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    APPARATUS AND METHODS FOR MICRO-TRANSFER PRINTING
    9.
    发明申请
    APPARATUS AND METHODS FOR MICRO-TRANSFER PRINTING 审中-公开
    微转印打印设备及方法

    公开(公告)号：WO2016012409A3

    公开(公告)日：2016-03-24

    申请号：PCT/EP2015066566

    申请日：2015-07-20

    申请人： CELEPRINT LTD X

    发明人： BOWER CHRISTOPHER ,  MEITL MATTHEW ,  KNEEBURG DAVID ,  GOMEZ DAVID ,  BONAFEDE SALVATORE

    IPC分类号： H01L21/683 ,  H01L21/58 ,  H01L21/98 ,  H01L23/31

    CPC分类号： B41F16/00 ,  B25J15/00 ,  B41F16/0046 ,  B41F16/006 ,  B41F16/0073 ,  B41K3/04 ,  B41K3/12 ,  H01L21/3065 ,  H01L21/52 ,  H01L21/565 ,  H01L21/568 ,  H01L21/67103 ,  H01L21/683 ,  H01L21/6835 ,  H01L23/293 ,  H01L23/3171 ,  H01L24/75 ,  H01L24/83 ,  H01L24/97 ,  H01L25/50 ,  H01L31/1892 ,  H01L2221/68318 ,  H01L2221/68354 ,  H01L2221/68368 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/75315 ,  H01L2224/7598 ,  H01L2224/83001 ,  H01L2224/83011 ,  H01L2224/83013 ,  H01L2224/83024 ,  H01L2224/832 ,  H01L2224/83894 ,  H01L2224/83895 ,  H01L2924/10253 ,  H01L2924/1032 ,  H01L2924/10328 ,  H01L2924/10329 ,  H01L2924/10332 ,  H01L2924/10335 ,  H01L2924/10336 ,  H01L2924/10337 ,  H01L2924/10338 ,  H01L2924/1034

    摘要： An appartus and method for assembling a semiconductor device on a destination substrate using micro-transfer-printing is described. A conformable transfer device (102) such as an elastomer or visco-elastomer stamp includes an array of posts (114) for picking up printable semiconductor elements (104) from a native substrate (108) which is used for fabricating the printable semiconductor elements (104) and transferring the printable semiconductor elements (104) to a destination substrate (110). In certain embodiments, the printable semiconductor elements (104) are encapsulated in a polymer layer (106) before they are picked up. In certain embodiments a plasma treatment (e.g. atmospheric plasma) can be performed during micro transfer printing. The plasma can be applied to bottom surfaces of devices that are attached to an elastomer transfer-element. This treatment of bottom surfaces can be used to provide improved bonding between the devices and destination substrate, to clean the bottom surface of devices that have been fabricated using epitaxial lift-off methods, and to remove thin layers of oxides. In certain embodiments, if the devices have a backside metal, the semiconductor elements are printed to a destination substrate with mating metal pads that have been coated with a flux. After transferring the devices, the flux can be reflowed thereby leaving a good metal connection between the pads and the backside metal on the devices. In certain embodiments, the disclosed technology includes transfer devices designed to eliminate or reduce issues related to crowning. In certain embodiments, the crown is cut with a razor so that printable semiconductor elements are not picked up by the crown during a print operation.

    摘要翻译： 描述了使用微转印技术在目的基板上组装半导体器件的方法和方法。 诸如弹性体或粘弹性体印模的适形传送装置（102）包括用于从用于制造可印刷半导体元件的天然衬底（108）拾取可印刷半导体元件（104）的柱（114）阵列 104）并将可印刷半导体元件（104）传送到目的基板（110）。 在某些实施例中，可打印的半导体元件（104）在拾取之前被封装在聚合物层（106）中。 在某些实施例中，可以在微转印中进行等离子体处理（例如大气等离子体）。 等离子体可以施加到附接到弹性体转移元件的装置的底表面上。 底表面的这种处理可用于提供装置和目的基板之间的改进的结合，以清洁已经使用外延剥离方法制造的装置的底表面，以及去除薄层的氧化物。 在某些实施例中，如果器件具有背面金属，则半导体元件被印刷到具有已经涂覆有焊剂的配合金属焊盘的目标衬底。 在转移器件之后，焊剂可被回流，从而在焊盘和器件上的背面金属之间留下良好的金属连接。 在某些实施例中，所公开的技术包括被设计成消除或减少与隆起有关的问题的转移装置。 在某些实施例中，用剃刀切割表冠，使得可打印半导体元件在打印操作期间不被表冠拾取。