-
公开(公告)号：CN1093680C
公开(公告)日：2002-10-30
申请号：CN98123832.7
申请日：1998-11-04
申请人： 国际商业机器公司
发明人： 约翰·米切尔·考特 , 朱迪斯·玛列·罗尔丹 , 卡洛斯·朱安·桑普塞蒂 , 拉维·F·萨拉夫
CPC分类号： H01L24/12 , H01L23/49816 , H01L23/49883 , H01L24/11 , H01L24/83 , H01L2224/11822 , H01L2224/13099 , H01L2224/13311 , H01L2224/13411 , H01L2224/29111 , H01L2224/2919 , H01L2224/81011 , H01L2224/83193 , H01L2224/838 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/157 , H01L2924/15787 , H01L2924/15788 , H01L2924/1579 , H01L2924/19043 , H05K3/284 , H05K3/288 , H05K3/3436 , H05K3/3484 , H05K2201/035 , H05K2201/10977 , H05K2201/10992 , Y02P70/613 , Y10T29/49165 , Y10T428/12063 , Y10T428/12104 , Y10T428/12528 , Y10T428/12569 , Y10T428/12687 , Y10T428/12701 , Y10T428/12708 , Y10T428/12889 , Y10T428/31678 , H01L2924/00 , H01L2224/0401
摘要： 提供了一种含有溶剂、可开链聚合物和颗粒，用无氧化物金属层涂覆电极的浆料。电极可以是如C4凸点的互连接。对形成涂层和测试集成电路片的方法也进行了描述。本发明通过在含Pb电极上用Au涂覆以形成适于测试和连接的无氧化物表面，解决了集成电路片上被绝缘氧化物层覆盖的含Pb电极的连接问题。
-
公开(公告)号：CN105140136B
公开(公告)日：2018-02-13
申请号：CN201510438605.3
申请日：2010-03-11
申请人： 高通股份有限公司
IPC分类号： H01L21/56 , H01L21/60 , H01L23/31 , H01L23/48 , H01L23/522 , H01L25/065 , H01L25/18
CPC分类号： G06F1/16 , G11C5/147 , H01L21/563 , H01L23/3128 , H01L23/3171 , H01L23/3192 , H01L23/481 , H01L23/5223 , H01L23/5227 , H01L23/60 , H01L23/66 , H01L24/02 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/50 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/85 , H01L24/92 , H01L24/94 , H01L24/97 , H01L25/0657 , H01L25/16 , H01L25/18 , H01L25/50 , H01L2223/6611 , H01L2223/6666 , H01L2224/02166 , H01L2224/02311 , H01L2224/02313 , H01L2224/02321 , H01L2224/0233 , H01L2224/02331 , H01L2224/0235 , H01L2224/0237 , H01L2224/02371 , H01L2224/02375 , H01L2224/02381 , H01L2224/0239 , H01L2224/024 , H01L2224/0345 , H01L2224/03462 , H01L2224/03464 , H01L2224/03612 , H01L2224/03614 , H01L2224/03912 , H01L2224/0392 , H01L2224/0401 , H01L2224/04042 , H01L2224/05024 , H01L2224/05027 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05176 , H01L2224/05181 , H01L2224/05187 , H01L2224/05541 , H01L2224/05548 , H01L2224/05554 , H01L2224/0556 , H01L2224/05567 , H01L2224/05572 , H01L2224/056 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05669 , H01L2224/05673 , H01L2224/05676 , H01L2224/11 , H01L2224/11009 , H01L2224/1132 , H01L2224/11334 , H01L2224/11462 , H01L2224/11464 , H01L2224/1147 , H01L2224/11849 , H01L2224/119 , H01L2224/1191 , H01L2224/13 , H01L2224/13006 , H01L2224/1302 , H01L2224/13022 , H01L2224/13024 , H01L2224/13082 , H01L2224/13083 , H01L2224/13084 , H01L2224/13099 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13169 , H01L2224/13294 , H01L2224/133 , H01L2224/13311 , H01L2224/13609 , H01L2224/1403 , H01L2224/1411 , H01L2224/14181 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/16245 , H01L2224/16265 , H01L2224/17181 , H01L2224/2919 , H01L2224/2929 , H01L2224/29294 , H01L2224/293 , H01L2224/29339 , H01L2224/32105 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48111 , H01L2224/48145 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/48624 , H01L2224/48644 , H01L2224/48647 , H01L2224/48664 , H01L2224/48669 , H01L2224/48764 , H01L2224/48769 , H01L2224/48824 , H01L2224/48844 , H01L2224/48847 , H01L2224/48864 , H01L2224/4911 , H01L2224/49175 , H01L2224/4918 , H01L2224/73203 , H01L2224/73204 , H01L2224/73207 , H01L2224/73215 , H01L2224/73253 , H01L2224/73257 , H01L2224/73265 , H01L2224/81191 , H01L2224/81411 , H01L2224/81444 , H01L2224/81801 , H01L2224/81815 , H01L2224/8185 , H01L2224/81895 , H01L2224/81903 , H01L2224/83101 , H01L2224/83104 , H01L2224/83851 , H01L2224/92 , H01L2224/9202 , H01L2224/92125 , H01L2224/92127 , H01L2224/92147 , H01L2224/92225 , H01L2224/92247 , H01L2224/94 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06562 , H01L2225/06589 , H01L2225/1023 , H01L2225/1029 , H01L2225/1058 , H01L2225/107 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01059 , H01L2924/01068 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2924/1421 , H01L2924/1433 , H01L2924/15311 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19104 , H01L2924/19105 , H01L2924/30105 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2224/48869 , H01L2224/48744 , H01L2924/00012 , H01L2224/03 , H01L2224/0361 , H01L2924/0665 , H01L2224/81 , H01L2224/83 , H01L24/78 , H01L2224/85 , H01L21/56 , H01L21/78 , H01L2924/0635 , H01L2924/07025 , H01L21/304 , H01L21/76898 , H01L2224/0231
摘要： 本申请涉及使用顶部后钝化技术和底部结构技术的集成电路芯片。本发明揭示集成电路芯片和芯片封装，其包含所述集成电路芯片的顶部处的过钝化方案和所述集成电路芯片的底部处的底部方案，所述过钝化方案和底部方案使用顶部后钝化技术和底部结构技术。所述集成电路芯片可通过所述过钝化方案或所述底部方案连接到外部电路或结构，例如球栅格阵列(BGA)衬底、印刷电路板、半导体芯片、金属衬底、玻璃衬底或陶瓷衬底。还描述相关的制造技术。
-
公开(公告)号：CN104412724A
公开(公告)日：2015-03-11
申请号：CN201380033809.8
申请日：2013-02-21
申请人： 松下知识产权经营株式会社
CPC分类号： H05K1/097 , G02F1/1303 , G06K19/07718 , G06K19/07745 , H01L21/4853 , H01L23/145 , H01L23/4985 , H01L23/49855 , H01L23/49866 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/742 , H01L24/75 , H01L24/81 , H01L24/94 , H01L24/95 , H01L24/97 , H01L25/0652 , H01L2223/6677 , H01L2224/11312 , H01L2224/1132 , H01L2224/13008 , H01L2224/13016 , H01L2224/13019 , H01L2224/13025 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/1329 , H01L2224/13301 , H01L2224/13311 , H01L2224/13318 , H01L2224/13324 , H01L2224/13339 , H01L2224/13344 , H01L2224/13347 , H01L2224/13355 , H01L2224/13357 , H01L2224/1336 , H01L2224/13364 , H01L2224/13369 , H01L2224/1339 , H01L2224/1349 , H01L2224/13644 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/16238 , H01L2224/17106 , H01L2224/73204 , H01L2224/7526 , H01L2224/75262 , H01L2224/7565 , H01L2224/75651 , H01L2224/75702 , H01L2224/7598 , H01L2224/81127 , H01L2224/81191 , H01L2224/81193 , H01L2224/81203 , H01L2224/8159 , H01L2224/81601 , H01L2224/81611 , H01L2224/81618 , H01L2224/81624 , H01L2224/81639 , H01L2224/81644 , H01L2224/81647 , H01L2224/81655 , H01L2224/81657 , H01L2224/8166 , H01L2224/81664 , H01L2224/81669 , H01L2224/81815 , H01L2224/8184 , H01L2224/81871 , H01L2224/9202 , H01L2224/94 , H01L2224/95 , H01L2224/97 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06565 , H01L2924/12042 , H01L2924/19105 , H05K1/0274 , H05K1/0313 , H05K1/181 , H05K3/12 , H05K3/321 , H05K2201/0108 , H05K2201/10674 , H01L2924/00015 , H01L2924/00014 , H01L2924/00012 , H01L2924/01048 , H01L2224/81 , H01L2224/11 , H01L2924/00
摘要： 电子部件安装构造体包含基板；形成于基板表面上的、以Cu等高熔点金属为主体的导电性配线图案；将导电性配线图案的端子接合位置内包、搭载于所述基板表面的搭载位置上、具有外部端子的电子部件。外部端子在端子接合位置处以埋入到导电性配线图案的内部的状态与导电性配线图案相连接。因此，与仅在导电性配线图案的表面上将电子部件的外部端子与导电性配线图案连接的接合部相比，可以在强度更高的接合部处将外部端子与导电性配线图案连接。
-
公开(公告)号：CN103283008A
公开(公告)日：2013-09-04
申请号：CN201180059481.8
申请日：2011-09-26
申请人： 英闻萨斯有限公司
发明人： 基思·莱克·巴里 , 苏塞特·K·潘格尔 , 格兰特·维拉维森西奥 , 杰弗里·S·莱亚尔
IPC分类号： H01L21/60
CPC分类号： H01L24/83 , H01L23/293 , H01L23/3185 , H01L24/05 , H01L24/24 , H01L24/25 , H01L24/82 , H01L25/0657 , H01L2224/0345 , H01L2224/0346 , H01L2224/038 , H01L2224/0381 , H01L2224/0401 , H01L2224/05022 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05567 , H01L2224/05573 , H01L2224/05644 , H01L2224/05664 , H01L2224/1131 , H01L2224/11848 , H01L2224/13017 , H01L2224/1329 , H01L2224/133 , H01L2224/13311 , H01L2224/13313 , H01L2224/13347 , H01L2224/16145 , H01L2224/24051 , H01L2224/24105 , H01L2224/24146 , H01L2224/24226 , H01L2224/244 , H01L2224/245 , H01L2224/24992 , H01L2224/24997 , H01L2224/25175 , H01L2224/2919 , H01L2224/82009 , H01L2224/82039 , H01L2224/82101 , H01L2224/831 , H01L2225/06524 , H01L2225/06562 , H01L2924/00014 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/12042 , H01L2924/14 , H01L2924/0665 , H01L2924/00012 , H01L2224/05552 , H01L2924/00
摘要： 一种管芯具有位于互连边缘附近的互连面上的互连焊盘和具有被保形介质涂层覆盖的至少部分互连面，其中，介质涂层上的互连迹线与介质涂层的表面形成高界面角。因为迹线具有高界面角，减轻互连材料横向“渗出”的趋势且避免相邻迹线的接触或重叠。互连迹线包括可固化的导电互连材料，即包括可以以可流动方式施加的材料，然后被固化或被允许固化以形成导电迹线。而且，一种方法包括：在形成迹线之前，对保形介质涂层的表面进行CF4等离子体处理。
-
公开(公告)号：CN102379037A
公开(公告)日：2012-03-14
申请号：CN201080015041.8
申请日：2010-03-11
申请人： 米辑电子股份有限公司
IPC分类号： H01L23/522 , H01L21/56 , H01L23/31 , H01L23/48 , H01L23/00 , H01L25/065 , H01L25/18
CPC分类号： G06F1/16 , G11C5/147 , H01L21/563 , H01L23/3128 , H01L23/3171 , H01L23/3192 , H01L23/481 , H01L23/5223 , H01L23/5227 , H01L23/60 , H01L23/66 , H01L24/02 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/50 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/85 , H01L24/92 , H01L24/94 , H01L24/97 , H01L25/0657 , H01L25/16 , H01L25/18 , H01L25/50 , H01L2223/6611 , H01L2223/6666 , H01L2224/02166 , H01L2224/02311 , H01L2224/02313 , H01L2224/02321 , H01L2224/0233 , H01L2224/02331 , H01L2224/0235 , H01L2224/0237 , H01L2224/02371 , H01L2224/02375 , H01L2224/02381 , H01L2224/0239 , H01L2224/024 , H01L2224/0345 , H01L2224/03462 , H01L2224/03464 , H01L2224/03612 , H01L2224/03614 , H01L2224/03912 , H01L2224/0392 , H01L2224/0401 , H01L2224/04042 , H01L2224/05024 , H01L2224/05027 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05176 , H01L2224/05181 , H01L2224/05187 , H01L2224/05541 , H01L2224/05548 , H01L2224/05554 , H01L2224/0556 , H01L2224/05567 , H01L2224/05572 , H01L2224/056 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05669 , H01L2224/05673 , H01L2224/05676 , H01L2224/11 , H01L2224/11009 , H01L2224/1132 , H01L2224/11334 , H01L2224/11462 , H01L2224/11464 , H01L2224/1147 , H01L2224/11849 , H01L2224/119 , H01L2224/1191 , H01L2224/13 , H01L2224/13006 , H01L2224/1302 , H01L2224/13022 , H01L2224/13024 , H01L2224/13082 , H01L2224/13083 , H01L2224/13084 , H01L2224/13099 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13169 , H01L2224/13294 , H01L2224/133 , H01L2224/13311 , H01L2224/13609 , H01L2224/1403 , H01L2224/1411 , H01L2224/14181 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/16245 , H01L2224/16265 , H01L2224/17181 , H01L2224/2919 , H01L2224/2929 , H01L2224/29294 , H01L2224/293 , H01L2224/29339 , H01L2224/32105 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48111 , H01L2224/48145 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/48624 , H01L2224/48644 , H01L2224/48647 , H01L2224/48664 , H01L2224/48669 , H01L2224/48764 , H01L2224/48769 , H01L2224/48824 , H01L2224/48844 , H01L2224/48847 , H01L2224/48864 , H01L2224/4911 , H01L2224/49175 , H01L2224/4918 , H01L2224/73203 , H01L2224/73204 , H01L2224/73207 , H01L2224/73215 , H01L2224/73253 , H01L2224/73257 , H01L2224/73265 , H01L2224/81191 , H01L2224/81411 , H01L2224/81444 , H01L2224/81801 , H01L2224/81815 , H01L2224/8185 , H01L2224/81895 , H01L2224/81903 , H01L2224/83101 , H01L2224/83104 , H01L2224/83851 , H01L2224/92 , H01L2224/9202 , H01L2224/92125 , H01L2224/92127 , H01L2224/92147 , H01L2224/92225 , H01L2224/92247 , H01L2224/94 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06562 , H01L2225/06589 , H01L2225/1023 , H01L2225/1029 , H01L2225/1058 , H01L2225/107 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01059 , H01L2924/01068 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2924/1421 , H01L2924/1433 , H01L2924/15311 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19104 , H01L2924/19105 , H01L2924/30105 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2224/48869 , H01L2224/48744 , H01L2924/00012 , H01L2224/03 , H01L2224/0361 , H01L2924/0665 , H01L2224/81 , H01L2224/83 , H01L24/78 , H01L2224/85 , H01L21/56 , H01L21/78 , H01L2924/0635 , H01L2924/07025 , H01L21/304 , H01L21/76898 , H01L2224/0231
摘要： 本发明揭示集成电路芯片和芯片封装，其包含所述集成电路芯片的顶部处的过钝化方案和所述集成电路芯片的底部处的底部方案，所述过钝化方案和底部方案使用顶部后钝化技术和底部结构技术。所述集成电路芯片可通过所述过钝化方案或所述底部方案连接到外部电路或结构，例如球栅格阵列(BGA)衬底、印刷电路板、半导体芯片、金属衬底、玻璃衬底或陶瓷衬底。还描述相关的制造技术。
-
公开(公告)号：CN101208799A
公开(公告)日：2008-06-25
申请号：CN200680022890.X
申请日：2006-06-30
申请人： 英特尔公司
发明人： F·华
IPC分类号： H01L23/498 , H01L21/48
CPC分类号： H01L23/49816 , H01L21/4846 , H01L21/486 , H01L23/36 , H01L23/49827 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/0401 , H01L2224/05554 , H01L2224/05571 , H01L2224/05573 , H01L2224/05647 , H01L2224/1141 , H01L2224/11436 , H01L2224/1147 , H01L2224/1152 , H01L2224/11848 , H01L2224/11849 , H01L2224/13 , H01L2224/13099 , H01L2224/131 , H01L2224/13111 , H01L2224/13144 , H01L2224/13294 , H01L2224/133 , H01L2224/13311 , H01L2224/13316 , H01L2224/13339 , H01L2224/13344 , H01L2224/13347 , H01L2224/13411 , H01L2224/13416 , H01L2224/13439 , H01L2224/13444 , H01L2224/13447 , H01L2224/13499 , H01L2224/16227 , H01L2224/16235 , H01L2224/27436 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/81191 , H01L2224/81815 , H01L2224/83191 , H01L2224/8385 , H01L2224/9211 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12044 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/16152 , H01L2224/16225 , H01L2924/00 , H01L2924/00014 , H01L2924/00012 , H01L2924/0105 , H01L2224/11 , H01L2224/27 , H01L2224/81 , H01L2224/83
摘要： 纳米金属微粒成分包括具有大约50纳米或者更小的微粒大小的第一金属。导线互连与回流纳米焊料接触，并且具有与回流纳米焊料相同的金属或合金成分。还公开了采用回流纳米焊料成分的微电子封装。一种组装微电子封装的方法包括制备导线互连模板。计算系统包括与导线互连耦合的纳米焊料成分。
-
公开(公告)号：CN107454741A
公开(公告)日：2017-12-08
申请号：CN201710366152.7
申请日：2017-05-22
申请人： 松下知识产权经营株式会社
IPC分类号： H05K1/14 , H05K3/36 , C09J201/00 , C09J163/00 , C09J9/02 , H01B1/22
CPC分类号： H05K3/3468 , B23K1/0016 , B23K35/264 , C22C12/00 , C22C28/00 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/1329 , H01L2224/13309 , H01L2224/13311 , H01L2224/13313 , H01L2224/13318 , H01L2224/13339 , H01L2224/1339 , H01L2224/16227 , H01L2224/81815 , H01L2924/014 , H01L2924/20104 , H05K1/111 , H05K1/181 , H05K3/3478 , H05K2201/10234 , H05K2203/041 , C09J201/00 , C09J9/02 , C09J163/00 , H01B1/22 , H05K1/144 , H05K3/368 , H05K2201/0382
摘要： 本发明提供一种导电粒子、电路部件的连接材料、连接构造以及连接方法。导电粒子具有包含树脂材料的芯粒子、和覆盖芯粒子的表面且包含焊料的表层，焊料的熔点在树脂材料的软化点以下。
-
公开(公告)号：CN104553133B
公开(公告)日：2017-10-10
申请号：CN201410528116.2
申请日：2014-10-09
申请人： 纳普拉有限公司
发明人： 关根重信
CPC分类号： H01L24/05 , B22F1/0003 , B22F1/0062 , B22F1/025 , B22F7/064 , B22F2999/00 , B23K35/025 , B23K35/262 , B23K35/302 , H01B1/02 , H01B1/16 , H01B1/22 , H01L23/481 , H01L23/49827 , H01L23/49866 , H01L23/53233 , H01L24/29 , H01L24/32 , H01L2224/04026 , H01L2224/04073 , H01L2224/05647 , H01L2224/13147 , H01L2224/13294 , H01L2224/13311 , H01L2224/13313 , H01L2224/13347 , H01L2224/13411 , H01L2224/13447 , H01L2224/1349 , H01L2224/29294 , H01L2224/29311 , H01L2224/29313 , H01L2224/29347 , H01L2224/29411 , H01L2224/29447 , H01L2224/2949 , H01L2224/32507 , H01L2224/81447 , H01L2224/83447 , H01L2225/06544 , H01L2924/01005 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01029 , H01L2924/0103 , H01L2924/01031 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01083 , H01L2924/13091 , H01L2924/3656 , H01L2924/00014 , H01L2924/00 , B22F2301/10 , B22F2301/255 , B22F2301/30 , B22F2301/205
摘要： 本发明提供一种不会产生空隙、裂纹等的高品质、高可靠度的电极接合部和电配线。将2个导体接合的接合部含有选自Si、B、Ti、Al、Ag、Bi、In、Sb、Ga的组中的至少一种、Cu和Sn，在其与导体之间形成有纳米复合结构的金属扩散区域。
-
公开(公告)号：CN105140136A
公开(公告)日：2015-12-09
申请号：CN201510438605.3
申请日：2010-03-11
申请人： 高通股份有限公司
IPC分类号： H01L21/56 , H01L21/60 , H01L23/31 , H01L23/48 , H01L23/522 , H01L25/065 , H01L25/18
CPC分类号： G06F1/16 , G11C5/147 , H01L21/563 , H01L23/3128 , H01L23/3171 , H01L23/3192 , H01L23/481 , H01L23/5223 , H01L23/5227 , H01L23/60 , H01L23/66 , H01L24/02 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/50 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/85 , H01L24/92 , H01L24/94 , H01L24/97 , H01L25/0657 , H01L25/16 , H01L25/18 , H01L25/50 , H01L2223/6611 , H01L2223/6666 , H01L2224/02166 , H01L2224/02311 , H01L2224/02313 , H01L2224/02321 , H01L2224/0233 , H01L2224/02331 , H01L2224/0235 , H01L2224/0237 , H01L2224/02371 , H01L2224/02375 , H01L2224/02381 , H01L2224/0239 , H01L2224/024 , H01L2224/0345 , H01L2224/03462 , H01L2224/03464 , H01L2224/03612 , H01L2224/03614 , H01L2224/03912 , H01L2224/0392 , H01L2224/0401 , H01L2224/04042 , H01L2224/05024 , H01L2224/05027 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05176 , H01L2224/05181 , H01L2224/05187 , H01L2224/05541 , H01L2224/05548 , H01L2224/05554 , H01L2224/0556 , H01L2224/05567 , H01L2224/05572 , H01L2224/056 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05669 , H01L2224/05673 , H01L2224/05676 , H01L2224/11 , H01L2224/11009 , H01L2224/1132 , H01L2224/11334 , H01L2224/11462 , H01L2224/11464 , H01L2224/1147 , H01L2224/11849 , H01L2224/119 , H01L2224/1191 , H01L2224/13 , H01L2224/13006 , H01L2224/1302 , H01L2224/13022 , H01L2224/13024 , H01L2224/13082 , H01L2224/13083 , H01L2224/13084 , H01L2224/13099 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13169 , H01L2224/13294 , H01L2224/133 , H01L2224/13311 , H01L2224/13609 , H01L2224/1403 , H01L2224/1411 , H01L2224/14181 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/16245 , H01L2224/16265 , H01L2224/17181 , H01L2224/2919 , H01L2224/2929 , H01L2224/29294 , H01L2224/293 , H01L2224/29339 , H01L2224/32105 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48111 , H01L2224/48145 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/48624 , H01L2224/48644 , H01L2224/48647 , H01L2224/48664 , H01L2224/48669 , H01L2224/48764 , H01L2224/48769 , H01L2224/48824 , H01L2224/48844 , H01L2224/48847 , H01L2224/48864 , H01L2224/4911 , H01L2224/49175 , H01L2224/4918 , H01L2224/73203 , H01L2224/73204 , H01L2224/73207 , H01L2224/73215 , H01L2224/73253 , H01L2224/73257 , H01L2224/73265 , H01L2224/81191 , H01L2224/81411 , H01L2224/81444 , H01L2224/81801 , H01L2224/81815 , H01L2224/8185 , H01L2224/81895 , H01L2224/81903 , H01L2224/83101 , H01L2224/83104 , H01L2224/83851 , H01L2224/92 , H01L2224/9202 , H01L2224/92125 , H01L2224/92127 , H01L2224/92147 , H01L2224/92225 , H01L2224/92247 , H01L2224/94 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06562 , H01L2225/06589 , H01L2225/1023 , H01L2225/1029 , H01L2225/1058 , H01L2225/107 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01059 , H01L2924/01068 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2924/1421 , H01L2924/1433 , H01L2924/15311 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19104 , H01L2924/19105 , H01L2924/30105 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2224/48869 , H01L2224/48744 , H01L2924/00012 , H01L2224/03 , H01L2224/0361 , H01L2924/0665 , H01L2224/81 , H01L2224/83 , H01L24/78 , H01L2224/85 , H01L21/56 , H01L21/78 , H01L2924/0635 , H01L2924/07025 , H01L21/304 , H01L21/76898 , H01L2224/0231 , H01L24/10
摘要： 本申请涉及使用顶部后钝化技术和底部结构技术的集成电路芯片。本发明揭示集成电路芯片和芯片封装，其包含所述集成电路芯片的顶部处的过钝化方案和所述集成电路芯片的底部处的底部方案，所述过钝化方案和底部方案使用顶部后钝化技术和底部结构技术。所述集成电路芯片可通过所述过钝化方案或所述底部方案连接到外部电路或结构，例如球栅格阵列(BGA)衬底、印刷电路板、半导体芯片、金属衬底、玻璃衬底或陶瓷衬底。还描述相关的制造技术。
-
公开(公告)号：CN102379037B
公开(公告)日：2015-08-19
申请号：CN201080015041.8
申请日：2010-03-11
申请人： 高通股份有限公司
IPC分类号： H01L23/522 , H01L21/56 , H01L23/31 , H01L23/48 , H01L23/00 , H01L25/065 , H01L25/18
CPC分类号： G06F1/16 , G11C5/147 , H01L21/563 , H01L23/3128 , H01L23/3171 , H01L23/3192 , H01L23/481 , H01L23/5223 , H01L23/5227 , H01L23/60 , H01L23/66 , H01L24/02 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/50 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/85 , H01L24/92 , H01L24/94 , H01L24/97 , H01L25/0657 , H01L25/16 , H01L25/18 , H01L25/50 , H01L2223/6611 , H01L2223/6666 , H01L2224/02166 , H01L2224/02311 , H01L2224/02313 , H01L2224/02321 , H01L2224/0233 , H01L2224/02331 , H01L2224/0235 , H01L2224/0237 , H01L2224/02371 , H01L2224/02375 , H01L2224/02381 , H01L2224/0239 , H01L2224/024 , H01L2224/0345 , H01L2224/03462 , H01L2224/03464 , H01L2224/03612 , H01L2224/03614 , H01L2224/03912 , H01L2224/0392 , H01L2224/0401 , H01L2224/04042 , H01L2224/05024 , H01L2224/05027 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05176 , H01L2224/05181 , H01L2224/05187 , H01L2224/05541 , H01L2224/05548 , H01L2224/05554 , H01L2224/0556 , H01L2224/05567 , H01L2224/05572 , H01L2224/056 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05669 , H01L2224/05673 , H01L2224/05676 , H01L2224/11 , H01L2224/11009 , H01L2224/1132 , H01L2224/11334 , H01L2224/11462 , H01L2224/11464 , H01L2224/1147 , H01L2224/11849 , H01L2224/119 , H01L2224/1191 , H01L2224/13 , H01L2224/13006 , H01L2224/1302 , H01L2224/13022 , H01L2224/13024 , H01L2224/13082 , H01L2224/13083 , H01L2224/13084 , H01L2224/13099 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13169 , H01L2224/13294 , H01L2224/133 , H01L2224/13311 , H01L2224/13609 , H01L2224/1403 , H01L2224/1411 , H01L2224/14181 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/16245 , H01L2224/16265 , H01L2224/17181 , H01L2224/2919 , H01L2224/2929 , H01L2224/29294 , H01L2224/293 , H01L2224/29339 , H01L2224/32105 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48111 , H01L2224/48145 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/48624 , H01L2224/48644 , H01L2224/48647 , H01L2224/48664 , H01L2224/48669 , H01L2224/48764 , H01L2224/48769 , H01L2224/48824 , H01L2224/48844 , H01L2224/48847 , H01L2224/48864 , H01L2224/4911 , H01L2224/49175 , H01L2224/4918 , H01L2224/73203 , H01L2224/73204 , H01L2224/73207 , H01L2224/73215 , H01L2224/73253 , H01L2224/73257 , H01L2224/73265 , H01L2224/81191 , H01L2224/81411 , H01L2224/81444 , H01L2224/81801 , H01L2224/81815 , H01L2224/8185 , H01L2224/81895 , H01L2224/81903 , H01L2224/83101 , H01L2224/83104 , H01L2224/83851 , H01L2224/92 , H01L2224/9202 , H01L2224/92125 , H01L2224/92127 , H01L2224/92147 , H01L2224/92225 , H01L2224/92247 , H01L2224/94 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06562 , H01L2225/06589 , H01L2225/1023 , H01L2225/1029 , H01L2225/1058 , H01L2225/107 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01059 , H01L2924/01068 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2924/1421 , H01L2924/1433 , H01L2924/15311 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19104 , H01L2924/19105 , H01L2924/30105 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2224/48869 , H01L2224/48744 , H01L2924/00012 , H01L2224/03 , H01L2224/0361 , H01L2924/0665 , H01L2224/81 , H01L2224/83 , H01L24/78 , H01L2224/85 , H01L21/56 , H01L21/78 , H01L2924/0635 , H01L2924/07025 , H01L21/304 , H01L21/76898 , H01L2224/0231
摘要： 本发明揭示集成电路芯片和芯片封装，其包含所述集成电路芯片的顶部处的过钝化方案和所述集成电路芯片的底部处的底部方案，所述过钝化方案和底部方案使用顶部后钝化技术和底部结构技术。所述集成电路芯片可通过所述过钝化方案或所述底部方案连接到外部电路或结构，例如球栅格阵列(BGA)衬底、印刷电路板、半导体芯片、金属衬底、玻璃衬底或陶瓷衬底。还描述相关的制造技术。
-
-
-
-
-
-
-
-
-
搜索结果
24 条记录 (耗时 0.021 秒)
