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公开(公告)号：US07576366B2
公开(公告)日：2009-08-18
申请号：US12007279
申请日：2008-01-09
Applicant: Yu-Nung Shen
Inventor： Yu-Nung Shen
IPC: H01L33/00 , H01L29/02 , H01L29/227
CPC classification number: H01L33/62 , H01L24/13 , H01L24/16 , H01L33/46 , H01L33/54 , H01L33/60 , H01L2224/1147 , H01L2224/13016 , H01L2224/13144 , H01L2224/13583 , H01L2224/13624 , H01L2224/13644 , H01L2224/13655 , H01L2224/16 , H01L2924/00013 , H01L2924/01079 , H01L2924/12041 , H01L2924/00014 , H01L2224/13099
Abstract: AN LED chip package body provides an LED chip with a pad-installed surface, a plurality of pads disposed on the pad-installed surface and a rear surface formed opposite the pad-installed surface. The LED chip package body further has a light-reflecting coating disposed on the pad-installed surface of the LED chip and a plurality of pad-exposed holes for exposure of the corresponding pads of the LED chip. The LED chip package body further comprises a light-transparent element disposed on the rear surface of the LED chip and a plurality of conductive projecting blocks. Each of the conductive projecting blocks is disposed on the corresponding pad of the LED chip.
Abstract translation: LED芯片封装体提供具有焊盘安装表面的LED芯片，设置在焊盘安装表面上的多个焊盘以及与焊盘安装表面相对形成的后表面。 LED芯片封装体还具有设置在LED芯片的焊盘安装表面上的光反射涂层和用于曝光LED芯片的相应焊盘的多个焊盘暴露孔。 LED芯片封装体还包括设置在LED芯片的后表面上的透光元件和多个导电突出块。 每个导电突出块设置在LED芯片的相应的焊盘上。
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公开(公告)号：US20090091024A1
公开(公告)日：2009-04-09
申请号：US11867051
申请日：2007-10-04
Applicant: Kejun Zeng , Wei Qun Peng , Rebecca L. Holford , Robert John Furtaw , Bernardo Gallegos
Inventor： Kejun Zeng , Wei Qun Peng , Rebecca L. Holford , Robert John Furtaw , Bernardo Gallegos
IPC: H01L23/488 , H01L21/60
CPC classification number: H01L24/81 , B23K1/0016 , B23K35/007 , B23K35/262 , B23K35/286 , B23K35/3013 , H01L23/49811 , H01L24/11 , H01L24/12 , H01L24/16 , H01L25/105 , H01L2224/0401 , H01L2224/05124 , H01L2224/05147 , H01L2224/0558 , H01L2224/05644 , H01L2224/05664 , H01L2224/1134 , H01L2224/13144 , H01L2224/13147 , H01L2224/13583 , H01L2224/136 , H01L2224/13644 , H01L2224/13655 , H01L2224/16225 , H01L2224/73204 , H01L2224/81193 , H01L2224/8121 , H01L2224/81815 , H01L2225/06558 , H01L2225/06568 , H01L2225/1023 , H01L2225/1058 , H01L2924/00013 , H01L2924/01004 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/0102 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H01L2924/15331 , H01L2924/30107 , H01L2924/3025 , H01L2924/00014 , H01L2224/13099 , H01L2924/00 , H01L2924/013
Abstract: A metallic interconnect structure (200) for connecting a gold bump (205) and a copper pad (212), as used for example in semiconductor flip-chip assembly. A first region (207) of binary AuSn2 intermetallic is adjacent to the gold bump. A region (208) of binary AuSn4 intermetallic is adjacent to the first AuSn2 region. Then, a region (209) of binary gold-tin solid solution is adjacent to the AuSn4 region, and a second region (210) of binary AuSn2 intermetallic is adjacent to the solid solution region. The second AuSn2 region is adjacent to a nickel layer (213) (preferred thickness about 0.08 μm), which covers the copper pad. The nickel layer insures that the gold/tin intermetallics and solutions remain substantially free of copper and thus avoid ternary compounds, providing stabilized gold bump/solder connections.
Abstract translation: 金属互连结构（200），用于连接例如半导体倒装芯片组装中的金凸块（205）和铜焊盘（212）。 二元AuSn2金属间化合物的第一区域（207）与金凸块相邻。 二元AuSn4金属间化合物的区域（208）与第一AuSn2区相邻。 然后，二元金 - 锡固溶体的区域（209）与AuSn4区相邻，并且二元AuSn2金属间化合物的第二区（210）与固溶区相邻。 第二AuSn2区域与覆盖铜焊盘的镍层（213）（优选厚度约0.08μm）相邻。 镍层确保金/锡金属间化合物和溶液基本上不含铜，从而避免三元化合物，提供稳定的金凸块/焊料连接。
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公开(公告)号：US07462942B2
公开(公告)日：2008-12-09
申请号：US10682054
申请日：2003-10-09
Applicant: Kim Hwee Tan , Ch'ng Han Shen , Rosemarie Tagapulot , Yin Yen Bong , Ma L. Nang Htoi , Lim Tiong Soon , Shikui Lui , Balasubramanian Sivagnanam
Inventor： Kim Hwee Tan , Ch'ng Han Shen , Rosemarie Tagapulot , Yin Yen Bong , Ma L. Nang Htoi , Lim Tiong Soon , Shikui Lui , Balasubramanian Sivagnanam
CPC classification number: H01L24/11 , H01L24/13 , H01L2224/05001 , H01L2224/05023 , H01L2224/05124 , H01L2224/05144 , H01L2224/05147 , H01L2224/05166 , H01L2224/05556 , H01L2224/05568 , H01L2224/13012 , H01L2224/13013 , H01L2224/13014 , H01L2224/1308 , H01L2224/13082 , H01L2224/13111 , H01L2224/13147 , H01L2224/1357 , H01L2224/13655 , H01L2224/13671 , H01L2224/14051 , H01L2924/00013 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01061 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H01L2924/1461 , H01L2924/15747 , H01L2924/19041 , H01L2924/30107 , H01L2924/3025 , H01L2924/00014 , H01L2224/13099 , H01L2924/00012 , H01L2224/29099 , H01L2924/00
Abstract: A die, comprising a substrate and one or more pillar structures formed over the substrate in a pattern and the method of forming the die.
Abstract translation: 一种模具，其包括基板和以图案形成在所述基板上的一个或多个支柱结构以及形成所述模具的方法。
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公开(公告)号：US20080173888A1
公开(公告)日：2008-07-24
申请号：US12007276
申请日：2008-01-09
Applicant: Yu-Nung Shen
Inventor： Yu-Nung Shen
IPC: H01L33/00
CPC classification number: H01L33/62 , H01L24/13 , H01L24/16 , H01L33/46 , H01L33/54 , H01L33/60 , H01L2224/1147 , H01L2224/13016 , H01L2224/13144 , H01L2224/13583 , H01L2224/13624 , H01L2224/13644 , H01L2224/13655 , H01L2224/16 , H01L2924/00013 , H01L2924/01079 , H01L2924/12041 , H01L2924/00014 , H01L2224/13099
Abstract: AN LED chip package body provides an LED chip with a pad-installed surface, a plurality of pads disposed on the pad-installed surface and a rear surface formed opposite the pad-installed surface. The LED chip package body further has a light-reflecting coating disposed on the pad-installed surface of the LED chip and a plurality of pad-exposed holes for exposure of the corresponding pads of the LED chip. The LED chip package body further comprises a light-transparent element disposed on the rear surface of the LED chip and a plurality of conductive projecting blocks. Each of the conductive projecting blocks is disposed on the corresponding pad of the LED chip.
Abstract translation: LED芯片封装体提供具有焊盘安装表面的LED芯片，设置在焊盘安装表面上的多个焊盘以及与焊盘安装表面相对形成的后表面。 LED芯片封装体还具有设置在LED芯片的焊盘安装表面上的光反射涂层和用于曝光LED芯片的相应焊盘的多个焊盘暴露孔。 LED芯片封装体还包括设置在LED芯片的后表面上的透光元件和多个导电突出块。 每个导电突出块设置在LED芯片的相应的焊盘上。
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公开(公告)号：US20080111149A1
公开(公告)日：2008-05-15
申请号：US12007278
申请日：2008-01-09
Applicant: Yu-Nung Shen
Inventor： Yu-Nung Shen
IPC: H01L33/00
CPC classification number: H01L33/62 , H01L24/13 , H01L24/16 , H01L33/46 , H01L33/54 , H01L33/60 , H01L2224/1147 , H01L2224/13016 , H01L2224/13144 , H01L2224/13583 , H01L2224/13624 , H01L2224/13644 , H01L2224/13655 , H01L2224/16 , H01L2924/00013 , H01L2924/01079 , H01L2924/12041 , H01L2924/00014 , H01L2224/13099
Abstract: AN LED chip package body provides an LED chip with a pad-installed surface, a plurality of pads disposed on the pad-installed surface and a rear surface formed opposite the pad-installed surface. The LED chip package body further has a light-reflecting coating disposed on the pad-installed surface of the LED chip and a plurality of pad-exposed holes for exposure of the corresponding pads of the LED chip. The LED chip package body further comprises a light-transparent element disposed on the rear surface of the LED chip and a plurality of conductive projecting blocks. Each of the conductive projecting blocks is disposed on the corresponding pad of the LED chip.
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Patent Agency Ranking
公开(公告)号：US20080108158A1
公开(公告)日：2008-05-08
申请号：US12007285
申请日：2008-01-09
Applicant: Yu-Nung Shen
Inventor： Yu-Nung Shen
IPC: H01L33/00
CPC classification number: H01L33/62 , H01L24/13 , H01L24/16 , H01L33/46 , H01L33/54 , H01L33/60 , H01L2224/1147 , H01L2224/13016 , H01L2224/13144 , H01L2224/13583 , H01L2224/13624 , H01L2224/13644 , H01L2224/13655 , H01L2224/16 , H01L2924/00013 , H01L2924/01079 , H01L2924/12041 , H01L2924/00014 , H01L2224/13099
Abstract: AN LED chip package body provides an LED chip with a pad-installed surface, a plurality of pads disposed on the pad-installed surface and a rear surface formed opposite the pad-installed surface. The LED chip package body further has a light-reflecting coating disposed on the pad-installed surface of the LED chip and a plurality of pad-exposed holes for exposure of the corresponding pads of the LED chip. The LED chip package body further comprises a light-transparent element disposed on the rear surface of the LED chip and a plurality of conductive projecting blocks. Each of the conductive projecting blocks is disposed on the corresponding pad of the LED chip.
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87.发明授权Manufacturing method of semiconductor device, semiconductor device, circuit board, electro-optic device, and electronic apparatus 失效半导体器件，半导体器件，电路板，电光器件和电子设备的制造方法公开(公告)号：US07348269B2
公开(公告)日：2008-03-25
申请号：US11311800
申请日：2005-12-19
Applicant: Shuichi Tanaka , Mitsuru Kuribayashi
Inventor： Shuichi Tanaka , Mitsuru Kuribayashi
IPC: H01L21/44
CPC classification number: H01L21/288 , G02F1/13452 , G02F2001/13456 , H01L24/11 , H01L24/13 , H01L24/83 , H01L24/90 , H01L2224/05001 , H01L2224/05022 , H01L2224/05548 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/05671 , H01L2224/05684 , H01L2224/13099 , H01L2224/1319 , H01L2224/136 , H01L2224/13624 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/13664 , H01L2224/13666 , H01L2224/13671 , H01L2224/13684 , H01L2224/16225 , H01L2224/2919 , H01L2224/73204 , H01L2224/81203 , H01L2224/83191 , H01L2224/83192 , H01L2224/83203 , H01L2224/838 , H01L2924/0001 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01054 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/00 , H01L2924/01023 , H01L2924/01028 , H01L2924/00014
Abstract: A method for manufacturing a semiconductor device with a bump electrode wherein the bump electrode includes a resin material as a core and at least a top surface covered with a conductive film. The method includes placing the resin material on a substrate on which an electrode terminal is formed by an inkjet method, and forming an interconnecting metal that connects the electrode terminal to a top surface of the resin material.
Abstract translation: 一种用于制造具有凸块电极的半导体器件的方法，其中所述凸块电极包括作为芯的树脂材料和至少覆盖有导电膜的顶表面。 该方法包括通过喷墨方法将树脂材料放置在其上形成有电极端子的基板上，并且形成将电极端子连接到树脂材料的顶表面的互连金属。
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公开(公告)号：US07225538B2
公开(公告)日：2007-06-05
申请号：US10035633
申请日：2001-12-28
Applicant: Benjamin Niles Eldridge , Gary William Grube , Igor Yan Khandros , Gaetan L. Mathieu
Inventor： Benjamin Niles Eldridge , Gary William Grube , Igor Yan Khandros , Gaetan L. Mathieu
IPC: H01R43/16
CPC classification number: H05K7/1069 , B23K20/004 , B23K2101/40 , C23C18/31 , C23C18/32 , C23C18/38 , C25D5/08 , C25D5/22 , C25D21/02 , G01R1/0483 , G01R1/06711 , G01R1/07314 , G01R1/07342 , G01R1/07357 , G01R1/07378 , G01R31/2884 , G01R31/2886 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L21/6715 , H01L21/67248 , H01L21/67253 , H01L21/67288 , H01L22/20 , H01L23/49811 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/72 , H01L24/78 , H01L24/81 , H01L24/85 , H01L25/0652 , H01L25/16 , H01L2224/05568 , H01L2224/05571 , H01L2224/05572 , H01L2224/05573 , H01L2224/1134 , H01L2224/13082 , H01L2224/13099 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13647 , H01L2224/13655 , H01L2224/16145 , H01L2224/45015 , H01L2224/45109 , H01L2224/45111 , H01L2224/45116 , H01L2224/4512 , H01L2224/45123 , H01L2224/45124 , H01L2224/45138 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/45163 , H01L2224/45164 , H01L2224/45169 , H01L2224/45173 , H01L2224/45176 , H01L2224/45565 , H01L2224/4569 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48599 , H01L2224/49109 , H01L2224/73203 , H01L2224/78301 , H01L2224/81801 , H01L2224/85043 , H01L2224/85045 , H01L2224/851 , H01L2224/85201 , H01L2224/85203 , H01L2224/85205 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01031 , H01L2924/01039 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/0106 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01083 , H01L2924/01322 , H01L2924/014 , H01L2924/07802 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15312 , H01L2924/1532 , H01L2924/16195 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19107 , H01L2924/20751 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01R12/52 , H05K1/141 , H05K3/20 , H05K3/308 , H05K3/326 , H05K3/3421 , H05K3/3426 , H05K3/368 , H05K3/4015 , H05K3/4092 , H05K2201/0397 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10378 , H05K2201/10719 , H05K2201/10734 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , Y02P70/611 , Y02P70/613 , Y10T29/49147 , Y10T29/49149 , Y10T29/49174 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , H01L2924/00 , H01L2224/48 , H01L2924/00012 , H01L2924/20752 , H01L2924/20756 , H01L2924/20757 , H01L2924/00015 , H01L2924/2075 , H01L2924/01204 , H01L2924/013 , H01L2924/01004 , H01L2924/01048
Abstract: Contact structures exhibiting resilience or compliance are formed. The contact structures may be formed on a sacrificial substrate. The contact structures are attached to an array of electrical connections on a substrate to form a contact assembly. The electrical connections on the substrate may be metallic pads.
Abstract translation: 形成表现出弹性或顺应性的接触结构。 接触结构可以形成在牺牲衬底上。 接触结构附接到基底上的电连接阵列以形成接触组件。 基板上的电连接可以是金属焊盘。
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公开(公告)号：US07084656B1
公开(公告)日：2006-08-01
申请号：US08735816
申请日：1996-10-21
Applicant: Igor Y. Khandros , Gaetan L. Mathieu
Inventor： Igor Y. Khandros , Gaetan L. Mathieu
IPC: G01R1/073
CPC classification number: G01R1/073 , G01R1/07357 , H01L23/49811 , H01L24/13 , H01L24/14 , H01L24/72 , H01L24/73 , H01L25/0652 , H01L25/0657 , H01L25/16 , H01L2224/04042 , H01L2224/05572 , H01L2224/11005 , H01L2224/13011 , H01L2224/13016 , H01L2224/13076 , H01L2224/131 , H01L2224/13124 , H01L2224/1329 , H01L2224/13339 , H01L2224/13552 , H01L2224/13562 , H01L2224/13582 , H01L2224/13611 , H01L2224/13644 , H01L2224/13655 , H01L2224/14181 , H01L2224/16235 , H01L2224/16238 , H01L2224/1624 , H01L2224/32145 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/4813 , H01L2224/48132 , H01L2224/4824 , H01L2224/48465 , H01L2224/48471 , H01L2224/73203 , H01L2224/73251 , H01L2224/81192 , H01L2224/85444 , H01L2224/8592 , H01L2225/0651 , H01L2225/06572 , H01L2924/00014 , H01L2924/15151 , H01L2924/15153 , H01L2924/15312 , H01L2924/19041 , H01L2924/19103 , H01L2924/19104 , H01L2924/19107 , H05K3/32 , H05K3/4015 , H05K2201/10378 , H05K2201/10962 , H05K2203/049 , H01L2924/00 , H01L2924/013 , H01L2924/01082 , H01L2924/014 , H01L2924/00012 , H01L2224/16 , H01L2224/72 , H01L2224/4554
Abstract: An interconnection contact structure assembly including an electronic component having a surface and a conductive contact carried by the electronic component and accessible at the surface. The contact structure includes an internal flexible elongate member having first and second ends and with the first end forming a first intimate bond to the surface of said conductive contact terminal without the use of a separate bonding material. An electrically conductive shell is provided and is formed of at least one layer of a conductive material enveloping the elongate member and forming a second intimate bond with at least a portion of the conductive contact terminal immediately adjacent the first intimate bond.
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公开(公告)号：US20060118604A1
公开(公告)日：2006-06-08
申请号：US11005557
申请日：2004-12-05
Applicant: Stephen Buchwalter , Claudius Feger , Peter Gruber , Sung Kang , Paul Lauro , Da-Yuan Shih
Inventor： Stephen Buchwalter , Claudius Feger , Peter Gruber , Sung Kang , Paul Lauro , Da-Yuan Shih
IPC: B23K35/12
CPC classification number: H05K3/3436 , B23K35/26 , H01L24/11 , H01L24/12 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/1308 , H01L2224/13082 , H01L2224/131 , H01L2224/13147 , H01L2224/13155 , H01L2224/13176 , H01L2224/13181 , H01L2224/13184 , H01L2224/1357 , H01L2224/13639 , H01L2224/13644 , H01L2224/13655 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01044 , H01L2924/01047 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15787 , H05K3/3426 , H05K3/3468 , H05K2201/10287 , H05K2201/10992 , H05K2203/0113 , H05K2203/0415 , H05K2203/128 , Y02P70/613 , H01L2224/13099 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
Abstract: Improved interconnects are produced by injection molded solder which fills mold arrays with molten solder so that columns that have much greater height to width aspect ratios greater than one are formed, rather than conventional flip chip bumps. The columns may have filler particles or reinforcing conductors therein. In the interconnect structures produced, the cost and time of a subsequent underfill step is reduced or avoided. The problem of incompatibility with optical interconnects between chips because underfills require high loading of silica fillers which scatter light, is solved, thus allowing flip chips to incorporate optical interconnects.
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