG , Yugang SUN , Matthew MEITL , Zhengtao ZHU

IPC分类号： H01L33/00 , H01L25/075 , H01L33/32

CPC分类号： H01L29/76 , B81C2201/0185 , B82Y10/00 , H01L21/02521 , H01L21/02603 , H01L21/02628 , H01L21/308 , H01L21/322 , H01L21/6835 , H01L23/02 , H01L24/03 , H01L24/05 , H01L24/08 , H01L24/29 , H01L24/32 , H01L24/80 , H01L24/83 , H01L24/94 , H01L24/97 , H01L25/0753 , H01L27/1285 , H01L27/1292 , H01L29/04 , H01L29/06 , H01L29/0665 , H01L29/0673 , H01L29/0676 , H01L29/068 , H01L29/12 , H01L29/78603 , H01L29/78681 , H01L29/78696 , H01L31/0392 , H01L31/03926 , H01L31/1804 , H01L31/1864 , H01L31/1896 , H01L33/007 , H01L33/0079 , H01L33/32 , H01L2221/68368 , H01L2221/68381 , H01L2224/03 , H01L2224/0332 , H01L2224/0345 , H01L2224/03614 , H01L2224/0362 , H01L2224/05073 , H01L2224/05082 , H01L2224/05124 , H01L2224/05144 , H01L2224/05155 , H01L2224/05166 , H01L2224/05552 , H01L2224/05553 , H01L2224/05554 , H01L2224/05555 , H01L2224/05644 , H01L2224/05666 , H01L2224/08225 , H01L2224/2919 , H01L2224/32225 , H01L2224/80 , H01L2224/80006 , H01L2224/80121 , H01L2224/80862 , H01L2224/80895 , H01L2224/83 , H01L2224/83005 , H01L2224/83121 , H01L2224/83192 , H01L2224/83193 , H01L2224/8385 , H01L2224/83862 , H01L2224/9202 , H01L2224/94 , H01L2224/95 , H01L2224/97 , H01L2924/00012 , H01L2924/01032 , H01L2924/0665 , H01L2924/10253 , H01L2924/10329 , H01L2924/12032 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/12044 , H01L2924/1305 , H01L2924/1306 , H01L2924/13063 , H01L2924/13091 , H01L2924/14 , H01L2924/1461 , H01L2924/15159 , H01L2924/15162 , H01L2924/15788 , H01L2924/1579 , Y02E10/547 , Y02P70/521 , Y10S977/707 , Y10S977/724 , H01L2924/00014 , H01L2924/00

摘要： The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

摘要翻译： 本发明提供了用于制造可印刷半导体元件并将可印刷半导体元件组装到衬底表面上的方法和装置。本发明的方法，装置和装置部件能够在包含聚合物材料的基底上产生宽范围的灵活的电子和光电器件和器件阵列。本发明还提供了拉伸配置中能够具有良好性能的可拉伸半导体结构和可拉伸电子器件。

65.

发明申请
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE, AND POSITIONING JIG 有权
标题翻译：半导体器件，制造半导体器件的方法和定位JIG

公开(公告)号：US20150255444A1

公开(公告)日：2015-09-10

申请号：US14620184

申请日：2015-02-11

申请人： FUJI ELECTRIC CO., LTD.

发明人： Kenichiro SATO

IPC分类号： H01L25/18 , H01L21/67 , H01L23/00 , H01L25/00 , H01L23/495

CPC分类号： H01L25/18 , H01L21/67121 , H01L21/67259 , H01L23/49541 , H01L23/49579 , H01L24/05 , H01L24/09 , H01L24/37 , H01L24/40 , H01L24/48 , H01L24/49 , H01L24/77 , H01L24/84 , H01L24/85 , H01L25/072 , H01L25/50 , H01L2224/04042 , H01L2224/05554 , H01L2224/0603 , H01L2224/37011 , H01L2224/371 , H01L2224/37124 , H01L2224/37147 , H01L2224/37599 , H01L2224/40095 , H01L2224/40225 , H01L2224/40227 , H01L2224/45015 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/73221 , H01L2224/73271 , H01L2224/77272 , H01L2224/77702 , H01L2224/77705 , H01L2224/80121 , H01L2224/80136 , H01L2224/80815 , H01L2224/85121 , H01L2224/85136 , H01L2224/85801 , H01L2924/00014 , H01L2924/13055 , H01L2924/172 , H01L2924/17724 , H01L2924/17747 , H01L2224/45099 , H01L2224/05599 , H01L2924/00 , H01L2924/207

摘要： A semiconductor device has a plurality of small-sized semiconductor chips disposed between an insulated circuit board having a conductive pattern and a terminal. The semiconductor device exhibits a high accuracy in positioning the semiconductor chips. The semiconductor device includes an insulated circuit board having a conductive pattern, a first semiconductor chip with a rectangular shape connected to the conductive pattern through a first joining material, a second semiconductor chip with a rectangular shape, disposed on the conductive pattern separated from the first semiconductor chip and connected to the conductive pattern through a second joining material, and a terminal disposed above the first semiconductor chip and the second semiconductor chip, connected to the first semiconductor chip through a third joining material, and connected to the second semiconductor chip through a fourth joining material. The terminal has a through-hole above a place between the first semiconductor chip and the second semiconductor chip.

摘要翻译： 半导体器件具有设置在具有导电图案的绝缘电路板和端子之间的多个小尺寸半导体芯片。半导体器件在半导体芯片的定位方面表现出高精度。半导体器件包括具有导电图案的绝缘电路板，通过第一接合材料连接到导电图案的矩形形状的第一半导体芯片，具有矩形形状的第二半导体芯片，设置在与第一接合材料分离的导电图案上半导体芯片，并且通过第二接合材料连接到导电图案，以及设置在第一半导体芯片和第二半导体芯片上方的端子，通过第三接合材料连接到第一半导体芯片，并且通过第二接合材料连接到第二半导体芯片第四连接材料。端子在第一半导体芯片和第二半导体芯片之间的位置之上具有通孔。

66.

发明申请
Conductive Pad Structure for Hybrid Bonding and Methods of Forming Same 有权
标题翻译：用于混合键合的导电垫结构及其形成方法

公开(公告)号：US20150171050A1

公开(公告)日：2015-06-18

申请号：US14133328

申请日：2013-12-18

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

发明人： Sheng-Chau Chen , Shih Pei Chou , Yen-Chang Chu , Cheng-Hsien Chou , Chih-Hui Huang , Yeur-Luen Tu

IPC分类号： H01L23/00 , H01L27/146 , H01L21/48 , H01L21/324 , H01L21/02

CPC分类号： H01L24/08 , H01L21/31144 , H01L21/3212 , H01L21/324 , H01L24/02 , H01L24/03 , H01L24/05 , H01L24/80 , H01L25/0657 , H01L27/14634 , H01L27/1464 , H01L27/1469 , H01L2224/02321 , H01L2224/0235 , H01L2224/0345 , H01L2224/03452 , H01L2224/03462 , H01L2224/03614 , H01L2224/03845 , H01L2224/039 , H01L2224/05553 , H01L2224/05554 , H01L2224/05555 , H01L2224/05556 , H01L2224/05557 , H01L2224/05559 , H01L2224/05569 , H01L2224/05576 , H01L2224/05647 , H01L2224/05687 , H01L2224/08057 , H01L2224/08145 , H01L2224/08147 , H01L2224/80011 , H01L2224/80013 , H01L2224/80121 , H01L2224/80895 , H01L2224/80896 , H01L2224/80906 , H01L2224/80948 , H01L2225/06513 , H01L2225/06527 , H01L2225/06541 , H01L2924/05042 , H01L2924/05442 , H01L2924/059 , H01L2924/00014 , H01L2924/00012 , H01L2924/04642

摘要： A method embodiment includes patterning an opening through a layer at a surface of a device die. The method further includes forming a liner on sidewalls of the opening, patterning the device die to extend the opening further into the device die. After patterning the device die, the liner is removed. A conductive pad is formed in the device die by filling the opening with a conductive material.

摘要翻译： 一种方法实施例包括通过在器件裸片表面的层图案化开口。所述方法还包括在所述开口的侧壁上形成衬垫，使所述器件裸片图形化以将所述开口进一步延伸到所述器件裸片中。在将器件模具图案化之后，将衬垫移除。通过用导电材料填充开口，在器件裸片中形成导电焊盘。

67.

发明授权
Bonded processed semiconductor structures and carriers 有权
标题翻译：结合处理的半导体结构和载体

公开(公告)号：US09041214B2

公开(公告)日：2015-05-26

申请号：US13900157

申请日：2013-05-22

申请人： Soitec

发明人： Mariam Sadaka , Ionut Radu

IPC分类号： H01L23/52 , H01L21/20 , H01L21/683 , H01L21/768 , H01L23/538 , H01L23/00 , H01L25/00

CPC分类号： H01L21/76254 , H01L21/2007 , H01L21/6835 , H01L21/76898 , H01L23/5384 , H01L23/562 , H01L24/03 , H01L24/05 , H01L24/08 , H01L24/27 , H01L24/28 , H01L24/29 , H01L24/32 , H01L24/80 , H01L24/83 , H01L24/92 , H01L24/94 , H01L24/98 , H01L25/50 , H01L2221/68327 , H01L2221/68363 , H01L2221/68377 , H01L2221/68381 , H01L2224/03616 , H01L2224/0362 , H01L2224/0401 , H01L2224/04026 , H01L2224/05009 , H01L2224/056 , H01L2224/05647 , H01L2224/05687 , H01L2224/08121 , H01L2224/08146 , H01L2224/0903 , H01L2224/16145 , H01L2224/27444 , H01L2224/27616 , H01L2224/29187 , H01L2224/32145 , H01L2224/73204 , H01L2224/80 , H01L2224/80006 , H01L2224/80011 , H01L2224/80121 , H01L2224/802 , H01L2224/80203 , H01L2224/80357 , H01L2224/80805 , H01L2224/80895 , H01L2224/80896 , H01L2224/80905 , H01L2224/83 , H01L2224/83005 , H01L2224/83011 , H01L2224/83022 , H01L2224/83121 , H01L2224/83191 , H01L2224/83193 , H01L2224/832 , H01L2224/83203 , H01L2224/83205 , H01L2224/83805 , H01L2224/83896 , H01L2224/92 , H01L2224/9211 , H01L2224/94 , H01L2225/06513 , H01L2225/06541 , H01L2924/00 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01051 , H01L2924/01074 , H01L2924/01079 , H01L2924/01322 , H01L2924/05042 , H01L2924/05442 , H01L2924/10253 , H01L2924/12042 , H01L2924/1301 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2924/3512

摘要： Methods of fabricating semiconductor structures include implanting atom species into a carrier die or wafer to form a weakened region within the carrier die or wafer, and bonding the carrier die or wafer to a semiconductor structure. The semiconductor structure may be processed while using the carrier die or wafer to handle the semiconductor structure. The semiconductor structure may be bonded to another semiconductor structure, and the carrier die or wafer may be divided along the weakened region therein. Bonded semiconductor structures are fabricated using such methods.

摘要翻译： 制造半导体结构的方法包括将原子物质注入到载体晶粒或晶片中以在载体晶粒或晶片内形成弱化区域，并将载体晶片或晶片结合到半导体结构。可以在使用载体晶片或晶片来处理半导体结构的同时对半导体结构进行处理。半导体结构可以结合到另一个半导体结构，并且载体晶片或晶片可以沿其中的弱化区域分割。使用这种方法制造粘合的半导体结构。

68.

发明申请
Hybrid Bonding and Apparatus for Performing the Same 有权
标题翻译：混合键合及其执行装置

公开(公告)号：US20140256087A1

公开(公告)日：2014-09-11

申请号：US13787566

申请日：2013-03-06

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

发明人： Ping-Yin Liu , Xin-Hua Huang , Chih-Hui Huang , Lan-Lin Chao , Yeur-Luen Tu , Yan-Chih Lu , Jhy-Jyi Sze , Chia-Shiung Tsai

IPC分类号： H01L23/00

CPC分类号： H01L24/03 , H01L24/08 , H01L24/74 , H01L24/80 , H01L24/94 , H01L2224/08145 , H01L2224/74 , H01L2224/7501 , H01L2224/7525 , H01L2224/75251 , H01L2224/75252 , H01L2224/753 , H01L2224/757 , H01L2224/7598 , H01L2224/80011 , H01L2224/80013 , H01L2224/80065 , H01L2224/80075 , H01L2224/80121 , H01L2224/80204 , H01L2224/80209 , H01L2224/80895 , H01L2224/80896 , H01L2224/80907 , H01L2224/80948 , H01L2224/94 , H01L2924/01322 , H01L2924/00012 , H01L2224/80 , H01L2924/00

摘要： A method includes performing a hybrid bonding to bond a first package component to a second package component, so that a bonded pair is formed. In the bonded pair, first metal pads in the first package component are bonded to second metal pads in the second package component, and a first surface dielectric layer at a surface of the first package component is bonded to a second surface dielectric layer at a surface of the second package component. After the hybrid bonding, a thermal compressive annealing is performed on the bonded pair.

摘要翻译： 一种方法包括执行混合结合以将第一封装部件结合到第二封装部件，从而形成结合对。在结合对中，第一封装部件中的第一金属焊盘接合到第二封装部件中的第二金属焊盘，并且在第一封装部件的表面处的第一表面电介质层在表面的第二个包装组件。在混合键合之后，对结合对进行热压缩退火。