公开(公告)号：US20150145117A1

公开(公告)日：2015-05-28

申请号：US14605208

申请日：2015-01-26

申请人： Tessera, Inc.

发明人： Belgacem Haba ,  Wael Zohni ,  Richard Dewitt Crisp

IPC分类号： H01L25/065 ,  H01L23/373 ,  H01L23/367 ,  H01L23/00

CPC分类号： H01L25/0652 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/3731 ,  H01L23/3736 ,  H01L23/4334 ,  H01L23/49816 ,  H01L24/14 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/06136 ,  H01L2224/13014 ,  H01L2224/14519 ,  H01L2224/32145 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/4824 ,  H01L2224/484 ,  H01L2224/49111 ,  H01L2224/731 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2224/48227 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A microelectronic assembly includes a dielectric element having oppositely-facing first and second surfaces and one or more apertures extending between the surfaces, the dielectric element further having conductive elements thereon; a first microelectronic element having a rear surface and a front surface facing the first surface of the dielectric element, the first microelectronic element having a first edge and a plurality of contacts exposed at the front surface thereof; a second microelectronic element including having a rear surface and a front surface facing the rear surface of the first microelectronic element, a projecting portion of the front surface of the second microelectronic element extending beyond the first edge of the first microelectronic element, the projecting portion being spaced from the first surface of the dielectric element, the second microelectronic element having a plurality of contacts exposed at the projecting portion of the front surface; leads extending from contacts of the microelectronic elements through the at least one aperture to at least some of the conductive elements; and a heat spreader thermally coupled to at least one of the first microelectronic element or the second microelectronic element.

摘要翻译： 微电子组件包括具有相对面对的第一和第二表面的介电元件和在表面之间延伸的一个或多个孔，该介电元件还在其上具有导电元件; 第一微电子元件，其具有背面和面向电介质元件的第一表面的前表面，第一微电子元件具有第一边缘和暴露在其前表面的多个触点; 第二微电子元件，包括具有背面和面向第一微电子元件的后表面的前表面，第二微电子元件的前表面的突出部分延伸超过第一微电子元件的第一边缘，突出部分为 与介电元件的第一表面间隔开，第二微电子元件具有在前表面的突出部分处露出的多个触点; 从微电子元件的接触通过至少一个孔延伸到至少一些导电元件的引线; 以及热耦合到第一微电子元件或第二微电子元件中的至少一个的散热器。

公开(公告)号：US09030001B2

公开(公告)日：2015-05-12

申请号：US14058955

申请日：2013-10-21

申请人： Tessera, Inc.

发明人： Belgacem Haba

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L21/48 ,  H01L23/498 ,  H01L23/00 ,  H01L25/065 ,  H01L25/10 ,  H01L25/00 ,  H01L21/50 ,  B82Y40/00

CPC分类号： H01L24/17 ,  B82Y40/00 ,  H01L21/4853 ,  H01L21/50 ,  H01L23/49811 ,  H01L23/52 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/06181 ,  H01L2224/116 ,  H01L2224/1182 ,  H01L2224/11821 ,  H01L2224/13101 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13644 ,  H01L2224/13794 ,  H01L2224/13911 ,  H01L2224/13944 ,  H01L2224/13947 ,  H01L2224/16057 ,  H01L2224/16113 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/29111 ,  H01L2224/73104 ,  H01L2224/81026 ,  H01L2224/81099 ,  H01L2224/81143 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81801 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15321 ,  H01L2924/20102 ,  H01L2924/20103 ,  H01L2924/20104 ,  H01L2924/20105 ,  Y10S977/773 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/05552

摘要： A method of making an assembly includes the steps of applying metallic nanoparticles to exposed surfaces of conductive elements of either of or both of a first component and a second component, juxtaposing the conductive elements of the first component with the conductive elements of the second component with the metallic nanoparticles disposed therebetween, and elevating a temperature at least at interfaces of the juxtaposed conductive elements to a joining temperature at which the metallic nanoparticles cause metallurgical joints to form between the juxtaposed conductive elements. The conductive elements of either of or both of the first component and the second component can include substantially rigid posts having top surfaces projecting a height above the surface of the respective component and edge surfaces extending at substantial angles away from the top surfaces thereof.

摘要翻译： 制造组件的方法包括以下步骤：将金属纳米颗粒施加到第一部件和第二部件中的任一个或两者的导电元件的暴露表面上，将第一部件的导电元件与第二部件的导电元件并置， 设置在其间的金属纳米颗粒，并且至少在并置的导电元件的界面处将温度升高到金属纳米粒子在并置的导电元件之间形成冶金接合部的接合温度。 第一部件和第二部件中的任一个或两者的导电元件可以包括基本上刚性的支柱，其具有突出在相应部件的表面上方的高度的顶表面，并且远离其顶表面以基本角度延伸的边缘表面。

公开(公告)号：US20150122662A1

公开(公告)日：2015-05-07

申请号：US14071679

申请日：2013-11-05

申请人： Rohm and Haas Electronic Materials LLC

发明人： Julia WOERTINK ,  Yi QIN ,  Jonathan D. PRANGE ,  Pedro O. LOPEZ MONTESINOS

IPC分类号： C25D3/32

CPC分类号： C25D3/32 ,  C25D3/60 ,  C25D7/123 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/94 ,  H01L2224/05611 ,  H01L2224/05655 ,  H01L2224/11462 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/94 ,  H05K3/3473 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/11 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01029 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2924/0103 ,  H01L2924/01051 ,  H01L2924/01025 ,  H01L2924/014 ,  H01L2924/01322 ,  H01L2924/01026

摘要： Tin electroplating baths having certain brightening agents and nonionic surfactants provide tin-containing solder deposits having good morphology, reduced void formation and improved within-die uniformity.

摘要翻译： 具有某些增亮剂和非离子表面活性剂的锡电镀浴提供了具有良好形态，减少的空隙形成和改进的模内均匀性的含锡焊料沉积物。

公开(公告)号：US09024442B2

公开(公告)日：2015-05-05

申请号：US13508864

申请日：2011-08-04

申请人： Shinichi Terashima ,  Masamoto Tanaka ,  Katsuichi Kimura

发明人： Shinichi Terashima ,  Masamoto Tanaka ,  Katsuichi Kimura

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  B23K35/26 ,  C22C13/00 ,  H01L23/00 ,  H01L23/498 ,  H01L23/31 ,  H05K3/34

CPC分类号： B23K35/262 ,  C22C13/00 ,  H01L23/3114 ,  H01L23/49816 ,  H01L23/49866 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05082 ,  H01L2224/05083 ,  H01L2224/11334 ,  H01L2224/13005 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13688 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/3512 ,  H01L2924/3651 ,  H01L2924/37 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2203/041 ,  H01L2224/05644 ,  H01L2224/05164 ,  H01L2224/05155 ,  H01L2224/05147 ,  H01L2924/01083 ,  H01L2924/01028 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01026 ,  H01L2924/2076 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00

摘要： The present invention relates to a solder ball for semiconductor packaging and an electronic member having such solder ball. Specifically there are provided: a solder ball capable of ensuring a sufficient thermal fatigue property even when a diameter thereof is not larger than 250 μm as observed in recent years; and an electronic member having such solder ball. More specifically, there are provided: a solder ball for semiconductor packaging that is made of a solder alloy containing Sn as a main element, 0.1-2.5% Ag by mass, 0.1-1.5% Cu by mass and at least one of Mg, Al and Zn in a total amount of 0.0001-0.005% by mass, such solder ball having a surface including a noncrystalline phase that has a thickness of 1-50 nm and contains at least one of Mg, Al and Zn, O and Sn, and an electronic member having such solder ball.

摘要翻译： 本发明涉及一种用于半导体封装的焊球和具有这种焊球的电子部件。 具体地说，提供了一种能够确保近年来观察到的直径不大于250μm时的足够的热疲劳特性的焊球; 以及具有这种焊球的电子部件。 更具体地说，提供一种半导体封装用焊料球，其由以Sn为主要元素的焊料合金制成，质量％为0.1〜2.5质量％，Cu为0.1〜1.5质量％，Mg，Al 和Zn，其总量为0.0001-0.005质量％，这种焊球具有包括厚度为1-50nm并且包含Mg，Al和Zn，O和Sn中的至少一种的非晶相的表面，以及 具有这种焊球的电子部件。

公开(公告)号：US20150115477A1

公开(公告)日：2015-04-30

申请号：US14589578

申请日：2015-01-05

申请人： Tessera, Inc.

发明人： Belgacem Haba ,  Richard Dewitt Crisp ,  Wael Zohni

IPC分类号： H01L23/50 ,  H01L23/00

CPC分类号： H01L23/50 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/29101 ,  H01L2224/29191 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32227 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48472 ,  H01L2224/4911 ,  H01L2224/49112 ,  H01L2224/49175 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1029 ,  H01L2225/1047 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01076 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/1431 ,  H01L2924/1433 ,  H01L2924/1435 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1438 ,  H01L2924/1443 ,  H01L2924/14511 ,  H01L2924/15151 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15172 ,  H01L2924/15182 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012

摘要： A microelectronic assembly can include a substrate having first and second surfaces and an aperture extending therebetween, the substrate having terminals. The assembly can also include a first microelectronic element having a front surface facing the first surface of the substrate, a second microelectronic element having a front surface facing the first microelectronic element and projecting beyond an edge of the first microelectronic element, first and second leads electrically connecting contacts of the respective first and second microelectronic elements to the terminals, and third leads electrically interconnecting the contacts of the first and second microelectronic elements. The contacts of the first microelectronic element can be exposed at the front surface thereof adjacent the edge thereof. The contacts of the second microelectronic element can be disposed in a central region of the front surface thereof. The first, second, and third leads can have portions aligned with the aperture.

摘要翻译： 微电子组件可以包括具有第一和第二表面的基板和在其间延伸的孔，该基板具有端子。 组件还可以包括具有面向衬底的第一表面的前表面的第一微电子元件，具有面向第一微电子元件并且突出超过第一微电子元件的边缘的前表面的第二微电子元件，第一和第二引线电 将相应的第一和第二微电子元件的触点连接到端子，以及第三引线将第一和第二微电子元件的触点电互连。 第一微电子元件的触点可以在靠近其边缘的前表面暴露。 第二微电子元件的触点可以设置在其前表面的中心区域中。 第一，第二和第三引线可以具有与孔对准的部分。

公开(公告)号：US09000578B2

公开(公告)日：2015-04-07

申请号：US12900718

申请日：2010-10-08

申请人： Chia-Pao Shu ,  Chun-wen Cheng ,  Kuei-Sung Chang

发明人： Chia-Pao Shu ,  Chun-wen Cheng ,  Kuei-Sung Chang

IPC分类号： H01L23/48 ,  H01L23/52 ,  B81C1/00 ,  H01L23/00 ,  H01L25/065

CPC分类号： H01L24/83 ,  B81C1/00238 ,  B81C1/00269 ,  B81C2203/019 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/29 ,  H01L24/30 ,  H01L24/32 ,  H01L24/94 ,  H01L25/0657 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/0361 ,  H01L2224/0362 ,  H01L2224/04026 ,  H01L2224/05551 ,  H01L2224/05555 ,  H01L2224/05557 ,  H01L2224/05617 ,  H01L2224/05638 ,  H01L2224/061 ,  H01L2224/26145 ,  H01L2224/29017 ,  H01L2224/2902 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29117 ,  H01L2224/29124 ,  H01L2224/29138 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/29166 ,  H01L2224/29181 ,  H01L2224/29291 ,  H01L2224/32058 ,  H01L2224/321 ,  H01L2224/32106 ,  H01L2224/32148 ,  H01L2224/83203 ,  H01L2224/83365 ,  H01L2224/83805 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461

摘要： A package system includes a first substrate and a second substrate. The second substrate is electrically coupled with the first substrate. The second substrate includes at least one first opening. At least one electrical bonding material is disposed between the first substrate and the second substrate. A first portion of the at least one electrical bonding material is at least partially filled in the at least one first opening.

摘要翻译： 封装系统包括第一基板和第二基板。 第二基板与第一基板电耦合。 第二基板包括至少一个第一开口。 至少一个电接合材料设置在第一基板和第二基板之间。 所述至少一个电接合材料的第一部分至少部分地填充在所述至少一个第一开口中。

公开(公告)号：US20150077962A1

公开(公告)日：2015-03-19

申请号：US14031414

申请日：2013-09-19

申请人： Kabirkumar Mirpuri

发明人： Kabirkumar Mirpuri

IPC分类号： H05K1/18 ,  H01L23/00 ,  H05K1/11 ,  B23K1/20

CPC分类号： H01L24/81 ,  B23K1/20 ,  H01L24/13 ,  H01L24/16 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/13101 ,  H01L2224/16225 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2225/06513 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15331 ,  H01L2924/1815 ,  H01L2924/20106 ,  H01L2924/351 ,  H05K3/3436 ,  H01L2924/00 ,  H01L2924/00014

摘要： An electronic device including a solder structure and methods of forming an electrical interconnection are shown. Solder structures are shown including a solder ball formed from a first solder having a first melting temperature, and a connecting structure coupling the solder ball to one or more electrical connection pads, the connecting structure formed from a second solder having a second melting temperature lower than the first melting temperature. Electronic devices are shown including a polymer mold material formed over the solder structures.

摘要翻译： 示出了包括焊料结构的电子器件和形成电互连的方法。 示出了焊接结构，其包括由具有第一熔融温度的第一焊料形成的焊球和将焊球耦合到一个或多个电连接焊盘的连接结构，该连接结构由第二焊料形成，第二焊料具有低于 第一个熔化温度。 示出了包括在焊料结构上形成的聚合物模具材料的电子器件。

公开(公告)号：US08973259B2

公开(公告)日：2015-03-10

申请号：US13228496

申请日：2011-09-09

申请人： Sotaro Ito ,  Michimasa Takahashi ,  Yukinobu Mikado

发明人： Sotaro Ito ,  Michimasa Takahashi ,  Yukinobu Mikado

IPC分类号： H05K3/30 ,  H01L23/00 ,  H01L23/538 ,  H05K1/18 ,  H01L25/10 ,  H05K3/00 ,  H05K3/46

CPC分类号： H01L24/83 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/32 ,  H01L25/105 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/8385 ,  H01L2224/92 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/351 ,  H05K1/185 ,  H05K3/0035 ,  H05K3/4652 ,  H05K2201/096 ,  H05K2201/10477 ,  H05K2201/10674 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49167 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2924/01049 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/13111 ,  H01L2224/13109

摘要： A method for manufacturing a multilayered printed circuit board including forming a first insulating resin substrate having a metal layer substantially corresponding to dimensions of a semiconductor device, forming a second insulating resin substrate, forming a recess extending to the metal layer of the first insulating resin substrate such that a surface of the metal layer is exposed, accommodating the semiconductor device in the recess such that the semiconductor device is mounted on the surface of the metal layer, and forming a resin insulating layer on the first insulating resin substrate such that the semiconductor device accommodated in the recess is covered.

摘要翻译： 一种多层印刷电路板的制造方法，其特征在于，包括形成具有与半导体装置的尺寸基本对应的金属层的第一绝缘性树脂基板，形成第二绝缘树脂基板，形成延伸到第一绝缘树脂基板的金属层的凹部 使得金属层的表面露出，将半导体器件容纳在凹部中，使得半导体器件安装在金属层的表面上，并且在第一绝缘树脂基板上形成树脂绝缘层，使得半导体器件 容纳在凹处被覆盖。

公开(公告)号：US08970035B2

公开(公告)日：2015-03-03

申请号：US13624356

申请日：2012-09-21

申请人： Jing-Cheng Lin ,  Po-Hao Tsai

发明人： Jing-Cheng Lin ,  Po-Hao Tsai

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L24/11 ,  H01L21/563 ,  H01L23/3192 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L24/94 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/05187 ,  H01L2224/05611 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05671 ,  H01L2224/06102 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/11612 ,  H01L2224/11614 ,  H01L2224/1182 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13169 ,  H01L2224/1403 ,  H01L2224/1411 ,  H01L2224/14155 ,  H01L2224/14156 ,  H01L2224/14177 ,  H01L2224/14515 ,  H01L2224/16113 ,  H01L2224/16145 ,  H01L2224/16148 ,  H01L2224/16168 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/1703 ,  H01L2224/17517 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2224/831 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/381 ,  H01L2924/3841 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2924/01108 ,  H01L2224/11 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/01082 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/00

摘要： A package structure includes a first substrate bonded to a second substrate by Connecting metal pillars on the first substrate to connectors on the second substrate. A first metal pillar is formed overlying and electrically connected to a metal pad on a first region of the first substrate, and a second metal pillar is formed overlying a passivation layer in a second region of the first substrate. A first solder joint region is formed between metal pillar and the first connector, and a second solder joint region is formed between the second metal pillar and the second connector. The thickness of the first metal pillar is greater than the thickness of the second metal pillar.

摘要翻译： 封装结构包括通过将第一基板上的金属柱连接到第二基板上的连接器而将第一基板接合到第二基板。 第一金属柱形成在第一衬底的第一区域上并覆盖并电连接到金属焊盘，第二金属柱形成在第一衬底的第二区域中的钝化层上。 在金属柱和第一连接器之间形成第一焊接区域，在第二金属柱和第二连接器之间形成第二焊点区域。 第一金属柱的厚度大于第二金属柱的厚度。

公开(公告)号：US08967827B2

公开(公告)日：2015-03-03

申请号：US13641483

申请日：2011-04-26

申请人： Yoji Urano ,  Ryoji Yokotani ,  Ikko Kuzuhara ,  Kenichiro Tanaka

发明人： Yoji Urano ,  Ryoji Yokotani ,  Ikko Kuzuhara ,  Kenichiro Tanaka

IPC分类号： F21S4/00 ,  F21V21/00 ,  H05K1/02 ,  F21K99/00 ,  F21V19/00 ,  H05K1/18 ,  F21V29/00 ,  H01L25/075 ,  H01L33/48 ,  H01L33/62 ,  H05K1/05 ,  H05K3/20 ,  F21Y101/02 ,  F21Y103/00 ,  F21Y105/00 ,  H01L23/00

CPC分类号： H05K1/0203 ,  F21K9/20 ,  F21K9/27 ,  F21K9/90 ,  F21V19/004 ,  F21V29/767 ,  F21Y2103/10 ,  F21Y2105/10 ,  F21Y2107/90 ,  F21Y2115/10 ,  H01L24/45 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H05K1/0271 ,  H05K1/056 ,  H05K1/181 ,  H05K3/202 ,  H05K2201/10106 ,  Y02P70/611 ,  Y10S362/80 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01049

摘要： Provided is lead frame in which a wiring pattern supported by a support piece inside of a one-pitch outer frame section comprises a plurality of base units, each of which comprises a die pad on which a solid-state light emitting element is mounted, a heat sink extending from die pad so as to surround die pad electrically connected to one electrode of the element, and a lead electrically connected to the other electrode of the element. Lead of one base unit among adjacent base units and heat sink of the other base unit are coupled and electrically connected in series. Increase in temperature of the element is inhibited, light output is increased, and cost of a light emitting unit in which a plurality of solid-state light emitting elements connected in series are used is reduced. Also provided are wiring board, light emitting unit, and illuminating apparatus.

摘要翻译： 本发明提供了一种引线框架，其中由一节距外框部分内的支撑件支撑的布线图案包括多个基座单元，每个基座单元包括其上安装固态发光元件的芯片焊盘， 从芯片焊盘延伸的散热片，以便围绕与该元件的一个电极电连接的芯片焊盘以及与该元件的另一个电极电连接的引线。 相邻基座中的一个基本单元和另一个基座单元的散热器的引线串联并电连接。 抑制元件的温度升高，光输出增加，并且使用串联连接的多个固态发光元件的发光单元的成本降低。 还提供了布线板，发光单元和照明装置。