公开(公告)号：US09466559B2

公开(公告)日：2016-10-11

申请号：US13229887

申请日：2011-09-12

申请人： Hiromi Shigihara ,  Hiroshi Tsukamoto ,  Akira Yajima

发明人： Hiromi Shigihara ,  Hiroshi Tsukamoto ,  Akira Yajima

IPC分类号： H01L23/498 ,  H01L23/00 ,  H01L25/065 ,  H01L23/485 ,  H01L21/66

CPC分类号： H01L24/05 ,  H01L21/565 ,  H01L22/32 ,  H01L23/485 ,  H01L23/49816 ,  H01L24/06 ,  H01L24/12 ,  H01L24/16 ,  H01L24/45 ,  H01L24/46 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L24/81 ,  H01L24/85 ,  H01L25/0657 ,  H01L2224/02166 ,  H01L2224/02205 ,  H01L2224/0347 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05027 ,  H01L2224/05082 ,  H01L2224/05083 ,  H01L2224/05084 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05157 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05173 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05558 ,  H01L2224/05564 ,  H01L2224/05568 ,  H01L2224/05572 ,  H01L2224/05583 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/0568 ,  H01L2224/06183 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/29198 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/4502 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45164 ,  H01L2224/46 ,  H01L2224/4807 ,  H01L2224/48095 ,  H01L2224/48145 ,  H01L2224/48158 ,  H01L2224/48247 ,  H01L2224/48453 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48507 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48655 ,  H01L2224/48664 ,  H01L2224/4868 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/48755 ,  H01L2224/48764 ,  H01L2224/4878 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48855 ,  H01L2224/48864 ,  H01L2224/4888 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/85181 ,  H01L2224/85186 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2924/00011 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01061 ,  H01L2924/01065 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/078 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2924/01039 ,  H01L2924/0665 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/0002 ,  H01L2924/00015

摘要： In semiconductor integrated circuit devices for vehicle use, an aluminum pad on a semiconductor chip and an external device are coupled to each other by wire bonding using a gold wire for the convenience of mounting. Such a semiconductor integrated circuit device, however, causes a connection failure due to the interaction between aluminum and gold in use for a long time at a relatively high temperature (about 150 degrees C.). A semiconductor integrated circuit device can include a semiconductor chip as a part of the device, an electrolytic gold plated surface film (gold-based metal plated film) provided over an aluminum-based bonding pad on a semiconductor chip via a barrier metal film, and a gold bonding wire (gold-based bonding wire) for interconnection between the plated surface film and an external lead provided over a wiring board (wiring substrate).

摘要翻译： 在用于车辆用途的半导体集成电路器件中，半导体芯片上的铝焊盘和外部器件通过使用金线的引线接合彼此耦合以便于安装。 然而，这样的半导体集成电路器件在相对较高的温度（约150℃）下长时间使用铝和金之间的相互作用导致连接故障。 半导体集成电路器件可以包括作为器件的一部分的半导体芯片，经由阻挡金属膜设置在半导体芯片上的铝基焊盘上的电解镀金表面膜（金基金属镀膜），以及 用于在电镀表面膜和设置在布线板（布线基板）上的外部引线之间互连的金接合线（金基接合线）。

公开(公告)号：US20160035952A1

公开(公告)日：2016-02-04

申请号：US14884718

申请日：2015-10-15

申请人： Nichia Corporation

发明人： Motokazu YAMADA ,  Ryota Seno ,  Kazuhiro Kamada

IPC分类号： H01L33/60 ,  H01L33/00 ,  H01L33/50 ,  H01L33/48 ,  H01L33/62

CPC分类号： H01L33/60 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/005 ,  H01L33/483 ,  H01L33/486 ,  H01L33/50 ,  H01L33/52 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01063 ,  H01L2924/01065 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2933/005 ,  H01L2924/00 ,  H01L2924/2076 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A light emitting device (100) includes a base member (101), electrically conductive members (102a, 102b) disposed on the base member (101), a light emitting element (104) mounted on the electrically conductive members (102a, 102b), an insulating filler (114) covering at least a portion of surfaces of the electrically conductive members (102a, 102b) where the light emitting element (104) is not mounted, and a light transmissive member (108) covering the light emitting element (104).

公开(公告)号：US20150303155A1

公开(公告)日：2015-10-22

申请号：US14728675

申请日：2015-06-02

申请人： SHARP KABUSHIKI KAISHA

发明人： Takae SAKAI ,  Masahiro MURAKAMI ,  Masahiko KUSHINO ,  Yoshihisa AMANO ,  Shinichi TOKUNO

IPC分类号： H01L23/60 ,  H01L21/78 ,  H01L21/56

CPC分类号： H01L23/60 ,  H01L21/563 ,  H01L21/78 ,  H01L23/3121 ,  H01L23/552 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01065 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1421 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2224/81 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： In order to securely ground an exterior shield and reduce burden imposed on a dicing blade and the exterior shield, a method of producing a semiconductor module comprises a hole-forming step of forming a hole 30 extending from a top surface of a sealing resin layer 3 to a ground wiring 111 (112) provided at a collective substrate 100, a film-forming step of forming an electrically conductive film made of an electrically conductive material so as to cover at least the top surface of the sealing resin layer 3, an internal surface of the hole 20, and the ground wiring 111 (112), and a separation step of separating from each other a plurality of individual module sections which the individual module section comprises.

摘要翻译： 为了牢固地研磨外部屏蔽并降低施加在切割刀片和外部屏蔽上的负担，制造半导体模块的方法包括形成从密封树脂层3的顶表面延伸的孔30的孔形成步骤 设置在集合基板100上的接地布线111（112），成膜步骤，形成由导电材料制成的导电膜，以至少覆盖密封树脂层3的顶面，内部 孔20的表面和接地布线111（112），以及分离步骤，分离各个模块部分所包括的多个单独的模块部分。

公开(公告)号：US20140126167A1

公开(公告)日：2014-05-08

申请号：US13982427

申请日：2012-01-31

申请人： Payam Bozorgi ,  Noel C. MacDonald

发明人： Payam Bozorgi ,  Noel C. MacDonald

IPC分类号： B81C3/00 ,  H05K1/18 ,  B23K26/24

CPC分类号： B81C3/001 ,  B23K26/0622 ,  B23K26/206 ,  B23K26/24 ,  B23K26/32 ,  B23K2103/14 ,  B81C1/00269 ,  B81C2203/0118 ,  B81C2203/038 ,  H01L21/50 ,  H01L23/10 ,  H01L24/97 ,  H01L2924/01019 ,  H01L2924/01065 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/16315 ,  H05K1/18 ,  H01L2924/00

摘要： A new packaging method for a wide range of MEMS for application on both the wafer and device scale. Titanium is used as the packaging material and both silicon and titanium MEMS devices are integrated on to a titanium substrate. A Nd:YAG pulsed laser is used to micro-weld the titanium cap to the substrate. A three-dimensional time dependent model of heat flow during laser beam welding is presented. The heat transfer and parametric design capabilities of COMSOL were employed for this purpose. Model calculations are compared and calibrated with experimental results of pulsed laser welds. The functionality and hermiticity of the proposed packaging was evaluated by packaging a self actuated Veeco Instrument AFM cantilever tip. The experimental measurements show that the resonance frequency and quality factor of the device stay the same before and after packaging and the applied technique has no effect on the device.

摘要翻译： 一种适用于晶圆和器件规模应用的广泛MEMS的新型封装方法。 钛用作包装材料，硅和钛MEMS器件都集成在钛基板上。 使用Nd：YAG脉冲激光将钛盖微焊接到基板上。 提出了激光束焊接过程中热流三维时间依赖模型。 为此，采用COMSOL的传热和参数设计能力。 模型计算与脉冲激光焊接的实验结果进行比较和校准。 通过包装自动驱动的Veeco仪器AFM悬臂尖端来评估所提出的包装的功能和隐性。 实验测量结果表明，器件的共振频率和品质因数在包装前后保持不变，应用技术对设备无影响。

公开(公告)号：US08709293B2

公开(公告)日：2014-04-29

申请号：US11793175

申请日：2005-12-14

申请人： Takashi Kitae ,  Seiji Karashima ,  Koichi Hirano ,  Toshiyuki Kojima ,  Seiichi Nakatani ,  Shingo Komatsu ,  Yoshihisa Yamashita

发明人： Takashi Kitae ,  Seiji Karashima ,  Koichi Hirano ,  Toshiyuki Kojima ,  Seiichi Nakatani ,  Shingo Komatsu ,  Yoshihisa Yamashita

IPC分类号： H01B1/02

CPC分类号： H05K3/323 ,  H01L21/6835 ,  H01L23/49838 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/06131 ,  H01L2224/06135 ,  H01L2224/11001 ,  H01L2224/11003 ,  H01L2224/1141 ,  H01L2224/11502 ,  H01L2224/11522 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/16058 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/165 ,  H01L2224/2741 ,  H01L2224/27436 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29291 ,  H01L2224/293 ,  H01L2224/29311 ,  H01L2224/29313 ,  H01L2224/29316 ,  H01L2224/73204 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83097 ,  H01L2224/83192 ,  H01L2224/832 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/8388 ,  H01L2224/83886 ,  H01L2224/83887 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01061 ,  H01L2924/01065 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/381 ,  H01L2924/3841 ,  H05K3/3436 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/083 ,  H05K2203/087 ,  Y02P70/613 ,  H01L2924/00011 ,  H01L2924/066 ,  H01L2924/06 ,  H01L2924/0695 ,  H01L2924/062 ,  H01L2924/0615 ,  H01L2924/068 ,  H01L2924/0705 ,  H01L2924/0675 ,  H01L2924/07001 ,  H01L2924/0103 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01083 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2924/00014

摘要： There is provided a flip-chip mounting resin composition which can be used for a flip-chip mounting process that is high in productivity and reliability and thus can be applicable to a flip-chip mounting of a next-generation LSI. This flip-chip mounting resin composition comprises a resin, metal particles and a convection additive 12 that boils upon heating the resin 13. Upon the heating of the resin 13, the metal particles melt and the boiling convection additive 12 convects within the resin 13. This flip-chip mounting resin composition is supplied between a circuit substrate 10 and a semiconductor chip 20, and subsequently the resin 13 is heated so that the molten metal particles self-assemble into the region between each electrode of the circuit substrate and each electrode of the semiconductor chip. As a result, an electrical connection is formed between each electrode of the circuit substrate and each electrode of the semiconductor chip. Finally, the resin 13 is allowed to cure so that the semiconductor chip 20 is secured to the circuit substrate 10, which leads to in a formation of a flip chip assembly.

摘要翻译： 提供了一种倒装芯片安装树脂组合物，其可用于生产率和可靠性高的倒装芯片安装工艺，因此可以应用于下一代LSI的倒装芯片安装。 这种倒装芯片安装树脂组合物包括树脂，金属颗粒和在加热树脂13时沸腾的对流添加剂12.当加热树脂13时，金属颗粒熔化，沸腾对流添加剂12在树脂13内对流。 将该倒装芯片安装树脂组合物供给在电路基板10和半导体芯片20之间，随后加热树脂13，使得熔融金属颗粒自组装成电路基板的每个电极和电极的每个电极之间的区域 半导体芯片。 结果，在电路基板的每个电极和半导体芯片的每个电极之间形成电连接。 最后，使树脂13固化，使得半导体芯片20固定到电路基板10，这导致形成倒装芯片组件。

公开(公告)号：US20130037842A1

公开(公告)日：2013-02-14

申请号：US13577491

申请日：2011-01-28

申请人： Motokazu Yamada ,  Ryota Seno ,  Kazuhiro Kamada

发明人： Motokazu Yamada ,  Ryota Seno ,  Kazuhiro Kamada

IPC分类号： H01L33/60

CPC分类号： H01L33/60 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/005 ,  H01L33/483 ,  H01L33/486 ,  H01L33/50 ,  H01L33/52 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01063 ,  H01L2924/01065 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2933/005 ,  H01L2924/00 ,  H01L2924/2076 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A light emitting device (100) includes a base member (101), electrically conductive members (102a, 102b) disposed on the base member (101), a light emitting element (104) mounted on the electrically conductive members (102a, 102b), an insulating filler (114) covering at least a portion of surfaces of the electrically conductive members (102a, 102b) where the light emitting element (104) is not mounted, and a light transmissive member (108) covering the light emitting element (104).

摘要翻译： 发光装置（100）包括基座（101），设置在基座构件（101）上的导电构件（102a，102b），安装在导电构件（102a，102b）上的发光元件 ，覆盖未安装发光元件（104）的导电构件（102a，102b）的表面的至少一部分的绝缘填料（114）和覆盖发光元件的透光构件（108） 104）。

公开(公告)号：US08143080B2

公开(公告)日：2012-03-27

申请号：US12941077

申请日：2010-11-07

申请人： Shen-Bo Lin

发明人： Shen-Bo Lin

IPC分类号： H01L21/00

CPC分类号： H01L33/647 ,  H01L24/97 ,  H01L33/48 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01065 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2224/85

摘要： A method for manufacturing a number of LED packages includes following steps: providing an electrode plate and at least one insulating plate; thermally pressing the electrode plate and the at least insulating plate together, wherein the electrode has a plurality of first and second electrodes; grinding two ends of the electrode plate to expose the first and second electrodes for obtaining a substrate; disposing a plurality of LED chips on the substrate plate and electrically connecting the LED chips to the first and second electrodes; and cutting the substrate plate to obtain the number of LED packages.

摘要翻译： 制造多个LED封装的方法包括以下步骤：提供电极板和至少一个绝缘板; 将所述电极板和所述至少绝缘板热压在一起，其中所述电极具有多个第一和第二电极; 研磨电极板的两端以露出第一和第二电极以获得基底; 将多个LED芯片设置在所述基板上并将所述LED芯片电连接到所述第一和第二电极; 并切割基板以获得LED封装的数量。

公开(公告)号：US08110920B2

公开(公告)日：2012-02-07

申请号：US12455762

申请日：2009-06-05

申请人： Sriram Dattaguru ,  Lesley A. Polka Wood ,  Yoshihiro Tomita ,  Kinya Ichikawa ,  Robert L. Sankman

发明人： Sriram Dattaguru ,  Lesley A. Polka Wood ,  Yoshihiro Tomita ,  Kinya Ichikawa ,  Robert L. Sankman

IPC分类号： H01L23/34 ,  H05K1/16

CPC分类号： H01L25/0657 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/48 ,  H01L24/82 ,  H01L25/18 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/06517 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01065 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A mounting substrate for a processor includes a die side and a land side with a processor footprint configured on the die side. The processor footprint is coupled to at least one processor interconnect and a microelectronic die is embedded in the mounting substrate. The microelectronic die is coupled to the processor interconnect and communication between a processor to be installed on the processor footprint is in a rate between 10 Gb/s and 1 Tb/s.

摘要翻译： 用于处理器的安装基板包括裸片侧和在裸片侧配置有处理器占位面的平台侧。 处理器占用面积耦合到至少一个处理器互连，并且微电子管芯嵌入在安装衬底中。 微电子管芯耦合到处理器互连，并且待处理器占用的处理器之间的通信速率在10Gb / s至1Tb / s之间。

公开(公告)号：US08072772B2

公开(公告)日：2011-12-06

申请号：US11359814

申请日：2006-02-22

申请人： Arthur R. Zingher

发明人： Arthur R. Zingher

IPC分类号： H05K7/02 ,  H05K7/06 ,  H05K7/08 ,  H05K7/10

CPC分类号： H01L23/50 ,  H01L24/29 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/18 ,  H01L2224/29101 ,  H01L2224/32145 ,  H01L2224/73253 ,  H01L2225/06527 ,  H01L2225/06589 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01065 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/3512

摘要： An apparatus includes a two-dimensional array of single-chip modules (SCMs) and at least one component. A respective SCM in the array includes at least a semiconductor die that is configured to communicate data signals by capacitive coupling using one or more proximity connectors in a first set of proximity connectors. The first set of proximity connectors are coupled to the semiconductor die. A second set of proximity connectors is coupled to at least the one component. At least the one component is coupled to semiconductor dies in two or more SCMs using one or more proximity connectors in the second set of proximity connectors thereby enabling communication of the data signals by capacitive coupling.

摘要翻译： 一种装置包括单芯片模块（SCM）的二维阵列和至少一个组件。 阵列中的相应SCM包括至少半导体管芯，其被配置为通过使用第一组接近连接器中的一个或多个接近连接器的电容耦合来传送数据信号。 第一组接近连接器耦合到半导体管芯。 至少一个组件耦合第二组接近连接器。 至少一个组件使用第二组接近连接器中的一个或多个接近连接器在两个或更多个SCM中耦合到半导体管芯，从而能够通过电容耦合来传送数据信号。

公开(公告)号：US20100327419A1

公开(公告)日：2010-12-30

申请号：US12459226

申请日：2009-06-26

申请人： Sriram Muthukumar ,  Charles A. Gealer

发明人： Sriram Muthukumar ,  Charles A. Gealer

IPC分类号： H01L25/11 ,  H01L21/50

CPC分类号： H01L23/49816 ,  H01L23/3121 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/0557 ,  H01L2224/13025 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1052 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01065 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A stacked-chip apparatus includes a package substrate and an interposer with a chip stack disposed with a standoff that matches the interposer. A package-on-package stacked-chip apparatus includes a top package disposed on the interposer.

摘要翻译： 堆叠式芯片装置包括封装基板和具有布置成具有与插入件匹配的支架的芯片堆叠的插入器。 一种封装在一体的堆叠式芯片装置，包括设置在插入件上的顶部封装。