公开(公告)号：US09899300B2

公开(公告)日：2018-02-20

申请号：US15465427

申请日：2017-03-21

申请人： ROHM CO., LTD.

发明人： Kenji Fujii ,  Yasumasa Kasuya ,  Mamoru Yamagami ,  Naoki Kinoshita ,  Motoharu Haga

IPC分类号： H01L23/00 ,  H01L23/31 ,  H01L23/495

CPC分类号： H01L23/49527 ,  H01L23/291 ,  H01L23/293 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3142 ,  H01L23/3171 ,  H01L23/3675 ,  H01L23/4334 ,  H01L23/4822 ,  H01L23/49503 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49568 ,  H01L23/49572 ,  H01L23/525 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/33 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/02311 ,  H01L2224/02331 ,  H01L2224/0239 ,  H01L2224/024 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/0346 ,  H01L2224/03462 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05083 ,  H01L2224/05084 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05181 ,  H01L2224/05548 ,  H01L2224/05567 ,  H01L2224/05572 ,  H01L2224/05582 ,  H01L2224/05583 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05681 ,  H01L2224/05684 ,  H01L2224/1145 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/1161 ,  H01L2224/11825 ,  H01L2224/13008 ,  H01L2224/13011 ,  H01L2224/13016 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13024 ,  H01L2224/13147 ,  H01L2224/13561 ,  H01L2224/13582 ,  H01L2224/13624 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13664 ,  H01L2224/13666 ,  H01L2224/16014 ,  H01L2224/16245 ,  H01L2224/16258 ,  H01L2224/17107 ,  H01L2224/29008 ,  H01L2224/29082 ,  H01L2224/29124 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/29164 ,  H01L2224/29166 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/753 ,  H01L2224/75301 ,  H01L2224/75981 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81201 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/8146 ,  H01L2224/81464 ,  H01L2224/81466 ,  H01L2224/8183 ,  H01L2224/83191 ,  H01L2224/83201 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83455 ,  H01L2224/8346 ,  H01L2224/83464 ,  H01L2224/83466 ,  H01L2224/8383 ,  H01L2224/92225 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/05042 ,  H01L2924/07025 ,  H01L2924/17724 ,  H01L2924/17747 ,  H01L2924/181 ,  H01L2924/182 ,  H01L2924/186 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/05166 ,  H01L2924/01028 ,  H01L2924/0665

摘要： A semiconductor device has a semiconductor element provided with a functional surface on which a functional circuit is formed and with a back surface facing in the opposite direction to the functional surface, while also having a lead supporting the semiconductor element and electrically connected to the semiconductor element, and a resin package covering at least a portion of the semiconductor element and the lead. The semiconductor element has a functional surface side electrode formed on the functional surface and equipped with a functional surface side raised part that projects in the direction in which the functional surface faces. The functional surface side raised part of the functional surface side electrode is joined to the lead by solid state bonding.

公开(公告)号：US20170194234A1

公开(公告)日：2017-07-06

申请号：US15465427

申请日：2017-03-21

申请人： ROHM CO., LTD.

发明人： Kenji FUJII ,  Yasumasa KASUYA ,  Mamoru YAMAGAMI ,  Naoki KINOSHITA ,  Motoharu HAGA

IPC分类号： H01L23/495 ,  H01L23/00 ,  H01L23/31

CPC分类号： H01L23/49527 ,  H01L23/291 ,  H01L23/293 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3142 ,  H01L23/3171 ,  H01L23/3675 ,  H01L23/4334 ,  H01L23/4822 ,  H01L23/49503 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49568 ,  H01L23/49572 ,  H01L23/525 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/33 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/02311 ,  H01L2224/02331 ,  H01L2224/0239 ,  H01L2224/024 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/0346 ,  H01L2224/03462 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05083 ,  H01L2224/05084 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05181 ,  H01L2224/05548 ,  H01L2224/05567 ,  H01L2224/05572 ,  H01L2224/05582 ,  H01L2224/05583 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05681 ,  H01L2224/05684 ,  H01L2224/1145 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/1161 ,  H01L2224/11825 ,  H01L2224/13008 ,  H01L2224/13011 ,  H01L2224/13016 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13024 ,  H01L2224/13147 ,  H01L2224/13561 ,  H01L2224/13582 ,  H01L2224/13624 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13664 ,  H01L2224/13666 ,  H01L2224/16014 ,  H01L2224/16245 ,  H01L2224/16258 ,  H01L2224/17107 ,  H01L2224/29008 ,  H01L2224/29082 ,  H01L2224/29124 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/29164 ,  H01L2224/29166 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/753 ,  H01L2224/75301 ,  H01L2224/75981 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81201 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/8146 ,  H01L2224/81464 ,  H01L2224/81466 ,  H01L2224/8183 ,  H01L2224/83191 ,  H01L2224/83201 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83455 ,  H01L2224/8346 ,  H01L2224/83464 ,  H01L2224/83466 ,  H01L2224/8383 ,  H01L2224/92225 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/05042 ,  H01L2924/07025 ,  H01L2924/17724 ,  H01L2924/17747 ,  H01L2924/181 ,  H01L2924/182 ,  H01L2924/186 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/05166 ,  H01L2924/01028 ,  H01L2924/0665

摘要： A semiconductor device has a semiconductor element provided with a functional surface on which a functional circuit is formed and with a back surface facing in the opposite direction to the functional surface, while also having a lead supporting the semiconductor element and electrically connected to the semiconductor element, and a resin package covering at least a portion of the semiconductor element and the lead. The semiconductor element has a functional surface side electrode formed on the functional surface and equipped with a functional surface side raised part that projects in the direction in which the functional surface faces. The functional surface side raised part of the functional surface side electrode is joined to the lead by solid state bonding.

公开(公告)号：US20170033075A1

公开(公告)日：2017-02-02

申请号：US15294508

申请日：2016-10-14

申请人： Advanced Semiconductor, Inc.

发明人： Min-Fong SHU ,  Yi-Hsiu TSENG ,  Kuan-Neng CHEN ,  Shu-Chiao KUO

IPC分类号： H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56

CPC分类号： H01L24/81 ,  H01L21/4853 ,  H01L21/563 ,  H01L23/13 ,  H01L23/3142 ,  H01L23/3185 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/564 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/05558 ,  H01L2224/05609 ,  H01L2224/05611 ,  H01L2224/05618 ,  H01L2224/05623 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05657 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05672 ,  H01L2224/05676 ,  H01L2224/05678 ,  H01L2224/1182 ,  H01L2224/13026 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13582 ,  H01L2224/13609 ,  H01L2224/13611 ,  H01L2224/13618 ,  H01L2224/13623 ,  H01L2224/13624 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/13663 ,  H01L2224/13664 ,  H01L2224/13666 ,  H01L2224/13676 ,  H01L2224/13678 ,  H01L2224/13687 ,  H01L2224/1607 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/16238 ,  H01L2224/16501 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81096 ,  H01L2224/8114 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81385 ,  H01L2224/81395 ,  H01L2224/81409 ,  H01L2224/81411 ,  H01L2224/81418 ,  H01L2224/81423 ,  H01L2224/81424 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/81457 ,  H01L2224/81463 ,  H01L2224/81464 ,  H01L2224/81466 ,  H01L2224/81476 ,  H01L2224/81478 ,  H01L2224/81487 ,  H01L2224/81815 ,  H01L2224/8183 ,  H01L2224/81898 ,  H01L2224/83104 ,  H01L2224/83193 ,  H01L2224/92125 ,  H01L2924/00015 ,  H01L2924/15311 ,  H01L2924/20103 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/3511 ,  H01L2924/381 ,  H01L2224/8109 ,  H01L2924/00014 ,  H01L2924/01076 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/053

摘要： A method of manufacturing a bonding structure includes (a) providing a substrate, wherein the substrate includes a top surface and at least one bonding pad disposed adjacent to the top surface of the substrate, at least one bonding pad having a sloped surface with a first slope; (b) providing a semiconductor element, wherein the semiconductor element includes at least one pillar, and at least one pillar has a sidewall with a second slope, wherein the absolute value of the first slope is smaller than the absolute value of the second slope; and (c) bonding at least one pillar to a portion of the sloped surface of corresponding ones of the at least one bonding pad.

摘要翻译： 一种接合结构的制造方法包括：（a）提供基板，其中所述基板包括顶表面和邻近所述基板顶表面设置的至少一个接合焊盘，至少一个接合焊盘，其具有倾斜表面，其具有第一 坡; （b）提供半导体元件，其中所述半导体元件包括至少一个支柱，并且至少一个支柱具有具有第二斜率的侧壁，其中所述第一斜率的绝对值小于所述第二斜率的绝对值; 和（c）将至少一个柱结合到所述至少一个接合焊盘中相应的一个焊盘的倾斜表面的一部分上。

公开(公告)号：US20160240450A1

公开(公告)日：2016-08-18

申请号：US15096792

申请日：2016-04-12

申请人： ROHM CO., LTD.

发明人： Kenji FUJII ,  Yasumasa KASUYA ,  Mamoru YAMAGAMI ,  Naoki KINOSHITA ,  Motoharu HAGA

IPC分类号： H01L23/29 ,  H01L23/31 ,  H01L23/00 ,  H01L23/367

CPC分类号： H01L23/49527 ,  H01L23/291 ,  H01L23/293 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3142 ,  H01L23/3171 ,  H01L23/3675 ,  H01L23/4334 ,  H01L23/4822 ,  H01L23/49503 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49568 ,  H01L23/49572 ,  H01L23/525 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/33 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/02311 ,  H01L2224/02331 ,  H01L2224/0239 ,  H01L2224/024 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/0346 ,  H01L2224/03462 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05073 ,  H01L2224/05082 ,  H01L2224/05083 ,  H01L2224/05084 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05181 ,  H01L2224/05548 ,  H01L2224/05567 ,  H01L2224/05572 ,  H01L2224/05582 ,  H01L2224/05583 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05681 ,  H01L2224/05684 ,  H01L2224/1145 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/1161 ,  H01L2224/11825 ,  H01L2224/13008 ,  H01L2224/13011 ,  H01L2224/13016 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13024 ,  H01L2224/13147 ,  H01L2224/13561 ,  H01L2224/13582 ,  H01L2224/13624 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13664 ,  H01L2224/13666 ,  H01L2224/16014 ,  H01L2224/16245 ,  H01L2224/16258 ,  H01L2224/17107 ,  H01L2224/29008 ,  H01L2224/29082 ,  H01L2224/29124 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/29164 ,  H01L2224/29166 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/753 ,  H01L2224/75301 ,  H01L2224/75981 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81201 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/8146 ,  H01L2224/81464 ,  H01L2224/81466 ,  H01L2224/8183 ,  H01L2224/83191 ,  H01L2224/83201 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83455 ,  H01L2224/8346 ,  H01L2224/83464 ,  H01L2224/83466 ,  H01L2224/8383 ,  H01L2224/92225 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/05042 ,  H01L2924/07025 ,  H01L2924/17724 ,  H01L2924/17747 ,  H01L2924/181 ,  H01L2924/182 ,  H01L2924/186 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/05166 ,  H01L2924/01028 ,  H01L2924/0665

摘要： A semiconductor device has a semiconductor element provided with a functional surface on which a functional circuit is formed and with a back surface facing in the opposite direction to the functional surface, while also having a lead supporting the semiconductor element and electrically connected to the semiconductor element, and a resin package covering at least a portion of the semiconductor element and the lead. The semiconductor element has a functional surface side electrode formed on the functional surface and equipped with a functional surface side raised part that projects in the direction in which the functional surface faces. The functional surface side raised part of the functional surface side electrode is joined to the lead by solid state bonding.

公开(公告)号：US20150333221A1

公开(公告)日：2015-11-19

申请号：US14278778

申请日：2014-05-15

申请人： LuxVue Technology Corporation

发明人： Andreas Bibl ,  Dariusz Golda

IPC分类号： H01L33/20 ,  H01L33/52 ,  H01L33/62 ,  H01L33/44 ,  H01L33/08 ,  H01L27/15

CPC分类号： H01L25/167 ,  G09F9/301 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/24 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L25/0753 ,  H01L27/1266 ,  H01L27/15 ,  H01L27/153 ,  H01L27/156 ,  H01L2221/68318 ,  H01L2221/68359 ,  H01L2221/68381 ,  H01L2224/11462 ,  H01L2224/1147 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/16227 ,  H01L2224/24101 ,  H01L2224/24105 ,  H01L2224/24227 ,  H01L2224/245 ,  H01L2224/27462 ,  H01L2224/2747 ,  H01L2224/291 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/32227 ,  H01L2224/73259 ,  H01L2224/73267 ,  H01L2224/81005 ,  H01L2224/81192 ,  H01L2224/81424 ,  H01L2224/81438 ,  H01L2224/81444 ,  H01L2224/81466 ,  H01L2224/81486 ,  H01L2224/8149 ,  H01L2224/81805 ,  H01L2224/81825 ,  H01L2224/8183 ,  H01L2224/82005 ,  H01L2224/82102 ,  H01L2224/82104 ,  H01L2224/82106 ,  H01L2224/83005 ,  H01L2224/83192 ,  H01L2224/83424 ,  H01L2224/83438 ,  H01L2224/83444 ,  H01L2224/83466 ,  H01L2224/83486 ,  H01L2224/8349 ,  H01L2224/83805 ,  H01L2224/83825 ,  H01L2224/8383 ,  H01L2224/92224 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/10161 ,  H01L2924/10162 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15156 ,  H01L2924/18161 ,  H01L2924/18162 ,  H05K1/189 ,  H05K3/4682 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/01074 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0781 ,  H01L2924/01038 ,  H01L2924/053 ,  H01L2924/06 ,  H01L2924/01006 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01042 ,  H01L2924/01022 ,  H01L2924/01071 ,  H01L2224/81 ,  H01L2224/82 ,  H01L2224/83

摘要： A flexible display panel and method of formation with a sacrificial release layer are described. The method of manufacturing a flexible display system includes forming a sacrificial layer on a carrier substrate. A flexible display substrate is formed on the sacrificial layer, with a plurality of release openings that extend through the flexible display substrate to the sacrificial layer. An array of LEDs and a plurality of microchips are transferred onto the flexible display substrate to form a flexible display panel. The sacrificial layer is selectively removed such that the flexible display panel attaches to the carrier substrate by a plurality of support posts. The flexible display panel is removed from the carrier substrate and is electrically coupled with display components to form a flexible display system.

摘要翻译： 描述了柔性显示面板及其形成方法。 柔性显示系统的制造方法包括在载体基板上形成牺牲层。 在牺牲层上形成柔性显示基板，其中多个释放开口延伸穿过柔性显示基板至牺牲层。 将LED阵列和多个微芯片转移到柔性显示基板上以形成柔性显示面板。 选择性地去除牺牲层，使得柔性显示面板通过多个支撑柱附接到载体基板。 柔性显示面板从载体基板移除并与显示部件电耦合以形成柔性显示系统。

公开(公告)号：US20150325509A1

公开(公告)日：2015-11-12

申请号：US14273882

申请日：2014-05-09

申请人： QUALCOMM Incorporated

发明人： Hong Bok We ,  Dong Wook Kim ,  Jae Sik Lee ,  Shiqun Gu ,  Ratibor Radojcic

IPC分类号： H01L23/498 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H05K1/11 ,  H01L23/522 ,  H01L23/528 ,  H01L21/311 ,  H05K1/09 ,  H01L21/78 ,  H01L25/065

CPC分类号： H01L23/49827 ,  H01L21/31127 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/498 ,  H01L23/49866 ,  H01L23/5226 ,  H01L23/528 ,  H01L23/5385 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13118 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16235 ,  H01L2224/81411 ,  H01L2224/81424 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/81466 ,  H01L2224/81484 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/141 ,  H01L2924/143 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/157 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/20648 ,  H01L2924/3511 ,  H05K1/09 ,  H05K1/115 ,  H05K2201/09563 ,  H01L2924/014 ,  H01L2224/81

摘要： A substrate block is provided that has an increased width. The substrate block comprises two substrate bars, and the substrate bars each comprise a substrate and a plurality of filled vias through the substrate. The substrate block may be used to manufacture package substrates, and these package substrate may be incorporated into a PoP structure. The package substrate includes a carrier having a plurality of vertical interconnections and a bar coupled to the vertical interconnections.

摘要翻译： 提供具有增加的宽度的衬底块。 衬底块包括两个衬底条，并且衬底条各自包括衬底和穿过衬底的多个填充的通孔。 衬底块可以用于制造封装衬底，并且这些封装衬底可以并入PoP结构中。 封装衬底包括具有多个垂直互连的载体和耦合到垂直互连的条。

公开(公告)号：US09184143B2

公开(公告)日：2015-11-10

申请号：US14098218

申请日：2013-12-05

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

发明人： Chia-Chun Miao ,  Shih-Wei Liang ,  Kai-Chiang Wu ,  Yen-Ping Wang

IPC分类号： H01L23/00

CPC分类号： H01L23/564 ,  H01L23/16 ,  H01L23/3192 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/12 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/94 ,  H01L2224/02311 ,  H01L2224/0239 ,  H01L2224/03828 ,  H01L2224/03831 ,  H01L2224/0401 ,  H01L2224/05024 ,  H01L2224/05166 ,  H01L2224/05548 ,  H01L2224/05558 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05681 ,  H01L2224/05687 ,  H01L2224/11334 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/118 ,  H01L2224/1183 ,  H01L2224/11849 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13561 ,  H01L2224/13562 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81466 ,  H01L2224/81471 ,  H01L2224/81484 ,  H01L2224/81801 ,  H01L2224/94 ,  H01L2924/12042 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/3841 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/01029 ,  H01L2924/01013 ,  H01L2924/01047 ,  H01L2224/11 ,  H01L2224/0231 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/013 ,  H01L2224/81 ,  H01L2224/03

摘要： A semiconductor device having a semiconductor substrate is provided. The semiconductor device has a metal structure over the semiconductor substrate. The metal structure is configured to receive a bump. The semiconductor device further has a conductive trace between the semiconductor substrate and the metal structure. The conductive trace is configured to connect to a power source. When an electric current from the power source passes through the conductive trace, an electromagnetic field is generated at the conductive trace. The position of the bump is adjusted in response to the electromagnetic field.

摘要翻译： 提供了具有半导体衬底的半导体器件。 半导体器件在半导体衬底上具有金属结构。 金属结构构造成接收凸起。 半导体器件还在半导体衬底和金属结构之间具有导电迹线。 导电迹线被配置为连接到电源。 当来自电源的电流通过导电迹线时，在导电迹线处产生电磁场。 凸起的位置响应于电磁场而被调节。

公开(公告)号：US20150255406A1

公开(公告)日：2015-09-10

申请号：US14201253

申请日：2014-03-07

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Chia-Chun Miao ,  Shih-Wei Liang ,  Kai-Chiang Wu

IPC分类号： H01L23/00 ,  H01L23/16

CPC分类号： H01L23/564 ,  H01L23/16 ,  H01L23/3192 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/12 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/94 ,  H01L2224/02311 ,  H01L2224/0239 ,  H01L2224/03828 ,  H01L2224/03831 ,  H01L2224/0401 ,  H01L2224/05024 ,  H01L2224/05166 ,  H01L2224/05548 ,  H01L2224/05558 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05681 ,  H01L2224/05687 ,  H01L2224/11334 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/118 ,  H01L2224/1183 ,  H01L2224/11849 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13561 ,  H01L2224/13562 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81466 ,  H01L2224/81471 ,  H01L2224/81484 ,  H01L2224/81801 ,  H01L2224/94 ,  H01L2924/12042 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/3841 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/01029 ,  H01L2924/01013 ,  H01L2924/01047 ,  H01L2224/11 ,  H01L2224/0231 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/013 ,  H01L2224/81 ,  H01L2224/03

摘要： An integrated circuit structure includes a substrate, a metal pad over the substrate, a passivation layer having a portion over the metal pad, and a polymer layer over the passivation layer. A Post-Passivation Interconnect (PPI) has a portion over the polymer layer, wherein the PPI is electrically coupled to the metal pad. The integrated circuit structure further includes a first solder region over and electrically coupled to a portion of the PPI, a second solder region neighboring the first solder region, a first coating material on a surface of the first solder region, and a second coating material on a surface of the second solder region. The first coating material and the second coating material encircle the first solder region and the second solder region, respectively. The first coating material is spaced apart from the second coating material.

摘要翻译： 集成电路结构包括衬底，衬底上的金属焊盘，具有在金属焊盘上方的部分的钝化层以及钝化层上的聚合物层。 后钝化互连（PPI）具有聚合物层上的一部分，其中PPI电耦合到金属焊盘。 所述集成电路结构还包括在所述PPI的一部分上方并电耦合的第一焊料区域，与所述第一焊料区域相邻的第二焊料区域，所述第一焊料区域的表面上的第一涂覆材料和 第二焊料区域的表面。 第一涂料和第二涂料分别围绕第一焊料区域和第二焊料区域。 第一涂层材料与第二涂层材料间隔开。

公开(公告)号：US08987130B2

公开(公告)日：2015-03-24

申请号：US13482414

申请日：2012-05-29

申请人： Gregory M. Fritz ,  Eric P. Lewandowski

发明人： Gregory M. Fritz ,  Eric P. Lewandowski

IPC分类号： H01L21/76 ,  H01L23/498 ,  H01L23/00

CPC分类号： H01L24/17 ,  H01L23/49811 ,  H01L23/49866 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/05582 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/0566 ,  H01L2224/13006 ,  H01L2224/13012 ,  H01L2224/13014 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13157 ,  H01L2224/1316 ,  H01L2224/13166 ,  H01L2224/13169 ,  H01L2224/13179 ,  H01L2224/16113 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/16501 ,  H01L2224/1713 ,  H01L2224/17163 ,  H01L2224/7525 ,  H01L2224/75264 ,  H01L2224/81192 ,  H01L2224/81222 ,  H01L2224/81455 ,  H01L2224/81457 ,  H01L2224/8146 ,  H01L2224/81466 ,  H01L2224/818 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/0541 ,  H01L2924/2064 ,  H01L2924/20641 ,  H01L2224/81121 ,  H01L2924/00012 ,  H01L2224/757 ,  H01L2924/014 ,  H01L2224/05552

摘要： An array of bonding pads including a set of reactive materials is provided on a first substrate. The set of reactive materials is selected to be capable of ignition by magnetic heating induced by time-dependent magnetic field. The magnetic heating can be eddy current heating, hysteresis heating, and/or heating by magnetic relaxation processes. An array of solder balls on a second substrate is brought to contact with the array of bonding pads. A reaction is initiated in the set of magnetic materials by an applied magnetic field. Rapid release of heat during a resulting reaction of the set of reactive materials to form a reacted material melts the solder balls and provides boding between the first substrate and the second substrate. Since the magnetic heating can be localized, the heating and warpage of the substrate can be minimized during the bonding process.

摘要翻译： 包括一组反应性材料的焊盘阵列设置在第一衬底上。 通过由时间依赖磁场引起的磁加热，可以选择一组反应性材料。 磁加热可以是涡流加热，滞后加热和/或通过磁弛豫过程加热。 使第二基板上的焊球的阵列与焊盘的阵列接触。 通过施加的磁场在一组磁性材料中引发反应。 在一组反应性材料的反应期间，在形成反应的材料的反应中快速释放热量，熔化焊球并在第一基板和第二基板之间提供粘结。 由于磁加热可以被定位，所以在接合过程中可以最小化衬底的加热和翘曲。

公开(公告)号：US11990435B2

公开(公告)日：2024-05-21

申请号：US17867287

申请日：2022-07-18

申请人： Amkor Technology Singapore Holding Pte. Ltd.

发明人： Sung Sun Park ,  Ji Young Chung ,  Christopher Berry

IPC分类号： G06V40/13 ,  B81C3/00 ,  H01L23/00 ,  H01L23/053 ,  H01L23/31

CPC分类号： H01L24/05 ,  B81C3/00 ,  G06V40/13 ,  G06V40/1329 ,  H01L23/053 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L23/3128 ,  H01L24/03 ,  H01L24/11 ,  H01L24/13 ,  H01L24/27 ,  H01L24/29 ,  H01L24/33 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/03464 ,  H01L2224/0347 ,  H01L2224/0361 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05684 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/119 ,  H01L2224/13013 ,  H01L2224/13014 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/16227 ,  H01L2224/27312 ,  H01L2224/2732 ,  H01L2224/27622 ,  H01L2224/2784 ,  H01L2224/29006 ,  H01L2224/29007 ,  H01L2224/29011 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/29299 ,  H01L2224/2939 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81424 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/8146 ,  H01L2224/81464 ,  H01L2224/81466 ,  H01L2224/81471 ,  H01L2224/81484 ,  H01L2224/81815 ,  H01L2224/8185 ,  H01L2224/83101 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/9211 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2924/014 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2224/131 ,  H01L2924/014 ,  H01L2224/13147 ,  H01L2924/00014 ,  H01L2224/13111 ,  H01L2924/01082 ,  H01L2224/13111 ,  H01L2924/01082 ,  H01L2924/01047 ,  H01L2224/13111 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2224/13111 ,  H01L2924/01029 ,  H01L2224/13111 ,  H01L2924/01047 ,  H01L2224/13111 ,  H01L2924/01079 ,  H01L2224/13111 ,  H01L2924/01083 ,  H01L2224/13111 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2224/13111 ,  H01L2924/01047 ,  H01L2924/01083 ,  H01L2224/13111 ,  H01L2924/0103 ,  H01L2224/13111 ,  H01L2924/0103 ,  H01L2924/01083 ,  H01L2224/11334 ,  H01L2924/00014 ,  H01L2224/1146 ,  H01L2924/00014 ,  H01L2224/1132 ,  H01L2924/00014 ,  H01L2224/11849 ,  H01L2924/00014 ,  H01L2224/05647 ,  H01L2924/00014 ,  H01L2224/05624 ,  H01L2924/00014 ,  H01L2224/05639 ,  H01L2924/00014 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2224/05655 ,  H01L2924/00014 ,  H01L2224/0345 ,  H01L2924/00014 ,  H01L2224/03464 ,  H01L2924/00014 ,  H01L2224/03452 ,  H01L2924/00014 ,  H01L2224/05147 ,  H01L2924/00014 ,  H01L2224/05124 ,  H01L2924/00014 ,  H01L2224/05139 ,  H01L2924/00014 ,  H01L2224/05144 ,  H01L2924/00014 ,  H01L2224/05155 ,  H01L2924/00014 ,  H01L2224/0347 ,  H01L2924/00014 ,  H01L2224/1147 ,  H01L2924/00014 ,  H01L2224/05666 ,  H01L2924/01074 ,  H01L2224/05671 ,  H01L2924/00014 ,  H01L2224/05666 ,  H01L2924/01028 ,  H01L2224/0361 ,  H01L2924/00014 ,  H01L2224/119 ,  H01L2224/034 ,  H01L2224/1147 ,  H01L2224/034 ,  H01L2224/114 ,  H01L2224/0361 ,  H01L2224/13294 ,  H01L2924/00014 ,  H01L2224/133 ,  H01L2924/014 ,  H01L2224/81203 ,  H01L2924/00014 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2224/2919 ,  H01L2924/0665 ,  H01L2224/2929 ,  H01L2924/0665 ,  H01L2224/2919 ,  H01L2924/07025 ,  H01L2224/2929 ,  H01L2924/07025 ,  H01L2224/2919 ,  H01L2924/069 ,  H01L2224/2929 ,  H01L2924/069 ,  H01L2224/83102 ,  H01L2924/00014 ,  H01L2224/83101 ,  H01L2924/00014 ,  H01L2224/9211 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/29294 ,  H01L2924/00014 ,  H01L2224/2939 ,  H01L2924/00014 ,  H01L2224/29299 ,  H01L2924/00014 ,  H01L2224/27622 ,  H01L2924/00014 ,  H01L2224/2732 ,  H01L2924/00014 ,  H01L2224/27312 ,  H01L2924/00014 ,  H01L2224/81447 ,  H01L2924/00014 ,  H01L2224/81424 ,  H01L2924/00014 ,  H01L2224/81455 ,  H01L2924/00014 ,  H01L2224/8146 ,  H01L2924/00014 ,  H01L2224/81439 ,  H01L2924/00014 ,  H01L2224/81464 ,  H01L2924/00014 ,  H01L2224/81484 ,  H01L2924/00014 ,  H01L2224/81444 ,  H01L2924/00014 ,  H01L2224/81466 ,  H01L2924/00014 ,  H01L2224/81471 ,  H01L2924/00014 ,  H01L2224/8185 ,  H01L2924/00012 ,  H01L2224/05166 ,  H01L2924/00014 ,  H01L2224/05684 ,  H01L2924/00014

摘要： A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise a sensing area on a bottom side of a die without top side electrodes that senses fingerprints from the top side, and/or that comprise a sensor die directly electrically connected to conductive elements of a plate through which fingerprints are sensed.