公开(公告)号：US09337162B2

公开(公告)日：2016-05-10

申请号：US13613047

申请日：2012-09-13

申请人： William M. Hiatt ,  Warren M. Farnworth

发明人： William M. Hiatt ,  Warren M. Farnworth

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/00 ,  H01L23/31

CPC分类号： H01L24/12 ,  H01L23/3114 ,  H01L24/11 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05557 ,  H01L2224/0558 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/1147 ,  H01L2224/11474 ,  H01L2224/11902 ,  H01L2224/13006 ,  H01L2224/13023 ,  H01L2224/13076 ,  H01L2224/13078 ,  H01L2224/13099 ,  H01L2224/13155 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2224/29099 ,  H01L2924/00014

摘要： An integrated circuit connection is describe that includes a first, securing member and a second, connection member. The first member, in an embodiment, is a spike that has a portion of its body fixed in a layer of an integrated circuit structure and extends outwardly from the integrated circuit structure. The second material is adapted to form a mechanical connection to a further electrical device. The second material (e.g., solder), is held by the first member to the integrated circuit structure. The first member increases the strength of the connection and assists in controlling the collapse of second member to form the mechanical connection to another circuit. The connection is formed by coating the integrated circuit structure with a patterned resist and etching the layer beneath the resist. A first member material (e.g., metal) is deposited. The resist is removed. The collapsible material is fixed to the first member.

公开(公告)号：US09307686B2

公开(公告)日：2016-04-05

申请号：US13420131

申请日：2012-03-14

申请人： Katsumi Takada ,  Kiyokazu Moriizumi ,  Masayuki Itoh

发明人： Katsumi Takada ,  Kiyokazu Moriizumi ,  Masayuki Itoh

IPC分类号： H05K13/04 ,  H05K1/02 ,  H05K3/34 ,  H01L23/36 ,  H01L23/00 ,  H01L23/34 ,  H01L23/373 ,  H05K3/22

CPC分类号： H05K1/0212 ,  H01L23/345 ,  H01L23/3735 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/29111 ,  H01L2224/29116 ,  H01L2224/29144 ,  H01L2224/32238 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48227 ,  H01L2224/81444 ,  H01L2224/83444 ,  H01L2924/0001 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/12041 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/181 ,  H05K3/22 ,  H05K3/3494 ,  H05K2201/09263 ,  H05K2203/1115 ,  H05K2203/176 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/01029 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2924/00

摘要： An electronic component includes a wiring substrate having a first surface and a second surface, an electronic component body mounted on a first surface side of the wiring substrate, an external electrode formed on a second surface side of the wiring substrate which is opposite to the first surface side, the external electrode being electrically connected to the electronic component body, a heat generating member having a conductive property and having a higher resistivity than the external electrode, and a heat insulating layer disposed between the electronic component body and the heat generating member, the heat insulating layer having an insulating property and being formed of a material different from an other material of the wiring substrate.

摘要翻译： 电子部件包括具有第一表面和第二表面的布线基板，安装在布线基板的第一表面侧上的电子部件主体，形成在布线基板的与第一表面相对的第二表面侧上的外部电极 表面侧，外部电极电连接到电子部件主体，具有导电性能并且具有比外部电极更高的电阻率的发热部件，以及设置在电子部件主体和发热部件之间的绝热层， 所述绝热层具有绝缘性，并且由与所述布线基板的其它材料不同的材料形成。

公开(公告)号：US20160064255A1

公开(公告)日：2016-03-03

申请号：US14935510

申请日：2015-11-09

申请人： Infineon Technologies AG

发明人： Ralf Otremba ,  Josef Hoeglauer ,  Juergen Schredl ,  Xaver Schloegel ,  Klaus Schiess ,  Bernd Roemer ,  Edward Fuergut

IPC分类号： H01L21/56

CPC分类号： H01L21/565 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/34 ,  H01L23/495 ,  H01L23/49562 ,  H01L23/49568 ,  H01L23/552 ,  H01L24/05 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/0603 ,  H01L2224/06181 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/48824 ,  H01L2224/48847 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/12032 ,  H01L2924/1301 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/29099

摘要： A method for manufacturing a chip arrangement, including disposing a chip over a carrier, wherein the bottom side of the chip is electrically connected to the first carrier side via one or more contact pads on the chip bottom side, disposing a first encapsulation material over the first carrier side, wherein the first encapsulation material at least partially surrounds the chip, and disposing a second encapsulation material over a second carrier side, wherein the second encapsulation material is in direct contact with the second carrier side.

摘要翻译： 一种用于制造芯片布置的方法，包括在载体上布置芯片，其中芯片的底侧通过芯片底侧上的一个或多个接触焊盘电连接到第一载体侧，在第一封装材料上设置第一封装材料 第一载体侧，其中第一封装材料至少部分地围绕芯片，并且在第二载体侧上设置第二封装材料，其中第二封装材料与第二载体侧直接接触。

公开(公告)号：US09275946B2

公开(公告)日：2016-03-01

申请号：US14629227

申请日：2015-02-23

申请人： Power Integrations, Inc.

发明人： Balu Balakrishnan ,  David Michael Hugh Matthews

IPC分类号： H01L23/495 ,  H02M3/00 ,  H01L23/48 ,  H01L23/552 ,  H01L23/66 ,  H01L23/00 ,  H02M3/335

CPC分类号： H01L23/49575 ,  H01L23/48 ,  H01L23/495 ,  H01L23/49541 ,  H01L23/552 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/29099 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/4911 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/12032 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H02M3/00 ,  H02M3/33523 ,  H01L2924/00 ,  H01L2224/45099

摘要： An integrated circuit package for use in a switch mode power converter includes a portion of a lead frame disposed within an encapsulation. The lead frame includes a first conductor having an inner conductive loop disposed within the encapsulation, and a second conductor galvanically isolated from the first conductor having an outer conductive loop disposed within the encapsulation and magnetically coupled to the first conductive loop to provide a communication link between the first and second conductors. First and second control circuits are coupled to the first and second conductors, respectively. The first control circuit is coupled to control a switching circuit in response to one or more control signals communicated between first and second dice that include the first and second control circuits, respectively, through the communication link to regulate a transfer of energy from an input to an output of the switch mode power converter.

摘要翻译： 用于开关模式功率转换器的集成电路封装包括布置在封装内的引线框架的一部分。 引线框架包括具有设置在封装内的内部导电回路的第一导体，以及与第一导体电隔离的第二导体，其具有布置在封装内的外部导电环，并且磁耦合到第一导电环，以提供 第一和第二导体。 第一和第二控制电路分别耦合到第一和第二导体。 第一控制电路被耦合以响应于通过通信链路分别在包括第一和第二控制电路的第一和第二骰子之间传送的一个或多个控制信号来控制开关电路，以调节能量从输入到 开关模式电源转换器的输出。

公开(公告)号：US09273235B2

公开(公告)日：2016-03-01

申请号：US14124509

申请日：2011-06-10

申请人： Satoru Kurita ,  Takashi Hinotsu ,  Shinya Sasaki

发明人： Satoru Kurita ,  Takashi Hinotsu ,  Shinya Sasaki

IPC分类号： B32B5/16 ,  B32B25/02 ,  C09J11/06 ,  C22C5/06 ,  H01L23/00 ,  H05K1/09 ,  B22F1/00

CPC分类号： C09J11/06 ,  B22F1/0018 ,  B22F1/0062 ,  C22C5/06 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/2732 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/1301 ,  H01L2924/13033 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15747 ,  H05K1/092 ,  H05K2201/0224 ,  H05K2201/0257 ,  Y10T428/24413 ,  H01L2224/29298 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2924/00014

摘要： A bonding material using silver nanoparticles considerably changes in coating-material property in response to a slight change in composition, and the stability thereof has been insufficient for large-amount application. A bonding material which uses silver nanoparticles, meets the requirements for mass printing, attains dimensional stability, and gives a smooth printed surface is provided. The bonding material includes silver nanoparticles which have at least an average primary particle diameter of 1 nm to 200 nm and have been coated with an organic substance having 8 or less carbon atoms, a dispersion medium, and a viscosity modifier composed of an organic substance, and has a viscosity (measured at a shear rate of 15.7 [1/s]) of 100 Pa·s or lower and a thixotropic ratio (measured at a shear rate of 3.1 [1/s]/measured at a shear rate of 15.7 [1/s]) of 4 or lower.

摘要翻译： 使用银纳米颗粒的接合材料响应于组成的轻微变化而显着改变涂层材料性质，并且其稳定性对于大量施加而言不足。 使用银纳米颗粒的接合材料满足大量印刷的要求，获得尺寸稳定性，并提供光滑的印刷表面。 接合材料包括至少具有1nm至200nm的平均初级粒径且已经涂覆有碳原子数为8以下的有机物的分散介质和由有机物构成的粘度调节剂的银纳米粒子， 并且具有100Pa·s以下的粘度（在剪切速度为15.7 [1 / s]下测定）和在剪切速度为15.7℃时测定的触变性比（在剪切速度为3.1 [1 / s]下测定） [1 / s]）为4以下。

公开(公告)号：US20160056090A1

公开(公告)日：2016-02-25

申请号：US14933583

申请日：2015-11-05

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Ku-Feng Yang ,  Shin-Puu Jeng ,  Wen-Chih Chiou

IPC分类号： H01L23/48

CPC分类号： H01L23/481 ,  H01L21/288 ,  H01L21/76838 ,  H01L21/76843 ,  H01L21/76897 ,  H01L21/76898 ,  H01L23/53238 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/05025 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2924/00013 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/014

摘要： A device includes a substrate having a front side and a backside, the backside being opposite the front side. An isolation layer is disposed on the front side of the substrate, wherein first portions of isolation layer and the substrate are in physical contact. A through substrate via (TSV) extends from the front side to the backside of the substrate. An oxide liner is on a sidewall of the TSV. The oxide liner extends between second portions of the substrate and the isolation layer. A dielectric layer having a metal pad is disposed over the isolation layer on the front side of the substrate. The metal pad and the TSV are formed of a same material.

摘要翻译： 一种装置包括具有前侧和后侧的基板，该背面与前侧相对。 隔离层设置在基板的正面上，其中隔离层和基板的第一部分物理接触。 通过基板通孔（TSV）从基板的前侧延伸到背面。 氧化物衬垫位于TSV的侧壁上。 氧化物衬垫在衬底的第二部分和隔离层之间延伸。 具有金属焊盘的电介质层设置在衬底前侧的隔离层上。 金属焊盘和TSV由相同的材料形成。

公开(公告)号：US09246073B2

公开(公告)日：2016-01-26

申请号：US13000784

申请日：2009-06-18

申请人： Tatsuo Sasaoka ,  Kaori Toyoda ,  Kentaro Nishiwaki ,  Hiroki Ikeuchi ,  Hiroshi Nasu

发明人： Tatsuo Sasaoka ,  Kaori Toyoda ,  Kentaro Nishiwaki ,  Hiroki Ikeuchi ,  Hiroshi Nasu

IPC分类号： B23K31/02 ,  H01L33/62 ,  B23K35/02 ,  B23K1/00 ,  H01L23/00 ,  H01L33/64 ,  H05K3/32 ,  H01L21/56 ,  H01L31/024 ,  H05K3/40

CPC分类号： H01L33/62 ,  B23K1/0016 ,  B23K35/0244 ,  B23K35/025 ,  H01L21/563 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L31/024 ,  H01L33/641 ,  H01L33/647 ,  H01L2224/0401 ,  H01L2224/06102 ,  H01L2224/16225 ,  H01L2224/29076 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/8314 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83207 ,  H01L2224/83385 ,  H01L2224/838 ,  H01L2224/8384 ,  H01L2224/83851 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/351 ,  H05K3/321 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/10106 ,  H05K2201/10166 ,  H05K2201/2036 ,  H05K2203/1131 ,  H05K2203/1178 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01014 ,  H01L2224/29298 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2924/00014

摘要： A mounting structure is provided that can allow gaseous matter generated when performing a heat treatment to escape to outside efficiently. A mounting structure 10 includes a substrate 1 having electrodes 2a and 2b, an electronic component 3 having electrodes 21a and 21b, joints 15a and 15b that electrically connect the electrodes 2a and 2b of the substrate 1 and the electrodes 21a and 21b of the electronic component 3 and also fix the electronic component 3 to the surface of the substrate 1, and a convex portion 4 that abuts against the electrode 2a of the substrate 1 and the electrode 21a of the electronic component 3 and is used as a spacer.

摘要翻译： 提供一种安装结构，其可以允许当执行热处理时产生的气体有效地逸出到外部。 安装结构10包括具有电极2a和2b的基板1，具有电极21a和21b的电子部件3，将基板1的电极2a和2b与电子部件的电极21a和21b电连接的接头15a和15b 并且还将电子部件3固定到基板1的表面，以及与基板1的电极2a和电子部件3的电极21a抵接并用作间隔件的凸部4。

公开(公告)号：US09245772B2

公开(公告)日：2016-01-26

申请号：US14328348

申请日：2014-07-10

申请人： STATS ChipPAC, Ltd.

发明人： JoungIn Yang ,  ChoongBin Yim ,  KeonTeak Kang ,  YoungChul Kim

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/56 ,  H01L23/14 ,  H01L23/31 ,  H01L23/498 ,  H01L25/03 ,  H01L23/00

CPC分类号： H01L21/561 ,  H01L21/486 ,  H01L23/147 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49827 ,  H01L24/02 ,  H01L24/28 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L25/03 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48611 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48655 ,  H01L2224/48711 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/48755 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/83192 ,  H01L2224/83805 ,  H01L2224/85205 ,  H01L2224/85411 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2224/92247 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/157 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2224/13111 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/83205

摘要： A semiconductor package comprises a substrate, a first semiconductor die mounted to the substrate, and a first double side mold (DSM) internal stackable module (ISM) bonded directly to the first semiconductor die through a first adhesive. The first DSM ISM includes a first molding compound, and a second semiconductor die disposed in the first molding compound. The semiconductor package further comprises a first electrical connection coupled between the first semiconductor die and the substrate, and a second electrical connection coupled between the first DSM ISM and the substrate.

摘要翻译： 半导体封装包括衬底，安装到衬底的第一半导体管芯和通过第一粘合剂直接结合到第一半导体管芯的第一双面模具（DSM）内部可堆叠模块（ISM）。 第一DSM ISM包括第一模塑料和设置在第一模塑料中的第二半导体模。 半导体封装还包括耦合在第一半导体管芯和衬底之间的第一电连接以及耦合在第一DSM ISM和衬底之间的第二电连接。

公开(公告)号：US09238278B2

公开(公告)日：2016-01-19

申请号：US14005874

申请日：2012-01-25

申请人： Daisuke Sakurai

发明人： Daisuke Sakurai

IPC分类号： B23K35/02 ,  B23K1/00 ,  B32B3/24 ,  B32B3/30 ,  B23K1/20 ,  B23K3/06 ,  B23K35/26 ,  H01L23/00 ,  C22C13/00 ,  B23K35/362 ,  B23K35/40 ,  C22C1/02 ,  B22F7/00 ,  H05K3/34

CPC分类号： B23K35/0244 ,  B22F7/004 ,  B23K1/0016 ,  B23K1/20 ,  B23K3/0623 ,  B23K35/26 ,  B23K35/262 ,  B23K35/362 ,  B23K35/40 ,  B23K2101/42 ,  C22C1/02 ,  C22C13/00 ,  C22C13/02 ,  C22C28/00 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/11003 ,  H01L2224/111 ,  H01L2224/11332 ,  H01L2224/1182 ,  H01L2224/11849 ,  H01L2224/13022 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/13562 ,  H01L2224/1357 ,  H01L2224/13578 ,  H01L2224/13609 ,  H01L2224/13611 ,  H01L2224/94 ,  H01L2924/00013 ,  H01L2924/01029 ,  H01L2924/15788 ,  H05K3/3436 ,  H05K3/3478 ,  H05K3/3484 ,  H05K2203/0425 ,  Y10T428/24322 ,  H01L2924/01028 ,  H01L2924/01047 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2924/0103 ,  H01L2924/00014 ,  H01L2224/11 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00

摘要： A solder transfer substrate, including: a base layer; an adhesive layer arranged on the base layer; and plural solder powders arranged on the adhesive layer, wherein in the base layer, which is a porous member, a plurality of holes, which allow at least a peeling-off liquid to pass therethrough, are formed from a side thereof on which the adhesive layer is not arranged to a side thereof on which the adhesive layer is arranged. Particularly, the adhesive layer has a characteristic of expanding with the peeling-off liquid infused.

摘要翻译： 一种焊料转移基板，包括：基底层; 布置在基层上的粘合剂层; 以及布置在所述粘合剂层上的多个焊料粉末，其中在作为多孔构件的所述基底层中，至少允许剥离液体通过的多个孔由其侧面形成， 层不布置在其上布置有粘合剂层的一侧。 特别地，粘合剂层具有渗透的剥离液体膨胀的特性。

公开(公告)号：US20160005717A1

公开(公告)日：2016-01-07

申请号：US14689655

申请日：2015-04-17

申请人： BRIDGE SEMICONDUCTOR CORPORATION

发明人： Charles W. C. Lin ,  Chia-Chung Wang

IPC分类号： H01L25/065 ,  H01L23/00 ,  H01L23/498 ,  H01L23/367

CPC分类号： H01L25/0657 ,  H01L21/561 ,  H01L23/13 ,  H01L23/34 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/3735 ,  H01L23/42 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5384 ,  H01L23/5385 ,  H01L23/544 ,  H01L24/17 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L25/0655 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81203 ,  H01L2224/81207 ,  H01L2224/81815 ,  H01L2224/83192 ,  H01L2224/92225 ,  H01L2224/97 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2225/06589 ,  H01L2225/06593 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/16153 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2224/16225 ,  H01L2224/05599 ,  H01L2224/29099

摘要： A method of making a semiconductor device with face-to-face chips on interposer includes the step of attaching a chip-on-interposer subassembly on a heat spreader with the chip inserted into a cavity of the heat spreader so that the heat spreader provides mechanical support for the interposer. The heat spreader also provides thermal dissipation, electromagnetic shielding and moisture barrier for the enclosed chip. In the method, a second chip is also electrically coupled to a second surface of the interposer and an optional second heat spreader is attached to the second chip.