公开(公告)号：US20180014407A1

公开(公告)日：2018-01-11

申请号：US15635590

申请日：2017-06-28

申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.

发明人： Junji SATO ,  Hitoshi KONDO ,  Katsuya FUKASE

IPC分类号： H05K1/18 ,  H01L21/683 ,  H01L23/31 ,  H01L23/538 ,  H01L25/065 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46 ,  H01L21/48 ,  H05K1/11 ,  H01L23/00

CPC分类号： H05K1/186 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/3157 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/5389 ,  H01L24/16 ,  H01L25/0657 ,  H01L2221/68345 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2225/06586 ,  H01L2924/1434 ,  H01L2924/19041 ,  H01L2924/19102 ,  H01L2924/386 ,  H05K1/111 ,  H05K1/115 ,  H05K3/4007 ,  H05K3/424 ,  H05K3/4682 ,  H05K2201/10015 ,  H05K2201/10515 ,  H05K2201/10636 ,  H05K2201/10734 ,  H05K2201/10977

摘要： A wiring board includes an electronic component; an insulating layer containing the electronic component therein, and including a via hole that is open at one surface of the insulating layer to expose an electrode of the electronic component; a first wiring layer embedded in the insulating layer, one surface of the first wiring layer being exposed at the one surface of the insulating layer; a second wiring layer including a wiring pattern formed on the one surface of the first wiring layer, and a via wiring extended from the wiring pattern to be extended in the via hole and directly connected to an electrode of the electronic component.

公开(公告)号：US20170352615A1

公开(公告)日：2017-12-07

申请号：US15625083

申请日：2017-06-16

申请人： Siliconware Precision Industries Co., Ltd.

发明人： Shih-Chao Chiu ,  Chun-Hsien Lin ,  Yu-Cheng Pai ,  Wei-Chung Hsiao ,  Ming-Chen Sun ,  Tzu-Chieh Shen ,  Chia-Cheng Chen

IPC分类号： H01L23/498 ,  H01L23/538 ,  H05K3/32 ,  H05K3/00 ,  H05K1/18 ,  H01L21/683 ,  H05K3/46 ,  H01L23/00 ,  H01L23/31 ,  H05K1/02 ,  H05K3/10

CPC分类号： H01L23/49838 ,  H01L21/6835 ,  H01L23/3121 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L2221/68318 ,  H01L2221/68345 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/26175 ,  H01L2224/2919 ,  H01L2224/32058 ,  H01L2224/32105 ,  H01L2224/32106 ,  H01L2224/32237 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2924/15313 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19103 ,  H01L2924/19104 ,  H05K1/0231 ,  H05K1/185 ,  H05K1/186 ,  H05K1/189 ,  H05K3/0026 ,  H05K3/007 ,  H05K3/108 ,  H05K3/32 ,  H05K3/4682 ,  H05K2201/0376 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10674 ,  H05K2201/10977 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/0665

摘要： The present invention provides a package structure with an embedded electronic component and a method of fabricating the package structure. The method includes: forming a first wiring layer on a carrier; removing the carrier and forming the first wiring layer on a bonding carrier; disposing an electronic component on the first wiring layer; forming an encapsulating layer, a second wiring layer and an insulating layer on the first wiring layer; disposing a chip on the electronic component and the second wiring layer; and forming a covering layer that covers the chip. The present invention can effectively reduce the thickness of the package structure and the electronic component without using adhesives.

公开(公告)号：US09806053B2

公开(公告)日：2017-10-31

申请号：US15185063

申请日：2016-06-17

申请人： MEDIATEK Inc.

发明人： Nan-Jang Chen

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/00 ,  H01L23/367 ,  H01L27/32 ,  H01L23/60 ,  H01L23/31 ,  H01L21/48 ,  H01L23/498 ,  H05K3/22

CPC分类号： H01L24/49 ,  H01L21/48 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/3675 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/60 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/73 ,  H01L27/32 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48195 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/141 ,  H01L2924/1421 ,  H01L2924/1432 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/19107 ,  H05K3/222 ,  H05K2201/10287 ,  H05K2201/10977 ,  H05K2203/049 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： A semiconductor package includes a first substrate, a first conductive layer, a first surface mount device (SMD) and a first bonding wire. The first substrate has a first top surface. The first conductive layer is formed on the first top surface and has a first conductive element and a second conductive element separated from each other. The first SMD is mounted on the first top surface, overlapping with but electrically isolated from the first conductive element. The first bonding wire electrically connects the first SMD with the first conductive layer.

公开(公告)号：US20170196089A1

公开(公告)日：2017-07-06

申请号：US15466442

申请日：2017-03-22

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Michael A. Gaynes ,  Jeffrey D. Gelorme ,  Robert P. Kuder, II ,  Daniel J. Littrell ,  Thomas E. Lombardi ,  Marie-Claude Paquet ,  Frank L. Pompeo ,  David L. Questad ,  James Speidell ,  Sri M. Sri-Jayantha ,  Son K. Tran

IPC分类号： H05K1/18 ,  H05K3/30 ,  H01R4/02

CPC分类号： H05K1/18 ,  H01L23/12 ,  H01R4/02 ,  H01R12/51 ,  H01R12/7041 ,  H01R43/205 ,  H05K1/0271 ,  H05K1/181 ,  H05K3/30 ,  H05K3/305 ,  H05K3/366 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10106 ,  H05K2201/10159 ,  H05K2201/10166 ,  H05K2201/10977

摘要： An interconnect structure that includes a component circuit board containing a plurality of electrical components, and a wafer connector assembly. The wafer connector assembly includes a plurality of interconnect circuit boards that are in electrical connection with the components circuit board through a plurality of rows of solder joints, the plurality of interconnect circuit boards having a connection end including at least one contact. An adhesive is present structurally reinforcing at least a row of the solder joints that is proximate to the connection end of the plurality of interconnect circuit boards of the wafer assembly.

公开(公告)号：US09622354B2

公开(公告)日：2017-04-11

申请号：US14076292

申请日：2013-11-11

申请人： GE Embedded Electronics Oy

发明人： Risto Tuominen ,  Antti Iihola ,  Petteri Palm

IPC分类号： H05K3/30 ,  H05K3/06 ,  H01L21/48 ,  H01L23/13 ,  H05K1/18 ,  H01L23/538 ,  H01L23/544 ,  H01L23/00 ,  H05K3/20 ,  H05K3/28 ,  H05K3/32 ,  H05K3/40

CPC分类号： H05K3/064 ,  H01L21/4846 ,  H01L21/56 ,  H01L21/568 ,  H01L23/13 ,  H01L23/5389 ,  H01L23/544 ,  H01L24/16 ,  H01L24/24 ,  H01L24/81 ,  H01L24/82 ,  H01L24/83 ,  H01L24/90 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/04105 ,  H01L2224/16 ,  H01L2224/18 ,  H01L2224/24227 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/81121 ,  H01L2224/81132 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/82039 ,  H01L2224/83132 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83205 ,  H01L2224/83851 ,  H01L2224/9211 ,  H01L2224/92144 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01018 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K1/183 ,  H05K1/187 ,  H05K1/188 ,  H05K3/205 ,  H05K3/284 ,  H05K3/303 ,  H05K3/305 ,  H05K3/32 ,  H05K3/321 ,  H05K3/4069 ,  H05K2201/0355 ,  H05K2201/09563 ,  H05K2201/0969 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/0353 ,  H05K2203/063 ,  H05K2203/0723 ,  Y02P70/613 ,  Y10T29/4913 ,  H01L2224/29075 ,  H01L2924/00 ,  H01L2224/0401

摘要： A method for manufacturing a circuit-board structure wherein a conductor foil is provided on an insulating material layer, a resist layer is spread on the conductor foil and a recess formed in the conductor foil and insulating material layer. The resist layer is patterned to form a conductor-pattern having openings wherein conductor patterns may be grown. A component is attached to the conductor foil and conductor pattern and conductor material is removed which does not form part of a conductor pattern.

公开(公告)号：US09601451B2

公开(公告)日：2017-03-21

申请号：US14823021

申请日：2015-08-11

申请人： LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.

发明人： Joseph Kuczynski ,  Melissa K. Miller ,  Heidi D. Williams ,  Jing Zhang

IPC分类号： H01L23/48 ,  H01L23/00 ,  B23K1/00 ,  H05K3/34 ,  H01L23/498 ,  H01L23/31

CPC分类号： H01L24/17 ,  B23K1/0016 ,  B23K3/0623 ,  H01L23/3142 ,  H01L23/49838 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/11011 ,  H01L2224/16055 ,  H01L2224/16057 ,  H01L2224/16227 ,  H01L2224/81007 ,  H01L2224/81815 ,  H01L2924/06 ,  H01L2924/14 ,  H01L2924/1531 ,  H05K3/341 ,  H05K3/3436 ,  H05K2201/10734 ,  H05K2201/10977 ,  Y02P70/613

摘要： Example methods, apparatus, and products for creating an environmentally protective coating for integrated circuit assemblies are described herein. A preform plastic sheet is places over components of an integrated circuit such that during a reflow process, the preform plastic sheet melts to form a conformal coating over components of the integrated circuit assembly.

公开(公告)号：US09596756B2

公开(公告)日：2017-03-14

申请号：US14020059

申请日：2013-09-06

申请人： Apple Inc.

发明人： Amanda R. Rainer ,  Connor R. Duke ,  James W. Bilanski ,  Jeffrey M. Thoma ,  Michael Eng ,  Mingzhe Li ,  Sung Woo Yoo ,  Miguel Alejandro Lara-Pena ,  Weng Choy Foo ,  Kieran Poulain

IPC分类号： H05K1/03 ,  H01L21/56 ,  H05K3/28 ,  H01L25/065 ,  H05K1/18

CPC分类号： H05K1/0393 ,  H01L21/563 ,  H01L25/0655 ,  H01L2224/73204 ,  H05K1/181 ,  H05K3/284 ,  H05K2201/0133 ,  H05K2201/10015 ,  H05K2201/10977 ,  H05K2201/2045 ,  H05K2203/0126 ,  H05K2203/304

摘要： An electronic device may be provided with integrated circuits and electrical components such as capacitors that are soldered to printed circuit boards. Liquid polymer adhesive such as encapsulant and underfill materials may be deposited on the printed circuit. Electrical components such as capacitors may be coated with the encapsulant. The underfill may be deposited adjacent to an integrated circuit, so that the underfill wicks into a gap between the integrated circuit and the printed circuit board. The encapsulant may be more viscous than the underfill and may therefore prevent the flowing underfill from reaching the electrical components. Some of the encapsulant may be located between the electrical components and the printed circuit board. The encapsulant can be cured to form an elastomeric material covering the electrical components that helps damp vibrations. The elastomeric material may be less stiff than the underfill.

摘要翻译： 电子设备可以设置有集成电路和电气部件，例如电焊接到印刷电路板的电容器。 诸如密封剂和底部填充材料的液体聚合物粘合剂可以沉积在印刷电路上。 诸如电容器的电气部件可以用密封剂涂覆。 底部填充物可以沉积在集成电路附近，使得底部填充物吸入集成电路和印刷电路板之间的间隙中。 密封剂可能比底部填充剂更粘稠，因此可以防止流动的底部填充物到达电气部件。 一些密封剂可以位于电气部件和印刷电路板之间。 密封剂可以被固化以形成覆盖电气部件的弹性材料，其有助于阻止振动。 弹性材料的硬度可能低于底部填充物。

公开(公告)号：US09596754B2

公开(公告)日：2017-03-14

申请号：US14367611

申请日：2012-12-18

申请人： TAIYO INK MFG. CO., LTD.

发明人： Gento Iwayama ,  Arata Endo ,  Shoji Minegishi ,  Masao Arima

IPC分类号： H05K1/00 ,  B32B7/02 ,  B32B27/38 ,  G06F7/00 ,  H01L21/00 ,  H05K1/03 ,  H01L21/56 ,  H05K3/28 ,  H01L23/498 ,  G03F7/40 ,  H05K3/00 ,  H05K3/46 ,  B32B27/08 ,  B32B27/16 ,  B32B27/20 ,  H05K3/34

CPC分类号： H05K1/0353 ,  B32B27/08 ,  B32B27/16 ,  B32B27/20 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2457/08 ,  G03F7/40 ,  H01L21/563 ,  H01L23/49816 ,  H01L23/49894 ,  H01L2224/73204 ,  H01L2224/92125 ,  H05K1/036 ,  H05K1/0373 ,  H05K3/0082 ,  H05K3/281 ,  H05K3/3436 ,  H05K3/4611 ,  H05K2201/0195 ,  H05K2201/10674 ,  H05K2201/10977 ,  Y10T428/24975 ,  Y10T428/31515

摘要： A dry film includes a carrier film, a thermosetting resin composition layer, and a photocurable resin composition layer formed between the carrier film and the thermosetting resin composition layer. The thermosetting resin composition layer is formed by applying and drying a thermosetting resin composition. The photocurable resin composition layer is formed by applying and drying a photocurable resin composition. A method of producing a printed writing board includes forming a resin insulation layer which includes a thermosetting resin composition layer and a photocurable resin composition layer on the substrate, in the order of the thermosetting resin composition layer and the photocurable resin composition layer from a surface side of the substrate, patterning the resin insulation layer by photolithographic approach, and patterning the resin insulation layer by laser processing.

摘要翻译： 干膜包括载体膜，热固性树脂组合物层和形成在载体膜和热固性树脂组合物层之间的光固化树脂组合物层。 热固性树脂组合物层通过涂布和干燥热固性树脂组合物形成。 可光固化树脂组合物层通过涂布和干燥光固化性树脂组合物而形成。 印刷书写板的制造方法包括：以热固化性树脂组合物层和光固化性树脂组合物层的表面侧的顺序，在基板上形成树脂绝缘层，该树脂绝缘层包括热固性树脂组合物层和光固化性树脂组合物层 通过光刻法构图树脂绝缘层，并通过激光加工对树脂绝缘层进行图案化。

公开(公告)号：US09524931B2

公开(公告)日：2016-12-20

申请号：US14592105

申请日：2015-01-08

申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.

发明人： Satoshi Shiraki

IPC分类号： H01L23/12 ,  H01L23/053 ,  H01L21/20 ,  H01L21/36 ,  H01L23/498 ,  H05K1/11 ,  H01L25/10 ,  H01L23/00 ,  H01L23/538 ,  H01L23/31 ,  H05K1/14 ,  H05K3/00 ,  H01L23/29

CPC分类号： H01L23/49838 ,  H01L23/295 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/5389 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/16237 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/12044 ,  H01L2924/1431 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1438 ,  H01L2924/1533 ,  H01L2924/181 ,  H05K1/111 ,  H05K1/144 ,  H05K3/0052 ,  H05K3/0097 ,  H05K2201/0939 ,  H05K2201/09409 ,  H05K2201/09418 ,  H05K2201/10977 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/01079 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2224/81 ,  H01L2924/01047 ,  H01L2924/01029

摘要： A wiring substrate includes a block with substrates laid out in an array. The block includes corners and a plan view center. Each substrate includes a substrate body. Pads are formed on the substrate body. Each pad includes a pad surface. The pads of the substrates include first pads, which are the pads of one of the substrates located in at least one of the corners of the block. The pad surface of each of the first pads includes a first axis extending from the first pad toward the plan view center of the block. The pad surface of each of the first pads has a first length along the corresponding first axis and a second length along a second axis, which is orthogonal to the first axis. The first length is longer than the second length.

摘要翻译： 布线基板包括具有布置在阵列中的基板的块。 该块包括角落和平面图中心。 每个基板包括基板主体。 垫片形成在基板主体上。 每个垫包括垫表面。 衬底的焊盘包括第一焊盘，其是位于块的至少一个角落中的一个衬底的焊盘。 每个第一焊盘的焊盘表面包括从第一焊盘朝向块的平面图中心延伸的第一轴。 每个第一焊盘的焊盘表面具有沿着对应的第一轴线的第一长度和沿着与第一轴线正交的第二轴线的第二长度。 第一长度比第二长度长。

公开(公告)号：US09491870B2

公开(公告)日：2016-11-08

申请号：US13797601

申请日：2013-03-12

申请人： SAMSUNG DISPLAY CO., LTD.

发明人： Sun Park ,  Chun-Gi You

IPC分类号： H05K7/02 ,  H05K3/36 ,  H05K1/11 ,  H05K3/32 ,  H01L27/32

CPC分类号： H05K3/361 ,  H01L27/3276 ,  H05K1/113 ,  H05K3/323 ,  H05K2201/0108 ,  H05K2201/09436 ,  H05K2201/10128 ,  H05K2201/10977 ,  Y10T29/49117

摘要： A display apparatus for improving corrosion resistance of a pad area and a method of manufacturing the same. The display apparatus includes a first substrate including a display area, a non-display area, and a pad area, and a second substrate facing the first substrate and corresponding to at least the display area, wherein the pad area includes, a connection area connected to a driving circuit; an exposed area spaced from the connection area; and a plurality of blocking areas between the connection area and the exposed area.

摘要翻译： 一种用于改善焊盘区域的耐腐蚀性的显示装置及其制造方法。 显示装置包括：第一基板，包括显示区域，非显示区域和焊盘区域;以及面对第一基板的至少对应于显示区域的第二基板，其中，焊盘区域包括：连接区域 到驱动电路; 与连接区域隔开的暴露区域; 以及在连接区域和暴露区域之间的多个阻挡区域。