公开(公告)号：US06274823B1

公开(公告)日：2001-08-14

申请号：US08735812

申请日：1996-10-21

Applicant: Igor Y. Khandros ,  Gaetan L. Mathieu

Inventor： Igor Y. Khandros ,  Gaetan L. Mathieu

IPC: H01R909

CPC classification number: H05K7/1069 ,  B23K2101/40 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/06761 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R3/00 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/67138 ,  H01L21/6715 ,  H01L22/20 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/06153 ,  H01L2224/1134 ,  H01L2224/13083 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/136 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85045 ,  H01L2224/85205 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01055 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49124 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49162 ,  Y10T29/49169 ,  Y10T29/49217 ,  Y10T29/49224 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/81205

Abstract: An interconnection contact structure assembly including an electronic component having a surface and a conductive contact carried by the electronic component and accessible at the surface. The contact structure includes an internal flexible elongate member having first and second ends and with the first end forming a first intimate bond to the surface of said conductive contact terminal without the use of a separate bonding material. An electrically conductive shell is provided and is formed of at least one layer of a conductive material enveloping the elongate member and forming a second intimate bond with at least a portion of the conductive contact terminal immediately adjacent the first intimate bond. The component carries the contact structures on both sides, the spacing of the structures on the first side being different than that of the second side.

Abstract translation: 一种互连接触结构组件，包括具有表面的电子部件和由电子部件承载并可在表面处接触的导电接触。 接触结构包括具有第一端和第二端的内部柔性细长构件，并且第一端在不使用单独的接合材料的情况下形成与所述导电接触端子的表面的第一紧密结合。 提供导电外壳，并且由至少一层导电材料形成，该导电材料层包围细长构件，并与紧邻第一紧密接合的导电接触端子的至少一部分形成第二紧密接合。 该部件在两侧承载接触结构，第一侧上的结构的间隔与第二侧不同。

公开(公告)号：US6089151A

公开(公告)日：2000-07-18

申请号：US30047

申请日：1998-02-24

Applicant: Chad Cobbley ,  Ford B. Grigg

Inventor： Chad Cobbley ,  Ford B. Grigg

IPC: B41F15/08 ,  B41L13/00 ,  B41M1/12 ,  B41N1/24 ,  H01L21/60 ,  H05K3/12 ,  H05K3/32 ,  H05K3/34

CPC classification number: B41F15/0818 ,  B41N1/24 ,  H01L24/11 ,  H01L24/81 ,  H05K3/1225 ,  H05K3/321 ,  H05K3/3484 ,  B41M1/12 ,  B41N1/248 ,  H01L2224/1132 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H05K2201/10719 ,  H05K3/3436

Abstract: A stencil for use in fabricating semiconductor devices is disclosed that has an aperture having a first portion extending from a first side thereof and a second portion extending from a second side thereof to minimize the shear stress between the material extruded therethrough and the stencil. The stencil allows for material to be extruded through the top of the stencil to the surface of the substrate and not contact the wall of the second portion of the aperture of the stencil. Since the material only contacts a small area of the first portion of the aperture near the top of the stencil, the material remains on the substrate and not in the aperture of the stencil.

公开(公告)号：US06080596A

公开(公告)日：2000-06-27

申请号：US920273

申请日：1997-08-22

Applicant: Alfons Vindasius ,  Kenneth M. Sautter

Inventor： Alfons Vindasius ,  Kenneth M. Sautter

IPC: H01L25/00 ,  H01L21/60 ,  H01L21/98 ,  H01L23/373 ,  H01L23/482 ,  H01L23/485 ,  H01L23/52 ,  H01L23/525 ,  H01L23/532 ,  H01L23/538 ,  H01L25/065 ,  H01L25/07 ,  H01L29/06 ,  H01R4/04 ,  H01R29/00 ,  H05K3/30 ,  H05K3/32 ,  H05K7/02 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L21/82

CPC classification number: H01L23/3737 ,  H01L23/4824 ,  H01L23/5256 ,  H01L23/5328 ,  H01L23/5382 ,  H01L23/5385 ,  H01L24/10 ,  H01L24/13 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/074 ,  H01L25/50 ,  H01R29/00 ,  H01R4/04 ,  H05K3/305 ,  H05K3/321 ,  H05K7/023 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/24145 ,  H01L2224/2919 ,  H01L2224/29399 ,  H01L2224/32145 ,  H01L2224/75 ,  H01L2224/753 ,  H01L2224/81801 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2225/0651 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06551 ,  H01L2225/06555 ,  H01L2225/06593 ,  H01L2225/06596 ,  H01L29/0657 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/3025 ,  H05K2201/09472 ,  H05K2201/10477 ,  H05K2201/10674 ,  H05K2201/10719 ,  H05K2201/10727 ,  Y02P70/613

Abstract: A method for vertically interconnecting stacks of silicon segments. Each segment includes a plurality of adjacent die on a semiconductor wafer. The plurality of die on a segment are interconnected on the segment using one or more layers of metal interconnects which extend to all four sides of the segment to provide edge bonding pads for external electrical connection points. After the die are interconnected, each segment is cut from the backside of the wafer using a bevel cut to provide four inwardly sloping edge walls on each of the segments. After the segments are cut from the wafer, the segments are placed on top of one another to form a stack. Vertically adjacent segments in the stack are electrically interconnected by applying electrically conductive epoxy to one or more sides of the stack. The inwardly sloping edge walls of each of the segments in the stack provide a recess which allows the electrically conductive epoxy to access the edge bonding pads and lateral circuits on each of the segments once the segments are stacked. A dielectric coating is applied to the die to provide a conformal coating to protect and insulate the die and a laser is used to ablate the area over the bond pads to remove the dielectric coating in order to provide for electrical connections to the bond pads.

Abstract translation: 一种用于垂直互连硅片段的方法。 每个段在半导体晶片上包括多个相邻的管芯。 使用一个或多个金属互连层在片段上互连多个管芯，该金属互连件延伸到段的全部四个侧面，以提供用于外部电连接点的边缘焊盘。 在芯片互连后，使用斜切切割从晶片的背面切割每个片段，以在每个片段上提供四个向内倾斜的边缘壁。 在从晶片切割片段之后，将片段放置在彼此的顶部以形成叠片。 堆叠中的垂直相邻段通过将导电环氧树脂施加到堆叠的一个或多个侧面而电互连。 堆叠中的每个段的向内倾斜的边缘壁提供凹部，其允许导电环氧树脂在片段堆叠之后接近每个片段上的边缘接合焊盘和侧向电路。 将电介质涂层施加到管芯上以提供保形涂层以保护和绝缘管芯，并且使用激光器来消除接合焊盘上的区域以移除电介质涂层，以便提供与接合焊盘的电连接。

公开(公告)号：US5864946A

公开(公告)日：1999-02-02

申请号：US839758

申请日：1997-04-15

Applicant: Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

Inventor： Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu

IPC: B23K1/00 ,  B23K20/00 ,  C23C18/16 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/603 ,  H01L21/66 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L25/065 ,  H01L25/16 ,  H01R12/00 ,  H05K1/14 ,  H05K3/20 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K7/10 ,  H01R9/00

CPC classification number: H05K7/1069 ,  B23K1/0008 ,  B23K20/004 ,  C23C18/1605 ,  C23C18/165 ,  C25D7/12 ,  G01R1/07342 ,  G01R31/2884 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/6835 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/27 ,  H01L24/72 ,  H01L24/81 ,  H01L24/94 ,  H01L25/0652 ,  H01L25/16 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3426 ,  H05K3/4015 ,  B23K2201/40 ,  C25D21/02 ,  C25D5/08 ,  C25D5/22 ,  G01R31/2856 ,  G01R31/2863 ,  G01R31/2886 ,  H01L2223/54453 ,  H01L2224/02311 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/0558 ,  H01L2224/05599 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/11003 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/1147 ,  H01L2224/1184 ,  H01L2224/13022 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13582 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/274 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4556 ,  H01L2224/45572 ,  H01L2224/45599 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48724 ,  H01L2224/48844 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/83851 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2224/90 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L23/544 ,  H01L24/45 ,  H01L24/49 ,  H01L24/83 ,  H01L24/90 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  H05K3/20 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4092 ,  Y02P70/611 ,  Y02P70/613 ,  Y10S977/712 ,  Y10S977/723 ,  Y10T29/49004 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49169 ,  Y10T29/49171 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/4922 ,  Y10T29/49812 ,  Y10T428/12396 ,  Y10T428/12528

Abstract: Resilient contact structures are mounted directly to bond pads on semiconductor dies, prior to the dies being singulated (separated) from a semiconductor wafer. This enables the semiconductor dies to be exercised (e.g., tested and/or burned-in) by connecting to the semiconductor dies with a circuit board or the like having a plurality of terminals disposed on a surface thereof. Subsequently, the semiconductor dies may be singulated from the semiconductor wafer, whereupon the same resilient contact structures can be used to effect interconnections between the semiconductor dies and other electronic components (such as wiring substrates, semiconductor packages, etc.). Using the all-metallic composite interconnection elements of the present invention as the resilient contact structures, burn-in can be performed at temperatures of at least 150.degree. C., and can be completed in less than 60 minutes.

Abstract translation: 弹性接触结构直接安装在半导体晶片上的接合焊盘上，在裸片与半导体晶片分离（分离）之前。 这使得半导体管芯能够通过具有设置在其表面上的多个端子的电路板等连接到半导体管芯来进行（例如，测试和/或烧入）。 接下来，半导体管芯可以从半导体晶片分离，因此可以使用相同的弹性接触结构来实现半导体管芯和其他电子部件（例如布线基板，半导体封装等）之间的互连。 使用本发明的全金属复合互连元件作为弹性接触结构，可以在至少150℃的温度下进行老化，并且可以在少于60分钟内完成。

公开(公告)号：US5840417A

公开(公告)日：1998-11-24

申请号：US457859

申请日：1995-06-01

Applicant: Justin C. Bolger

Inventor： Justin C. Bolger

IPC: H01L21/56 ,  H01L21/60 ,  H01L21/68 ,  H01L23/498 ,  H05K1/18 ,  H05K3/20 ,  H05K3/30 ,  H05K3/32 ,  B32B5/16

CPC classification number: H01L21/568 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49883 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H05K3/321 ,  H01L2224/05554 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01058 ,  H01L2924/01065 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/10253 ,  H01L2924/15173 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/351 ,  H05K1/181 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2201/10719 ,  H05K2201/10977 ,  H05K2203/0156 ,  H05K2203/0338 ,  H05K3/207 ,  H05K3/305 ,  Y10T428/12111 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/28 ,  Y10T428/2857 ,  Y10T428/287

Abstract: Electrically conductive sheet material preforms useful in bonding of electronic components as well as in the formation of electronic circuits are disclosed. The preforms, which comprise a multiplicity of electrically conductive adhesive members, each being separated from each other by means of a non-electrically conductive adhesive, are particularly useful in the assembly of multi-chip modules and multilayer electronic devices.

Abstract translation: 公开了用于电子部件的接合以及电子电路的形成中的导电性片状材料预制件。 包括多个导电粘合剂构件的预制件各自通过非导电粘合剂彼此分离，在多芯片模块和多层电子装置的组装中是特别有用的。

公开(公告)号：US5628919A

公开(公告)日：1997-05-13

申请号：US439980

申请日：1995-05-12

Applicant: Yoshihiro Tomura ,  Yoshihiro Bessho ,  Yasuhiko Hakotani

Inventor： Yoshihiro Tomura ,  Yoshihiro Bessho ,  Yasuhiko Hakotani

IPC: H01L21/48 ,  H01L21/56 ,  H01L23/485 ,  H01L23/498 ,  H05K1/18 ,  H05K3/24 ,  H05K3/32 ,  H05K3/40 ,  B44C1/22

CPC classification number: H05K3/4007 ,  H01L21/4853 ,  H01L21/563 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/13 ,  H05K3/321 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/351 ,  H05K1/181 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2201/09845 ,  H05K2201/10568 ,  H05K2201/10719 ,  H05K2201/10984 ,  H05K2203/0577 ,  H05K2203/167 ,  H05K3/243

Abstract: A chip carrier according to the present invention includes: a carrier body including an upper face, a lower face, and an internal conductor; and a plurality of terminal electrodes formed on the upper face of the carrier body, the plurality of terminal electrodes electrically connecting an LSI chip to the internal conductor. A plurality of concave portions for electrically connecting a plurality of electrodes on a circuit substrate to the internal conductor are provided on the lower face of the carrier body, the concave portions being electrically connected to the internal conductor.

Abstract translation: 根据本发明的芯片载体包括：载体，其包括上表面，下表面和内导体; 以及形成在所述载体主体的上表面上的多个端子电极，所述多个端子电极将LSI芯片电连接到所述内部导体。 多个用于将电路基板上的多个电极电连接到内部导体的凹部设置在载体主体的下表面上，凹部电连接到内部导体。

公开(公告)号：US5601740A

公开(公告)日：1997-02-11

申请号：US573945

申请日：1995-12-18

Applicant: Benjamin N. Eldridge ,  Gaetan L. Mathieu

Inventor： Benjamin N. Eldridge ,  Gaetan L. Mathieu

IPC: B23K20/00 ,  C23C18/16 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/603 ,  H01L21/66 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L25/065 ,  H01L25/16 ,  H05K1/14 ,  H05K3/20 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K7/10 ,  B23K9/06

CPC classification number: B23K20/004 ,  C25D7/12 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H05K3/24 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3426 ,  H05K3/4015 ,  H05K7/1069 ,  B23K2201/40 ,  C25D21/02 ,  C25D5/08 ,  C25D5/22 ,  G01R3/00 ,  G01R31/2884 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16145 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45565 ,  H01L2224/456 ,  H01L2224/4569 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85043 ,  H01L2224/851 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L24/45 ,  H01L24/49 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  H05K3/20 ,  H05K3/3421 ,  H05K3/368 ,  H05K3/4092 ,  Y02P70/611 ,  Y02P70/613

Abstract: The efficacy of electrical discharges for severing bond wires and/or for forming balls at the ends of bond wires (including bond wires already severed by alternative mechanisms) is improved by performing the electrical discharges in the presence of ultraviolet light. A "spark gap" is formed between an EFO electrode and the wire, one of which serves as the cathode of the spark gap. Preferably, the ultraviolet light is directed at the element serving as the cathode of the spark gap. Providing photoemission at the cathode element of the spark gap stabilizes arc/plasma formation and produces more reliable and predictable results. This technique may be used in conjunction with negative EFO systems or with positive EFO systems, and may benefit from either direct or field-assisted photoemission.

Abstract translation: 通过在紫外光的存在下进行放电，提高了在接合线（包括已被替代机构切断的接合线）的端部切断接合线和/或形成球的放电功效。 在EFO电极和导线之间形成“火花隙”，其中一个用作火花隙的阴极。 优选地，紫外线指向用作火花隙的阴极的元件。 在火花间隙的阴极元件处提供光电发射使电弧/等离子体形成稳定，并产生更可靠和可预测的结果。 这种技术可以与负EFO系统或正EFO系统结合使用，并可从直接或场辅助光电发射中受益。

公开(公告)号：US5381316A

公开(公告)日：1995-01-10

申请号：US45594

申请日：1993-04-09

Applicant: Minoru Hirai

Inventor： Minoru Hirai

IPC: H01L21/50 ,  H01L21/60 ,  H01L23/10 ,  H01L23/373 ,  H01L23/433 ,  H05K3/32 ,  H05K7/02

CPC classification number: H01L24/92 ,  H01L21/50 ,  H01L23/10 ,  H01L23/3736 ,  H01L23/433 ,  H01L24/81 ,  H05K3/325 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/16251 ,  H01L2924/19041 ,  H05K2201/10393 ,  H05K2201/10719

Abstract: An electronic part assembly composed of electronic parts wherein a projecting electrode formed on an electrode pad is pressed against a wiring pattern of a circuit board. A cover member a arranged so as to cover the electronic parts, and has a leg portion designed to be joined to the circuit board. A shape memory alloy member is arranged between the cover member and the electronic parts to press a reverse side surface so that electric connection between the projecting electrode and the wiring pattern can be maintained.

Abstract translation: 由电子部件构成的电子部件组件，其中形成在电极焊盘上的突出电极被压靠在电路板的布线图案上。 盖构件a，被布置成覆盖电子部件，并且具有被设计成接合到电路板的腿部。 形状记忆合金构件设置在盖构件和电子部件之间，以压靠反面，使得可以保持突出电极和布线图案之间的电连接。

公开(公告)号：US5346775A

公开(公告)日：1994-09-13

申请号：US21005

申请日：1993-02-22

Applicant: Sungho Jin ,  Mark T. McCormack

Inventor： Sungho Jin ,  Mark T. McCormack

IPC: B22F1/02 ,  B23K1/00 ,  B23K35/02 ,  B23K35/14 ,  B23K35/24 ,  B23K35/26 ,  B23K35/40 ,  C22C1/10 ,  H01R43/02 ,  H05K3/34

CPC classification number: B23K35/26 ,  B23K1/00 ,  B23K35/0222 ,  B23K35/0244 ,  H05K3/3484 ,  B23K35/262 ,  B23K35/264 ,  B23K35/268 ,  H01L24/12 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H05K2201/0215 ,  H05K2201/083 ,  H05K2201/10719 ,  H05K2203/104 ,  Y10T428/12007 ,  Y10T428/12486

Abstract: New solder compositions which can have improved mechanical properties are disclosed. In a preferred embodiment, the solder comprises a matrix material and magnetically dispersed particles. A desirable dispersion of the magnetic particles in the matrix material, is accomplished by applying a magnetic field to the molten matrix material containing magnetic particles and solidifying it in the presence of the magnetic field. The particle-dispersed microstructures improve the mechanical properties of the solder composition. The improved solder composition can be made into a powder to be used in solder paste, cream or reshaped while substantially retaining the improved mechanical properties.

Abstract translation: 公开了具有改进的机械性能的新的焊料组合物。 在优选实施例中，焊料包括基体材料和磁分散的颗粒。 磁性颗粒在基质材料中的理想分散是通过对含有磁性颗粒的熔融基质材料施加磁场并在磁场存在下使其固化来实现的。 颗粒分散的微结构改善了焊料组合物的机械性能。 改进的焊料组合物可以制成粉末以用于焊膏，奶油或重新成形，同时基本上保持改进的机械性能。

公开(公告)号：US5324569A

公开(公告)日：1994-06-28

申请号：US23526

申请日：1993-02-26

Applicant: Voddarahalli K. Nagesh ,  Daniel J. Miller ,  Robert A. Schuchard ,  Jeffrey G. Hargis

Inventor： Voddarahalli K. Nagesh ,  Daniel J. Miller ,  Robert A. Schuchard ,  Jeffrey G. Hargis

IPC: H01L23/12 ,  B23K1/00 ,  H01L23/498 ,  H01R4/02 ,  H05K3/34 ,  B32B9/00

CPC classification number: B23K1/0016 ,  H01L23/49816 ,  H01R4/02 ,  H05K3/3436 ,  B23K2201/40 ,  H01L2224/11334 ,  H01L2924/00013 ,  H05K2201/10234 ,  H05K2201/10719 ,  H05K2201/10727 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K2203/0415 ,  H05K2203/0435 ,  Y02P70/613 ,  Y10T428/24826 ,  Y10T428/2982 ,  Y10T428/2991

Abstract: A composite transversely plastic interconnect for a microcarrier produces a carrier-to-substrate bond having low electrical resistance and high mechanical strength, significant bond height to mediate TCE mismatch between dissimilar carrier and substrate materials, and sufficient gap between the carrier and the substrate to permit effective post solder cleaning of the interconnect. A contact array consisting of solder balls is placed directly onto either of a carrier or a substrate interconnect surface with a stencil positioned to the chosen interconnect surface. The solder balls may have a selected melting temperature. Additionally, the solder balls may have a metallic coating, such as nickel or copper, or molten solder. The carrier and substrate are joined by mating an interconnect surface of each and applying heat. Solder paste may be applied to one of the interconnect surfaces to add additional height to the joint and compensate for lack of coplanarity between the carrier and the substrate.

Abstract translation: 用于微载体的复合横向塑料互连产生具有低电阻和高机械强度，显着的键高度以介导不同载体和衬底材料之间的TCE失配以及载体和衬底之间的足够间隙的载体与衬底粘合，以允许 有效的后焊料清洗互连。 由焊球组成的接触阵列直接放置在载体或衬底互连表面中的任一个上，并且模板位于所选择的互连表面。 焊球可具有选定的熔化温度。 此外，焊球可以具有诸如镍或铜的金属涂层或熔融焊料。 载体和基底通过配合每个的互连表面并施加热量来连接。 可以将焊膏施加到互连表面中的一个以增加接头的附加高度并补偿载体和基底之间的共面性的缺乏。