公开(公告)号：US20050127486A1

公开(公告)日：2005-06-16

申请号：US10992032

申请日：2004-11-18

申请人： Salman Akram ,  Alan Wood

发明人： Salman Akram ,  Alan Wood

IPC分类号： H01L21/60 ,  H01L23/31 ,  H01L29/76 ,  H01L23/02 ,  H01L29/94 ,  H01L31/062 ,  H01L31/113 ,  H01L31/119

CPC分类号： H01L24/12 ,  H01L23/3114 ,  H01L24/06 ,  H01L24/11 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/13099 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/00

摘要： A carrier for use in a chip-scale package includes a film with at least one aperture defined therethrough. The aperture, which is alignable with a corresponding bond pad of a semiconductor device over which the carrier is to be positioned, is at least partially filled with conductive material. A contact on a surface of the carrier may communicate with the conductive material within the aperture. A conductive bump may be disposed adjacent the contact. The carrier may be positioned on a semiconductor device to form a chip-scale package. Such a chip-scale package may include a semiconductor device invertedly disposed over the carrier with bond pads of the semiconductor device being substantially aligned with apertures of the carrier.

摘要翻译： 用于芯片级封装的载体包括具有限定在其中的至少一个孔的膜。 可与导电材料至少部分地填充有半导体器件的相应接合焊盘对准的载体，所述接合焊盘至少部分地被导电材料填充。 载体表面上的接触件可与孔内的导电材料连通。 导电凸块可以设置在接触件附近。 载体可以位于半导体器件上以形成芯片级封装。 这种芯片级封装可以包括反向设置在载体上的半导体器件，半导体器件的接合焊盘与载体的孔基本上对准。

公开(公告)号：US06892210B1

公开(公告)日：2005-05-10

申请号：US10039641

申请日：2001-12-31

申请人： Jason Erickson ,  Alan Wood ,  Doug Dropeskey

发明人： Jason Erickson ,  Alan Wood ,  Doug Dropeskey

IPC分类号： G06F17/30

CPC分类号： G06F17/30575 ,  Y10S707/99938 ,  Y10S707/99952 ,  Y10S707/99953

摘要： A database management and synchronization program implemented across a peer-to-peer computer network, consisting of a sharing community of user computers. Database record synchronization throughout the sharing community is accomplished by using a synchronization object which contains the information about a change in a specific record or the addition of a new record. The synchronization object is transmitted by a local user computer at any time to a routing agent, which in turn transmits the synchronization object at any time to remote user computers within the sharing community. The synchronization object is then used by the remote user computer to update their database records.

摘要翻译： 通过对等计算机网络实现的数据库管理和同步程序，由用户计算机的共享社区组成。 整个共享社区中的数据库记录同步通过使用包含有关特定记录中的更改信息或添加新记录的信息的同步对象来实现。 同步对象由本地用户计算机随时发送到路由代理，路由代理随时将同步对象发送到共享社区内的远程用户计算机。 然后，远程用户计算机使用同步对象来更新其数据库记录。

公开(公告)号：US20050029650A1

公开(公告)日：2005-02-10

申请号：US10933144

申请日：2004-09-02

申请人： Alan Wood ,  Trung Tri Doan

发明人： Alan Wood ,  Trung Tri Doan

IPC分类号： H01L23/48 ,  H01L25/065 ,  H01L21/44 ,  H01L23/02

CPC分类号： H01L23/3114 ,  H01L21/76831 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/11 ,  H01L24/13 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05172 ,  H01L2224/0557 ,  H01L2224/05572 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2225/06541 ,  H01L2225/06586 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  Y10S438/977 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05681 ,  H01L2224/05684 ,  H01L2224/05111 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05184

摘要： A semiconductor component includes back side pin contacts fabricated using a circuit side fabrication method. The component also includes a thinned semiconductor die having a pattern of die contacts, and conductive members formed by filled openings in the die contacts and the die. In addition, the pin contacts are formed by terminal portions of the conductive members. The fabrication method includes the steps of forming the openings and the conductive members, and then thinning and etching the die to form the pin contacts. An alternate embodiment female component includes female conductive members configured to physically and electrically engage pin contacts on a mating component of a stacked assembly.

摘要翻译： 半导体部件包括使用电路侧制造方法制造的后侧引脚触点。 该部件还包括具有模接触图案的薄化半导体管芯，以及由管芯接触件和管芯中的填充开口形成的导电部件。 此外，引脚触点由导电构件的端子部分形成。 制造方法包括形成开口和导电构件的步骤，然后使模具变薄和蚀刻以形成引脚触点。 替代实施例的阴部件包括阴导电部件，其被配置为物理地和电接合堆叠组件的配合部件上的销触点。

公开(公告)号：US5634267A

公开(公告)日：1997-06-03

申请号：US338345

申请日：1994-11-14

申请人： Warren Farnworth ,  Alan Wood

发明人： Warren Farnworth ,  Alan Wood

IPC分类号： G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  H01L21/60 ,  H01L21/66 ,  H01L21/68 ,  H01L23/13 ,  H01L23/498 ,  H05K3/00 ,  H05K3/40 ,  H05K3/42 ,  H05K3/34

CPC分类号： G01R1/0466 ,  G01R1/0483 ,  G01R31/2893 ,  H01L21/6835 ,  H01L22/20 ,  H01L23/13 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/80 ,  H01L24/85 ,  H05K3/4007 ,  G01R1/06761 ,  G01R3/00 ,  G01R31/2831 ,  G01R31/2863 ,  H01L2224/16145 ,  H01L2224/48091 ,  H01L2224/48463 ,  H01L2224/85001 ,  H01L2224/85205 ,  H01L2225/06562 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15174 ,  H01L2924/30105 ,  H05K2201/0133 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/0307 ,  H05K2203/0723 ,  H05K3/0058 ,  H05K3/0067 ,  H05K3/423 ,  Y10T29/4913 ,  Y10T29/49144

摘要： A method and apparatus for fabricating known good semiconductor dice are provided. The method includes the steps of: testing the gross functionality of dice contained on a semiconductor wafer; sawing the wafer to singulate a die; and then testing the die by assembly in a carrier having an interconnect adapted to establish electrical communication between the bond pads on the die and external test circuitry. The interconnect for the carrier can be formed using different contact technologies including: thick film contact members on a rigid substrate; self-limiting contact members on a silicon substrate; or microbump contact members with a textured surface. During assembly of the carrier, the die and interconnect are optically aligned and placed into contact with a predetermined contact force. This establishes an electrical connection between the contact members on the interconnect and the bond pads of the die. In the assembled carrier the die and interconnect are biased together by a force distribution mechanism that includes a bridge clamp, a pressure plate and a spring clip. Following testing of the die, the carrier is disassembled and the tested die is removed.

摘要翻译： 提供了一种用于制造已知的良好半导体晶片的方法和装置。 该方法包括以下步骤：测试包含在半导体晶片上的骰子的总功能; 锯切晶片以切割模具; 然后通过组装在具有适于建立管芯上的接合焊盘与外部测试电路之间的电连通的互连的载体中来测试管芯。 用于载体的互连可以使用不同的接触技术形成，包括：刚性基板上的厚膜接触构件; 硅衬底上的自限制接触构件; 或具有纹理表面的微型块接触构件。 在载体的组装期间，芯片和互连件被光学对准并且被放置成与预定的接触力接触。 这就建立了互连上的接触构件和管芯的接合垫之间的电连接。 在组装的载体中，管芯和互连件通过包括桥夹，压板和弹簧夹的力分配机构偏压在一起。 在对模具进行测试之后，拆下载体并且移除被测试的模具。

公开(公告)号：US20080020505A1

公开(公告)日：2008-01-24

申请号：US11863087

申请日：2007-09-27

申请人： Salman Akram ,  Charles Watkins ,  Kyle Kirby ,  Alan Wood ,  Wiliam Hiatt

发明人： Salman Akram ,  Charles Watkins ,  Kyle Kirby ,  Alan Wood ,  Wiliam Hiatt

IPC分类号： H01L21/00

CPC分类号： H01L27/146 ,  H01L21/76898 ,  H01L27/14618 ,  H01L27/148 ,  H01L31/02016 ,  H01L2224/48227 ,  H01L2924/01046 ,  H01L2924/01066 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/00

摘要： Microelectronic imagers, methods for packaging microelectronic imagers, and methods for forming electrically conductive through-wafer interconnects in microelectronic imagers are disclosed herein. In one embodiment, a microelectronic imaging die can include a microelectronic substrate, an integrated circuit, and an image sensor electrically coupled to the integrated circuit. A bond-pad is carried by the substrate and electrically coupled to the integrated circuit. An electrically conductive through-wafer interconnect extends through the substrate and is in contact with the bond-pad. The interconnect can include a passage extending completely through the substrate and the bond-pad, a dielectric liner deposited into the passage and in contact with the substrate, first and second conductive layers deposited onto at least a portion of the dielectric liner, and a conductive fill material deposited into the passage over at least a portion of the second conductive layer and electrically coupled to the bond-pad.

摘要翻译： 本文公开了微电子成像器，用于封装微电子成像器的方法，以及用于在微电子成像器中形成导电晶片间互连的方法。 在一个实施例中，微电子成像管芯可以包括微电子衬底，集成电路和电耦合到集成电路的图像传感器。 接合焊盘由衬底承载并电耦合到集成电路。 导电晶片互连延伸穿过衬底并与接合焊盘接触。 互连可以包括完全延伸穿过衬底和接合焊盘的通道，沉积到通道中并与衬底接触的电介质衬垫，沉积在电介质衬垫的至少一部分上的第一和第二导电层以及导电 在第二导电层的至少一部分上沉积到通道中并且电耦合到接合焊盘的填充材料。

公开(公告)号：US20070246819A1

公开(公告)日：2007-10-25

申请号：US11409638

申请日：2006-04-24

申请人： David Hembree ,  Alan Wood

发明人： David Hembree ,  Alan Wood

IPC分类号： H01L23/04

CPC分类号： H01L24/16 ,  G01R1/06716 ,  G01R1/07307 ,  H01L21/486 ,  H01L21/565 ,  H01L21/568 ,  H01L21/76877 ,  H01L21/76885 ,  H01L21/76898 ,  H01L23/481 ,  H01L23/49827 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/81 ,  H01L24/85 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/02125 ,  H01L2224/0233 ,  H01L2224/02333 ,  H01L2224/02335 ,  H01L2224/02372 ,  H01L2224/02373 ,  H01L2224/02375 ,  H01L2224/0333 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05548 ,  H01L2224/05552 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/05567 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/06181 ,  H01L2224/1134 ,  H01L2224/13009 ,  H01L2224/13024 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/16146 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45116 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45655 ,  H01L2224/45684 ,  H01L2224/45698 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48145 ,  H01L2224/48455 ,  H01L2224/48463 ,  H01L2224/4847 ,  H01L2224/48471 ,  H01L2224/48475 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/48724 ,  H01L2224/48747 ,  H01L2224/48824 ,  H01L2224/48847 ,  H01L2224/4899 ,  H01L2224/48992 ,  H01L2224/78301 ,  H01L2224/85051 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85951 ,  H01L2225/06506 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/10155 ,  H01L2924/10161 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45164 ,  H01L2924/013 ,  H01L2924/00013

摘要： A semiconductor component includes a semiconductor substrate having a substrate contact, and a through wire interconnect (TWI) attached to the substrate contact. The through wire interconnect provides a multi level interconnect having contacts on opposing first and second sides of the semiconductor substrate. The through wire interconnect (TWI) includes a via through the substrate contact and the substrate, a wire in the via having a bonded connection with the substrate contact, a first contact on the wire proximate to the first side, and a second contact on the wire proximate to the second side. The through wire interconnect (TWI) also includes a polymer layer which partially encapsulates the through wire interconnect (TWI) while leaving the first contact exposed. The semiconductor component can be used to fabricate stacked-systems, module systems and test systems. A method for fabricating the semiconductor component can include a film assisted molding process for forming the polymer layer.

摘要翻译： 半导体部件包括具有衬底接触的半导体衬底和附着到衬底触点的通线互连（TWI）。 通线互连提供了在半导体衬底的相对的第一和第二侧上具有触点的多电平互连。 通线互连（TWI）包括穿过基板触点和基板的通孔，通孔中的导线与基板接触具有接合连接，接近第一侧的导线上的第一触点和第二触点 电线靠近第二侧。 通线互连（TWI）还包括聚合物层，其部分地封装通孔互连（TWI），同时使第一触点暴露。 半导体组件可用于制造堆叠系统，模块系统和测试系统。 制造半导体部件的方法可以包括用于形成聚合物层的膜辅助成型工艺。

公开(公告)号：US20070132104A1

公开(公告)日：2007-06-14

申请号：US11701927

申请日：2007-02-02

申请人： Warren Farnworth ,  Alan Wood ,  William Hiatt ,  James Wark ,  David Hembree ,  Kyle Kirby ,  Pete Benson

发明人： Warren Farnworth ,  Alan Wood ,  William Hiatt ,  James Wark ,  David Hembree ,  Kyle Kirby ,  Pete Benson

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L21/561 ,  B33Y70/00 ,  B33Y80/00 ,  H01L21/563 ,  H01L21/76898 ,  H01L23/3114 ,  H01L23/481 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68331 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05111 ,  H01L2224/05118 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05171 ,  H01L2224/05178 ,  H01L2224/0518 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/05559 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/13005 ,  H01L2224/13006 ,  H01L2224/13009 ,  H01L2224/13024 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06582 ,  H01L2225/06596 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/18161 ,  H01L2924/19015 ,  H01L2924/19041 ,  H01L2924/351 ,  H01L2924/207 ,  H01L2224/05552 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/013

摘要： A semiconductor component includes a base die and a secondary die stacked on and bonded to the base die. The base die includes conductive vias which form an internal signal transmission system for the component, and allow the circuit side of the secondary die to be bonded to the back side of the base die. The component also includes an array of terminal contacts on the circuit side of the base die in electrical communication with the conductive vias. The component can also include an encapsulant on the back side of the base die, which substantially encapsulates the secondary die, and a polymer layer on the circuit side of the base die which functions as a protective layer, a rigidifying member and a stencil for forming the terminal contacts. A method for fabricating the component includes the step of bonding singulated secondary dice to base dice on a base wafer, or bonding a secondary wafer to the base wafer, or bonding singulated secondary dice to singulated base dice.

摘要翻译： 半导体部件包括基模和层叠在基模上的二次模。 基模具包括形成用于部件的内部信号传输系统的导电通孔，并允许二次管芯的电路侧接合到基座的后侧。 该组件还包括与导电通孔电连通的基座芯片的电路侧上的端子触点阵列。 该组件还可以包括在基模的背侧上的密封剂，其基本上封装次模，以及在用作保护层的基模的电路侧上的聚合物层，用于形成的用于固化的模板 终端接触。 一种用于制造该部件的方法包括将单个二次骰子接合到基底晶片上的基底骰子上，或将次晶片接合到基底晶片，或将单个二次骰子接合到单个基体骰子的步骤。

公开(公告)号：US20070103180A1

公开(公告)日：2007-05-10

申请号：US11588707

申请日：2006-10-27

申请人： Alan Wood ,  Tim Corbett

发明人： Alan Wood ,  Tim Corbett

IPC分类号： G01R31/02

CPC分类号： H01L24/80 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/0491 ,  G01R1/0735 ,  G01R3/00 ,  G01R31/2831 ,  G01R31/2855 ,  G01R31/2863 ,  G01R31/2867 ,  G01R31/2886 ,  G01R31/2889 ,  G01R31/2893 ,  H01L22/20 ,  H01L22/22 ,  H01L23/13 ,  H01L2224/16145 ,  H01L2225/06562 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15151 ,  H05K3/0058 ,  H05K3/0067 ,  H05K3/4007 ,  H05K3/423 ,  H05K2201/0133 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/0307 ,  H05K2203/0723

摘要： A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consisting of two halves. The first half of the test fixture is a wafer cavity plate for receiving the wafer, and the second half establishes electrical communication between the wafer and electrical testing equipment. A rigid substrate has conductors thereon which establish electrical contact with the wafer. The test fixture need not be opened until the burn-in and electrical testing are completed. After burn-in stress and electrical testing, it is possible to establish interconnection between the single die or separate and package dice into discrete parts, arrays or clusters, either as singulated parts or as arrays.

公开(公告)号：US20070045808A1

公开(公告)日：2007-03-01

申请号：US11591744

申请日：2006-11-02

申请人： Warren Farnworth ,  Alan Wood

发明人： Warren Farnworth ,  Alan Wood

IPC分类号： H01L21/44 ,  H01L23/48 ,  H01L23/52

CPC分类号： H01L23/3128 ,  G01R1/0483 ,  G01R3/00 ,  G01R31/2867 ,  H01L21/4846 ,  H01L23/32 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/10161 ,  H01L2924/12042 ,  H01L2924/3011 ,  H01L2924/30111 ,  H05K1/0218 ,  H05K1/113 ,  H05K3/027 ,  H05K2201/09363 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A test carrier for a semiconductor component includes a base for retaining the component, and an interconnect on the base having contacts configured to electrically engage component contacts on the component. The base includes conductors in electrical communication with the contacts on the interconnect, which are defined by grooves in a conductive layer. In addition, the conductors include first portions of the conductive layer configured for electrical transmission, which are separated from one another by second portions of the conductive layer configured for no electrical transmission. The test carrier is configured for mounting to a burn in board in electrical communication with a test circuitry configured to apply test signals through the contacts on the interconnect to the component.

摘要翻译： 用于半导体部件的测试载体包括用于保持部件的基座和在基部上的互连件，其具有被构造成电接合部件上的部件触点的触点。 基座包括与互连上的触点电连通的导体，其由导电层中的沟槽限定。 此外，导体包括被配置用于电传输的导电层的第一部分，它们被配置为不进行电传输的导电层的第二部分彼此分离。 测试载体被配置为安装到板上的燃烧，与测试电路电连通，该测试电路经配置以通过互连件上的触点施加测试信号到组件。

公开(公告)号：US20060289992A1

公开(公告)日：2006-12-28

申请号：US11167367

申请日：2005-06-27

申请人： Alan Wood

发明人： Alan Wood

IPC分类号： H01L23/48

CPC分类号： H01L25/0657 ,  H01L25/50 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/051 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05684 ,  H01L2224/16 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06586 ,  H01L2225/06596 ,  H01L2924/15311 ,  H01L2924/00014

摘要： A semiconductor component includes a carrier and multiple semiconductor substrates stacked and interconnected on the carrier. The carrier includes conductive members bonded to corresponding conductive openings on the semiconductor substrates. The component can also include terminal contacts on the carrier in electrical communication with the conductive members, and an outer member for protecting the semiconductor substrates. A method for fabricating the component includes the steps of providing the carrier with the conductive members, and providing the semiconductor substrates with the conductive openings. The method also includes the step of aligning and placing the conductive openings on the conductive members, and then bonding the conductive members to the conductive openings. A system includes the carrier having the conductive members, the semiconductor substrates having the conductive openings, an aligning and placing system for aligning and placing the semiconductor substrates on the carrier, and a bonding system for bonding the conductive members to the conductive openings.

摘要翻译： 半导体部件包括载体和在载体上堆叠和互连的多个半导体衬底。 载体包括结合到半导体衬底上相应的导电开口的导电构件。 该部件还可以包括与导电构件电连通的载体上的端子触点，以及用于保护半导体衬底的外部构件。 一种用于制造该部件的方法包括以下步骤：为载体提供导电构件，并为半导体衬底提供导电孔。 该方法还包括将导电开口对准和放置在导电构件上，然后将导电构件接合到导电开口的步骤。 系统包括具有导电构件的载体，具有导电开口的半导体衬底，用于将半导体衬底对准和放置在载体上的对准和放置系统，以及用于将导电构件接合到导电开口的接合系统。